Patents by Inventor Robert D. Allen

Robert D. Allen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11943355
    Abstract: Methods and compositions for decentralized systems for mitigating climate change are provided. In some embodiments, the compositions comprise: one or more first servers operable to store a plurality of first tokens, wherein each one of the plurality of first tokens is associated with fiscal value; one or more second servers operable to store a plurality of second tokens, wherein each one of the plurality of second tokens corresponds to a unit of voting power; one or more project developer nodes operable to transmit project data corresponding to renewable energy or carbon sequestration; one or more auditor nodes operable to verify an identity, validate credentials, perform a project assessment, generate a smart contract, receive signals, and transmit signals; and one or more steward nodes, wherein each one of the one or more steward nodes is operable to stake tokens for voting power and to distribute voting power.
    Type: Grant
    Filed: August 3, 2022
    Date of Patent: March 26, 2024
    Assignee: Hunt Energy Enterprises, L.L.C.
    Inventors: Ross E. Freeman, Victor Kuang-en Liu, Mark H. Griffin, Robert D. Maher, III, John F. Allen, Jr.
  • Patent number: 11335908
    Abstract: A battery includes an anode, an electrolyte including a solvent and at least one ion conducting salt, and a cathode including a metal halide salt incorporated into an electrically conductive material. The electrolyte is in contact with the anode, the cathode, and an oxidizing gas.
    Type: Grant
    Filed: July 30, 2019
    Date of Patent: May 17, 2022
    Assignee: International Business Machines Corporation
    Inventors: Jangwoo Kim, Young-Hye Na, Robert D. Allen
  • Patent number: 10941295
    Abstract: Resin compositions made of high-performance polymers blended with molecular glass as rheological modifiers are disclosed. The high-performance polymers include thermoplastics, such as polysulfones, polyimides, poly(ether imides), polyketones, poly(ether ketones), and combinations thereof. The molecular glasses are amorphous, non-oligomeric, and have one or more functional groups that promote miscibility of the molecular glass with the high-performance polymers to produce a resin composition with low melt viscosity. Incorporation of the molecular glasses into the high-performance polymers does not alter the Young's modulus and yield stress values of the high-performance polymers.
    Type: Grant
    Filed: October 13, 2018
    Date of Patent: March 9, 2021
    Assignee: International Business Machines Corporation
    Inventors: Joseph M Dennis, Robert D Allen
  • Publication number: 20210036323
    Abstract: A battery includes an anode, an electrolyte including a solvent and at least one ion conducting salt, and a cathode including a metal halide salt incorporated into an electrically conductive material. The electrolyte is in contact with the anode, the cathode, and an oxidizing gas.
    Type: Application
    Filed: July 30, 2019
    Publication date: February 4, 2021
    Inventors: Jangwoo Kim, Young-Hye Na, Robert D. Allen
  • Patent number: 10745579
    Abstract: Extrudable compositions were prepared comprising poly(propylene) and a liquid additive comprising a lactam group. The compositions can comprise other optional additives that include a polyhemiaminal, antioxidants, UV light absorbers, and surfactants. The extruded compositions have higher percent elongation at break and lower Young's modulus compared to extruded poly(propylene) lacking the liquid additive. These and other property improvements make the extruded compositions attractive for forming field joint coatings for undersea pipeline applications.
    Type: Grant
    Filed: August 31, 2018
    Date of Patent: August 18, 2020
    Assignees: International Business Machines Corporation, Subsea 7 (US) LLC
    Inventors: Jeannette M. Garcia, Alireza Rahimi, Robert D. Allen, John Hobbs, Michael Firmian
  • Publication number: 20200115553
    Abstract: Resin compositions made of high-performance polymers blended with molecular glass as rheological modifiers are disclosed. The high-performance polymers include thermoplastics, such as polysulfones, polyimides, poly(ether imides), polyketones, poly(ether ketones), and combinations thereof. The molecular glasses are amorphous, non-oligomeric, and have one or more functional groups that promote miscibility of the molecular glass with the high-performance polymers to produce a resin composition with low melt viscosity. Incorporation of the molecular glasses into the high-performance polymers does not alter the Young's modulus and yield stress values of the high-performance polymers.
    Type: Application
    Filed: October 13, 2018
    Publication date: April 16, 2020
    Inventors: Joseph M. Dennis, Robert D. Allen
  • Publication number: 20200071557
    Abstract: Extrudable compositions were prepared comprising poly(propylene) and a liquid additive comprising a lactam group. The compositions can comprise other optional additives that include a polyhemiaminal, antioxidants, UV light absorbers, and surfactants. The extruded compositions have higher percent elongation at break and lower Young's modulus compared to extruded poly(propylene) lacking the liquid additive. These and other property improvements make the extruded compositions attractive for forming field joint coatings for undersea pipeline applications.
    Type: Application
    Filed: August 31, 2018
    Publication date: March 5, 2020
    Inventors: Jeannette M. Garcia, Alireza Rahimi, Robert D. Allen, John Hobbs, Michael Firmian
  • Patent number: 10174229
    Abstract: An adhesive bonding method that includes bonding a handling wafer to a front side surface of a device wafer with an adhesive comprising N-substituted maleimide copolymers. The device wafer may then be thinned from the backside surface of the device wafer while the device wafer is adhesively engaged to the handling wafer. The adhesive can then be removed by laser debonding, wherein the device wafer is separated from the handling wafer.
    Type: Grant
    Filed: November 20, 2017
    Date of Patent: January 8, 2019
    Assignee: International Business Machines Corporation
    Inventors: Robert D. Allen, Jeffrey Gelorme, Li-Wen Hung, Ratnam Sooriyakumaran, Linda K. Sundberg
  • Publication number: 20180228748
    Abstract: Compounds, pharmaceutical compositions and methods for treating viral and bacterial infections, by administering certain thiourea compounds, specifically acylthiourea, carboximidoylthiourea and S-alkyl isothiourea derivatives and analogs, in therapeutically effective amounts are disclosed.
    Type: Application
    Filed: April 17, 2018
    Publication date: August 16, 2018
    Applicant: SIGA TECHNOLOGIES, INC.
    Inventors: Robert D. ALLEN, III, Sean M. AMBERG, Dongcheng DAI, James R. BURGESON, Dennis E. HRUBY
  • Patent number: 9968571
    Abstract: Compounds, pharmaceutical compositions and methods for treating viral and bacterial infections, by administering certain thiourea compounds, specifically acylthiourea, carboximidoylthiourea and S-alkyl isothiourea derivatives and analogs, in therapeutically effective amounts are disclosed.
    Type: Grant
    Filed: December 22, 2016
    Date of Patent: May 15, 2018
    Assignee: SIGA TECHNOLOGIES, INC.
    Inventors: Robert D. Allen, III, Sean M. Amberg, Dongcheng Dai, James R. Burgeson, Dennis E. Hruby
  • Publication number: 20180072926
    Abstract: An adhesive bonding method that includes bonding a handling wafer to a front side surface of a device wafer with an adhesive comprising N-substituted maleimide copolymers. The device wafer may then be thinned from the backside surface of the device wafer while the device wafer is adhesively engaged to the handling wafer. The adhesive can then be removed by laser debonding, wherein the device wafer is separated from the handling wafer.
    Type: Application
    Filed: November 20, 2017
    Publication date: March 15, 2018
    Inventors: ROBERT D. ALLEN, JEFFREY GELORME, LI-WEN HUNG, RATNAM SOORIYAKUMARAN, LINDA K. SUNDBERG
  • Patent number: 9914816
    Abstract: Provided is a method of depolymerizing polyesters from post-consumer products, such as beverage bottles, to produce a high purity reaction product. For the depolymerization reaction, the polyesters are reacted with an alcohol and an amine organocatalyst at a temperature of about 150° C. to about 250° C. In one application, the use of an organocatalyst with a boiling point significantly lower than the boiling point of the reactant alcohol allows for the ready recycling of the amine organocatalyst. In another application, performing the depolymerization reaction under pressure at a temperature above the boiling point of the alcohol allows for accelerated depolymerization rates and the recovery of the organocatalyst with no further heat input.
    Type: Grant
    Filed: November 4, 2015
    Date of Patent: March 13, 2018
    Assignee: International Business Machines Corporation
    Inventors: Robert D. Allen, Krishna M. Bajjuri, Gregory Breyta, James L. Hedrick, Carl E. Larson
  • Patent number: 9868650
    Abstract: A method for removing glyphosate from a solution by contacting the solution with a polymeric particle including a moiety selected from the group consisting of ammonium, amine and combinations thereof, wherein the moiety is positively charged in the solution.
    Type: Grant
    Filed: December 21, 2015
    Date of Patent: January 16, 2018
    Assignee: International Business Machines Corporation
    Inventors: Robert D. Allen, Geraud J. Dubois, Young-Hye Na, Lianna C. Samuel, Joseph Sly, Ran Wang
  • Patent number: 9850406
    Abstract: An adhesive bonding method that includes bonding a handling wafer to a front side surface of a device wafer with an adhesive comprising N-substituted maleimide copolymers. The device wafer may then be thinned from the backside surface of the device wafer while the device wafer is adhesively engaged to the handling wafer. The adhesive can then be removed by laser debonding, wherein the device wafer is separated from the handling wafer.
    Type: Grant
    Filed: September 25, 2015
    Date of Patent: December 26, 2017
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Robert D. Allen, Jeffrey Gelorme, Li-Wen Hung, Ratnam Sooriyakumaran, Linda K. Sundberg
  • Patent number: 9748131
    Abstract: A method for adhesive bonding in microelectronic device processing is provided that includes bonding a handling wafer to a front side of a device wafer with an adhesive comprising phenoxy resin; and thinning the device wafer from the backside of the device wafer while the device wafer is adhesively engaged to the handling wafer. After the device wafer has been thinned, the adhesive comprising phenoxy resin may be removed by laser debonding, wherein the device wafer is separated from the handling wafer.
    Type: Grant
    Filed: November 17, 2015
    Date of Patent: August 29, 2017
    Assignee: International Business Machines Corporation
    Inventors: Robert D. Allen, Paul S. Andry, Jeffrey D. Gelorme, Li-wen Hung, John U. Knickerbocker, Cornelia K. Tsang
  • Publication number: 20170174535
    Abstract: A method for removing glyphosate from a solution by contacting the solution with a polymeric particle including a moiety selected from the group consisting of ammonium, amine and combinations thereof, wherein the moiety is positively charged in the solution.
    Type: Application
    Filed: December 21, 2015
    Publication date: June 22, 2017
    Inventors: Robert D. Allen, Geraud J. Dubois, Young-Hye Na, Lianna C. Samuel, Joseph Sly, Ran Wang
  • Patent number: 9656000
    Abstract: A wound dressing and a method of making the wound dressing is described herein. The wound dressing is formed of an absorbent substrate formed of one or more layers and a low-adherence layer disposed on the substrate. The low-adherence layer can be disposed within at least a portion of the substrate. The low-adherence layer is formed of a mixture of at least one highly fluorinated polymer and at least one acidic polymer. The at least one highly fluorinated polymer has a fluorine content greater than the fluorine content of the at least one acidic polymer.
    Type: Grant
    Filed: October 18, 2012
    Date of Patent: May 23, 2017
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Robert D. Allen, Christopher E. Bannister, Jere J. Brophy, Richard A. DiPietro
  • Publication number: 20170128393
    Abstract: Compounds, pharmaceutical compositions and methods for treating viral and bacterial infections, by administering certain thiourea compounds, specifically acylthiourea, carboximidoylthiourea and S-alkyl isothiourea derivatives and analogs, in therapeutically effective amounts are disclosed.
    Type: Application
    Filed: December 22, 2016
    Publication date: May 11, 2017
    Applicant: SIGA TECHNOLOGIES, INC.
    Inventors: Robert D. ALLEN III, Sean M. AMBERG, Dongcheng DAI, James R. BURGESON, Dennis E. HRUBY
  • Patent number: 9601364
    Abstract: A method for adhesive bonding in microelectronic device processing is provided that includes bonding a handling wafer to a front side of a device wafer with an adhesive comprising phenoxy resin; and thinning the device wafer from the backside of the device wafer while the device wafer is adhesively engaged to the handling wafer. After the device wafer has been thinned, the adhesive comprising phenoxy resin may be removed by laser debonding, wherein the device wafer is separated from the handling wafer.
    Type: Grant
    Filed: March 22, 2016
    Date of Patent: March 21, 2017
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Robert D. Allen, Paul S. Andry, Jeffrey D. Gelorme, Li-wen Hung, John U. Knickerbocker, Cornelia K. Tsang
  • Patent number: 9566254
    Abstract: Compounds, pharmaceutical compositions and methods for treating viral and bacterial infections, by administering certain thiourea compounds, specifically acylthiourea, carboximidoylthiourea and S-alkyl isothiourea derivatives and analogs, in therapeutically effective amounts are disclosed.
    Type: Grant
    Filed: December 1, 2015
    Date of Patent: February 14, 2017
    Assignee: SIGA TECHNOLOGIES, INC.
    Inventors: Robert D. Allen, III, Sean M. Amberg, Dongcheng Dai, James R. Burgeson, Dennis E. Hruby