Abstract: In an aspect, an intumescent battery pad for a lithium ion battery comprises a polyurethane foam having a compression force deflection of 5 to 1,035 kilopascals at 25% deflection determined in accordance with ASTM D3574-17; and an intumescent material comprising an acid source, a carbon source, and a blowing agent; wherein the intumescent battery pad has a UL-V0 rating at a thickness of 1 millimeter. In another aspect, a battery can comprise at least two battery cells; and an intumescent battery pad located in between the at least two battery cells.

Abstract: In an aspect, an intumescent battery pad for a lithium ion battery comprises a polyurethane foam having a compression force deflection of 5 to 1,035 kilopascals at 25% deflection determined in accordance with ASTM D3574-17; and an intumescent material comprising an acid source, a carbon source, and a blowing agent; wherein the intumescent battery pad has a UL-V0 rating at a thickness of 1 millimeter. In another aspect, a battery can comprise at least two battery cells; and an intumescent battery pad located in between the at least two battery cells.

Abstract: Systems and methods for assigning a company's proxies associated with a company's shares from a financial intermediary to a lender are disclosed. In accordance with an aspect of the invention a system includes a memory and a processor. The memory stores a number of the company's shares for which the financial intermediary has not received proxy voting instructions and, for a plurality of lenders, the number of the company's shares loaned by the lender. The processor has access to the memory and determines a number of the company's proxies for which the financial intermediary has not received proxy voting instructions to assign to at least some of the plurality of lenders based on the number of company's shares for which the financial intermediary has not received voting instructions and based on the number of shares loaned by the lender.

Abstract: A shim holder includes a body having a center panel, a pair of middle panels connected to the center panel, and a pair of outer panels connected to the middle panels and adapted to be fixed to a surface to be shimmed. The body is unitary, thin, substantially flat in a normal state, and flexible. Adhesive elements are disposed on the outer panels to fix the holder to the surface to be shimmed. Also disclosed is a shim holder including an outer member; an inner member for contact with a surface to be shimmed; and at least one elastomeric connecter for connecting the outer member to the inner member. An adhesive element is disposed on the inner member for fixing the inner member to the surface to be shimmed. Further disclosed is a method of attaching a shim to a surface to be shimmed including the steps of providing a shim holder, attaching the shim holder to the surface to be shimmed, and loading at least one shim to the shim holder.

Abstract: A silicone grip comprising a cured silicone film layer with a Shore A Durometer of less than or equal to about 60 wherein the silicone film layer is formed from a curable silicone composition comprising a catalyst that promotes cure of the silicone composition, a higher molecular weight organopolysiloxane having at least two alkenyl groups per molecule, a lower molecular weight organopolysiloxane having at least two alkenyl groups per molecule, and an organopolysiloxane having at least two silicon-bonded hydrogen atoms per molecule. The cured silicone layer is used in combination with an adhesive to provide a flexible and malleable grip, and/or in combination with a backing layer that can be solid or foamed.

Abstract: Use of a roughened dielectric layer between a dielectric substrate and a conductive layer, which allows increased adhesion between layers without the conductor loss associated with roughened conductor layers, as well as improved accuracy in etching. The method is widely applicable to a variety of dielectric substrate and conductive layer constructions, and can be readily tuned to provide the desired level of adhesion and other advantageous properties.

Abstract: A dimensionally stable high K? microwave laminate comprises independent control of the K? and CTE (coefficient of thermal expansion) of the fluoropolymer microwave laminates. The laminate comprises a composite having at least two types of ceramic filler. At least one type of ceramic filler exhibits a K? of greater than 30. The two or more fillers are necessary to be able to independently control the K? and the CTE of the composite, thereby achieving a dimensional stability of absolute magnitude less than 0.1% change. The present invention allows the manufacture of microwave laminate with any specified K? (within the achievable range) and the XY CTE of the material nearly matched to that of copper, resulting in good dimensioned stability during circuit fabrication.

Abstract: Disclosed is a high pressure injection molding system employing one or more plastic injection molding workstations including split molds, a single plastic extruder coupled to a heated manifold capable of delivering fluid plastic to multiple workstations, and wherein final lockup of the split mold halves results in application of compressive forces effective to maintain the split mold halves in nominal position during high pressure injection molding conditions. Operational movement is performed by use of a single remote pumping station utilizing pressure compensated pumps, accumulators and manifolds. The independent mold workstations allow independent operation while providing efficency of operation for the hydraulic system and extruder system.

Abstract: Methods of fabricating multilayer circuits are presented. In accordance with the present invention, a plurality of circuit layers comprised of a dielectric substrate having a circuit formed thereon are stacked, one on top of the other. The dielectric substrate is composed of a polymeric material capable of undergoing fusion bonding such as a fluoropolymeric based substrate. Fusible conductive bonding material (e.g. solder) is applied on selected exposed circuit traces (prior to the stacking step) whereupon the entire stack-up is subjected to lamination under heat and pressure to simultaneously fuse all of the substrate and conductive layers together to form an integral multilayer circuit having solid conductive interconnects.