Patents by Inventor Robert Csernicska

Robert Csernicska has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Micro-sensor
    Patent number: 7427808
    Abstract: The present invention describes a microsensor with a sensor element (2) and an integrated circuit (1), containing a semiconductor body (11) with an intergrated circuit (4), the sensor element (2) being positioned on a main surface (12) of the semiconductor body (11) and there being a eutectic connection (3) formed between the semiconductor body (11) and the sensor element (2).
    Type: Grant
    Filed: October 8, 2002
    Date of Patent: September 23, 2008
    Assignee: Austriamicrosystems AG
    Inventors: Manfred Brandl, Robert Csernicska
  • Method for producing an electrical component
    Patent number: 7338839
    Abstract: To expose a submerged bondable terminal pad in a component that includes at least two substrates which are joined with each other, it is proposed that grooves of relatively shallow depth be provided on the connecting surface of the second substrate before the two substrates are joined. After the two substrates are joined, incisions are made opposite the grooves which open the grooves from the back side. The cutouts to be removed are defined between two grooves.
    Type: Grant
    Filed: June 4, 2003
    Date of Patent: March 4, 2008
    Assignee: Austriamicrosystems AG
    Inventors: Manfred Brandl, Robert Csernicska, Walter Draxler
  • Method for producing an electrical component
    Publication number: 20060141760
    Abstract: To expose a submerged bondable terminal pad in a component that includes at least two substrates which are joined with each other, it is proposed that grooves of relatively shallow depth be provided on the connecting surface of the second substrate before the two substrates are joined. After the two substrates are joined, incisions are made opposite the grooves which open the grooves from the back side. The cutouts to be removed are defined between two grooves.
    Type: Application
    Filed: June 4, 2003
    Publication date: June 29, 2006
    Inventors: Manfred Brandl, Robert Csernicska, Walter Draxler
  • Micro-sensor
    Publication number: 20050067695
    Abstract: The present invention describes a microsensor with a sensor element (2) and an integrated circuit (1), containing a semiconductor body (11) with an integrated circuit (4), the sensor element (2) being positioned on a main surface (12) of the semiconductor body (11) and there being a eutectic connection (3) formed between the semiconductor body (11) and the sensor element (2).
    Type: Application
    Filed: October 8, 2002
    Publication date: March 31, 2005
    Inventors: Manfred Brandl, Robert Csernicska