Abstract: A non-destructive-readout nonvolatile semiconductor diode switching device that may be used as a memory element is disclosed. The diode switching device is formed with a ferroelectric material disposed above a rectifying junction to control the conduction characteristics therein by means of a remanent polarization. The invention may be used for the formation of integrated circuit memories for the storage of information.

Abstract: A process for removing topography effects during fabrication of micromachines. A sacrificial oxide layer is deposited over a level containing functional elements with etched valleys between the elements such that the sacrificial layer has sufficient thickness to fill the valleys and extend in thickness upwards to the extent that the lowest point on the upper surface of the oxide layer is at least as high as the top surface of the functional elements in the covered level. The sacrificial oxide layer is then polished down and planarized by chemical-mechanical polishing. Another layer of functional elements is then formed upon this new planarized surface.

Abstract: Apparatus for controlling the environment of a tank adapted to be filled with water where the tank includes a plurality of control apparatus. The invention specifically utilizes a microprocessor having a plurality of control signal inputs and a plurality of control signal outputs. Apparatus is provided for coupling each of the control signal outputs to each of the plurality of control apparatus. A program device is coupled to the microprocessor signal input such that data can be entered for the control of each of the plurality of control signal outputs and a timing apparatus is likewise coupled to one of the plurality of signal inputs in a manner to allow the microprocessor to calculate the time of day such that data entered by the program device will selectively control the function of each of the control apparatus as necessary to maintain the environment within the limits set by the operator.

Abstract: A silicon solar cell assembly comprising a large, thin silicon solar cell bonded to a metal mount for use when there exists a mismatch in the thermal expansivities of the device and the mount.