Patents by Inventor Robert D. Cyr

Robert D. Cyr has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of making a circuit board or layer thereof including semi-curing a second adhesive coated on a cured first adhesive
    Patent number: 5557843
    Abstract: A printed circuit board and method of manufacture thereof is disclosed. The printed circuit board includes a first substrate provided from a conductive layer having disposed on a first surface thereof a cured adhesive layer, A semi-cured adhesive layer is then disposed over the cured adhesive layer and a second substrate is disposed against the semi-cured adhesive layer.
    Type: Grant
    Filed: August 30, 1994
    Date of Patent: September 24, 1996
    Assignee: Parlex Corporation
    Inventors: Darryl J. McKenney, Robert D. Cyr
  • Printed circuit having a dielectric covercoat
    Patent number: 5450286
    Abstract: A printed circuit assembly includes a rigidizer having first and second opposing surfaces, a silicone bonding agent disposed over a first surface of the rigidizer, a flex circuit having first and second opposing surfaces with a first surface of the flex circuit disposed over the bonding agent, and a silicone covercoat disposed over selected portions of the second surface of the flex circuit.
    Type: Grant
    Filed: June 30, 1994
    Date of Patent: September 12, 1995
    Assignee: Parlex Corporation
    Inventors: Roland C. Jacques, Robert D. Cyr
  • Method of manufacturing a printed circuit board
    Patent number: 5376232
    Abstract: A method of depositing a conductive material on a surface of a printed circuit board, includes the steps of chemically treating at least a portion of a surface of the printed circuit board, disposing a resist layer over the chemically treated surface, depositing a conductive layer in the areas which are not covered by the resist, stripping the resist from the surface of the printed circuit board, and cleaning exposed chemically treated surfaces of the printed circuit board to remove contaminants from the surface of the printed circuit board which were introduced in the chemically treating step.
    Type: Grant
    Filed: August 23, 1993
    Date of Patent: December 27, 1994
    Assignee: Parlex Corporation
    Inventors: Darryl J. McKenney, Robert D. Cyr
  • Multiple layer printed circuit boards and method of manufacture
    Patent number: 5362534
    Abstract: A printed circuit board and method of manufacture thereof is disclosed. The printed circuit board includes a first substrate provided from a conductive layer having disposed on a first surface thereof a cured adhesive layer. A semi-cured adhesive layer is then disposed over the cured adhesive layer and a second substrate is disposed against the semi-cured adhesive layer.
    Type: Grant
    Filed: August 23, 1993
    Date of Patent: November 8, 1994
    Assignee: Parlex Corporation
    Inventors: Darryl J. McKenney, Robert D. Cyr