Abstract: A planar magnetic structure has an electrically insulating carrier made up of a base portion and opposed upstanding sidewalls. A plurality of planar primary windings and planar secondary windings are interstitially disposed within the carrier with planar dielectric spacers located between each adjacent pair of windings. A ferrite core envelopes the assembly to magnetically couple the windings. The carrier and windings form at least two spaces-apart sets of cooperating registration features which maintain the windings in fixed alignment with the carrier.

Abstract: A planar magnetic structure has an electrically insulating carrier made up of a base portion and opposed upstanding sidewalls. A plurality of planar primary windings and planar secondary windings are interstitially disposed within the carrier with planar dielectric spacers located between each adjacent pair of windings. A ferrite core envelopes the assembly to magnetically couple the windings. The carrier and windings form at least two spaces-apart sets of cooperating registration features which maintain the windings in fixed alignment with the carrier.

Abstract: A planar magnetic structure has an electrically insulating carrier made up of a base portion and opposed upstanding sidewalls. A plurality of planar primary windings and planar secondary windings are interstitially disposed within the carrier with planar dielectric spacers located between each adjacent pair of windings. A ferrite core envelopes the assembly to magnetically couple the windings. The carrier and windings form at least two spaces-apart sets of cooperating registration features which maintain the windings in fixed alignment with the carrier.

Abstract: A semiconductor power module includes a semiconductor chip thermally interfaced to a ceramic substrate and a leadframe defined by a flexible circuit disposed intermediate the chip and the ceramic substrate. The flexible circuit includes a conductor layer that is selectively encased in an insulated jacket to ensure adequate electrical insulation between the conductor layer and adjacent conductive surfaces. Preferably, the module is constructed for double side cooling by sandwiching the chip between a pair of ceramic substrates and providing intermediate flexible circuit leadframes on both sides of the chip for electrically accessing the chip terminals.

Abstract: The switching sequence of a phase-shifted zero-voltage-transition (PS-ZVT) full bridge converter circuit is alternated between two modes by periodically reversing the switching sequence for diagonally opposed switching devices of the bridge. Over a period of operation, each of the switching devices periodically conduct the entire free-wheeling current that occurs during load current reversal transitions so as to balance their average power dissipation and reduce the overall power dissipation of the converter circuit.

Abstract: A semiconductor power module includes a semiconductor chip thermally interfaced to a ceramic substrate and a leadframe defined by a flexible circuit disposed intermediate the chip and the ceramic substrate. The flexible circuit includes a conductor layer that is selectively encased in an insulated jacket to ensure adequate electrical insulation between the conductor layer and adjacent conductive surfaces. Preferably, the module is constructed for double side cooling by sandwiching the chip between a pair of ceramic substrates and providing intermediate flexible circuit leadframes on both sides of the chip for electrically accessing the chip terminals.

Abstract: The switching sequence of a phase-shifted zero-voltage-transition (PS-ZVT) full bridge converter circuit is alternated between two modes by periodically reversing the switching sequence for diagonally opposed switching devices of the bridge. Over a period of operation, each of the switching devices periodically conduct the entire free-wheeling current that occurs during load current reversal transitions so as to balance their average power dissipation and reduce the overall power dissipation of the converter circuit.

Abstract: A device and method for dynamically optimizing a power converter is disclosed. The dynamically optimized power converter unit includes a processor that maximizes efficiency of a power converter supplying energy to a load.

Abstract: A DC/DC converter employing synchronous rectification includes an energy transfer switch, a diode, a synchronous switch, a processor and a memory subsystem. The processor estimates a diode conduction time and provides a control signal to the synchronous switch to cause the synchronous switch to conduct for a period of time equal to the estimated diode conduction time.