Patents by Inventor Robert D. Ickes

Robert D. Ickes has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ELECTRONIC DEVICE HAVING ELECTRICALLY GROUNDED HEAT SINK AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20110292612
    Abstract: An electronic device includes an integrated circuit (IC) package attached to a substrate and a heat sink attached to the IC package. Additionally, the electronic device also includes a film having an electric conductivity and contacting the heat sink and the IC package and extending to the substrate to provide a grounding connection for the heat sink. A method of manufacturing an electronic device includes connecting an IC package to a substrate, coupling a heat sink to the IC package and depositing a film having an electric conductivity and contacting the heat sink and the IC package and extending to the substrate to provide a grounding connection for the heat sink.
    Type: Application
    Filed: May 26, 2010
    Publication date: December 1, 2011
    Applicant: LSI Corporation
    Inventors: John W. Osenbach, Lawrence W. Golick, Robert D. Ickes