Patents by Inventor Robert D. May

Robert D. May has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MICROELECTRONICS PACKAGES WITH PHOTO-INTEGRATED GLASS INTERPOSER
    Publication number: 20240112972
    Abstract: Disclosed herein are microelectronics package architectures utilizing photo-integrated glass interposers and photonic integrated glass layers and methods of manufacturing the same. The microelectronics packages may include an organic substrate, a photonic integrated glass layer, and a glass interpose. The organic substrate may define through substrate vias. The photonic integrated glass layer may be attached to the organic substrate. The photonic integrated glass layer may include photo detectors. The glass interposer may be attached to the organic substrate. The glass interposer may define through glass vias in optical communication with the photo detectors.
    Type: Application
    Filed: September 30, 2022
    Publication date: April 4, 2024
    Inventors: Hiroki Tanaka, Robert Alan May, Kristof Darmawikarta, Bai Nie, Brandon C. Marin, Jeremy D. Ecton, Srinivas Venkata Ramanuja Pietambaram, Changhua Liu
  • Light and moisture resistant package
    Patent number: 4991717
    Abstract: The molded container body (10) and molded lid panel (34, 46, 48) are joined by a light and moisture impervious seal membrane (54) which fixedly adheres to the upper surface of the lid panel but peelably adheres to the upper surface of a peripheral flange (20) on the container body, thus permitting one lid portion (46) to be raised to an open position by peeling the seal membrane away from flange (20) and pulling upward, without removing the seal membrane from the lid panel.
    Type: Grant
    Filed: January 29, 1990
    Date of Patent: February 12, 1991
    Assignee: Eastman Kodak Company
    Inventors: Robert D. May, John M. Williamson