Abstract: Techniques for forming an enclosure comprised of aluminum zirconium alloy layer are disclosed. In some embodiments, aluminum ions and zirconium ions can be dissolved in a non-aqueous ionic liquid in an electrolytic plating bath. A reverse pulsed electric current can facilitate in co-depositing the aluminum ions and the zirconium ions onto a metal substrate. The resulting aluminum zirconium alloy layer can include nanocrystalline grain structures, which can impart the alloy layer with increased hardness and increased resistance to scratching, denting, and abrasion. In some embodiments, the aluminum zirconium alloy layer can be anodized to form an aluminum oxide layer. Subsequent to the anodization operation, the oxidized layer is able to retain its substantially neutral color.

Abstract: Techniques for forming an enclosure comprised of an aluminum alloy are disclosed. In some embodiments, aluminum ions and metal element ions can be dissolved in a non-aqueous ionic liquid in an electrolytic plating bath. A reverse pulsed electric current can facilitate in co-depositing the aluminum ions and the metal element ions onto a metal substrate. The resulting aluminum alloy layer can include nanocrystalline structures, which can impart the alloy layer with increased hardness and increased resistance to scratching, corrosion, and abrasion. In some embodiments, the metal element ion is chromium and the aluminum alloy layer includes a chromium oxide passivation layer formed via a passivation process. Subsequent to the passivation process, the formation of the chromium oxide layer does not impart a change in color to the aluminum alloy layer. In some embodiments, hafnium ions are co-deposited with aluminum ions to form an aluminum hafnium alloy.

Abstract: Techniques for forming an enclosure comprised of an aluminum alloy are disclosed. In some embodiments, aluminum ions and metal element ions can be dissolved in a non-aqueous ionic liquid in an electrolytic plating bath. A reverse pulsed electric current can facilitate in co-depositing the aluminum ions and the metal element ions onto a metal substrate. The resulting aluminum alloy layer can include nanocrystalline structures, which can impart the alloy layer with increased hardness and increased resistance to scratching, corrosion, and abrasion. In some embodiments, the metal element ion is chromium and the aluminum alloy layer includes a chromium oxide passivation layer formed via a passivation process. Subsequent to the passivation process, the formation of the chromium oxide layer does not impart a change in color to the aluminum alloy layer. In some embodiments, hafnium ions are co-deposited with aluminum ions to form an aluminum hafnium alloy.

Abstract: Techniques for forming an enclosure comprised of aluminum zirconium alloy layer are disclosed. In some embodiments, aluminum ions and zirconium ions can be dissolved in a non-aqueous ionic liquid in an electrolytic plating bath. A reverse pulsed electric current can facilitate in co-depositing the aluminum ions and the zirconium ions onto a metal substrate. The resulting aluminum zirconium alloy layer can include nanocrystalline grain structures, which can impart the alloy layer with increased hardness and increased resistance to scratching, denting, and abrasion. In some embodiments, the aluminum zirconium alloy layer can be anodized to form an aluminum oxide layer. Subsequent to the anodization operation, the oxidized layer is able to retain its substantially neutral color.

Abstract: A composite conductor is disclosed having an elongate support with an outer surface of a whisker-forming metallic, the conductor further having a carbon nanotube yarn intertwined with the elongate support. The yarn is infiltrated by self-assembled whiskers from the whisker forming metallic.

Abstract: A method of manufacturing an electrical conductor includes providing a substrate layer, depositing a surface layer on the substrate layer that has pores at least partially exposing the substrate layer, and forming graphene deposits in the pores. Optionally, the graphene deposits may be formed only in the pores. The graphene deposits may be formed along the exposed portions of the substrate layer. The graphene layers may be selectively deposited or may be deposited to cover an entire layer. Optionally, the forming of the graphene deposits may include processing the electrical conductor using a chemical vapor deposition process using an organic compound precursor and heat of sufficient temperature to facilitate graphene growth on the metal compound comprising the substrate layer.

Abstract: A contactless connector includes a first communication chip configured to at least one of transmit and receive wireless RF signals, a second communication chip configured to at least one of transmit and receive wireless RF signals, and a waveguide structure between the first and second communication chips. The waveguide structure conveys RF signals between the first and second communication chips.

Abstract: An electrical conductor has a metal substrate. A seal layer is provided exterior of the metal substrate. A nickel layer is provided exterior of the seal layer. The seal layer is a non-nickel based metal. Optionally, the seal layer may be tin based. Optionally, the seal layer may create intermetallic interface layers with the nickel layer and the metal substrate. Optionally, the electrical conductor may constitute a contact configured for mating with at least one of a printed circuit board or another mating contact.

Abstract: A composite conductor is disclosed having an elongate support with an outer surface of a whisker-forming metallic, the conductor further having a carbon nanotube yarn intertwined with the elongate support. The yarn is infiltrated by self-assembled whiskers from the whisker forming metallic.

Abstract: A method of manufacturing a composite assembly includes providing a fluid bath and adding a ceramic material to the fluid bath. The ceramic material comprises a plurality of ceramic particles, wherein the plurality of ceramic particles is devoid of a conductive coating. The method further includes immersing at least part of a conductive substrate in the fluid bath. The method also includes applying a voltage potential between the fluid bath and the conductive substrate, whereby the ceramic material is electrodeposited onto the conductive substrate as at least a portion of a dielectric layer.

Abstract: An electrical contact includes a body having a mating segment. At least a portion of the mating segment defines a first conductive element having a three-dimensional (3D) surface. A dielectric layer is formed directly on the 3D surface of the first conductive element in engagement with the 3D surface. A second conductive element is formed on the dielectric layer such that the dielectric layer extends between the first and second conductive elements. The first and second conductive elements and the dielectric layer form a capacitor.

Abstract: A nickel based alloy coating and a method for applying the nickel based alloy as a coating to a substrate. The nickel based alloy comprises about 0.1-15% rhenium, about 5-55% of an element selected from the group consisting of cobalt, iron and combinations thereof, sulfur included as a microalloying addition in amounts from about 100 parts per million (ppm) to about 300 ppm, the balance nickel and incidental impurities. The nickel-based alloy of the present invention is applied to a substrate, usually an electro-mechanical device such as a MEMS, by well-known plating techniques. However, the plating bath must include sufficient sulfur to result in deposition of 100-300 ppm sulfur as a microalloyed element. The coated substrate is heat treated to develop a two phase microstructure in the coating.

Abstract: An electrical conductor has a metal substrate. A seal layer is provided exterior of the metal substrate. A nickel layer is provided exterior of the seal layer. The seal layer is a non-nickel based metal. Optionally, the seal layer may be tin based. Optionally, the seal layer may create intermetallic interface layers with the nickel layer and the metal substrate. Optionally, the electrical conductor may constitute a contact configured for mating with at least one of a printed circuit board or another mating contact.

Abstract: An electrical conductor has a metal substrate. A seal plating layer is provided on and exterior of the metal substrate. A nickel plating layer is provided on and exterior of the seal plating layer. A gold plating layer is provided on and exterior of the nickel plating layer. The seal plating layer is a non-nickel based metal. Optionally, the seal plating layer may be tin based. Optionally, the seal plating layer may create intermetallic interface layers with the nickel plating layer and the metal substrate. Optionally, the electrical conductor may constitute a contact configured for mating with at least one of a printed circuit board or another mating contact.

Abstract: A method of manufacturing an electrical conductor includes providing a substrate layer, depositing a surface layer on the substrate layer that has pores at least partially exposing the substrate layer, and forming graphene deposits in the pores. Optionally, the graphene deposits may be formed only in the pores. The graphene deposits may be formed along the exposed portions of the substrate layer. The graphene layers may be selectively deposited or may be deposited to cover an entire layer. Optionally, the forming of the graphene deposits may include processing the electrical conductor using a chemical vapor deposition process using an organic compound precursor and heat of sufficient temperature to facilitate graphene growth on the metal compound comprising the substrate layer.

Abstract: An electrical connector is provided for mating with an electrical component. The connector includes a substrate having a mating side, and a solder column extending from the mating side of the substrate. The solder column includes a base that is engaged with the substrate. The solder column extends a length away from the mating side of the substrate to a tip. The tip includes a contact surface that is configured to engage and electrically connect to an electrical contact of the electrical component. The solder column is linearly tapered along at least a portion of the length from the base to the tip.

Abstract: A contactless connector includes a first communication chip configured to at least one of transmit and receive wireless RF signals, a second communication chip configured to at least one of transmit and receive wireless RF signals, and a waveguide structure between the first and second communication chips. The waveguide structure conveys RF signals between the first and second communication chips.

Abstract: An electrical contact includes a body having a mating segment. At least a portion of the mating segment defines a first conductive element having a three-dimensional (3D) surface. A dielectric layer is formed directly on the 3D surface of the first conductive element in engagement with the 3D surface. A second conductive element is formed on the dielectric layer such that the dielectric layer extends between the first and second conductive elements. The first and second conductive elements and the dielectric layer form a capacitor.

Abstract: A cable includes a jacket surrounding a core and a carbon-based substrate (CBS) conductor in the core. The CBS conductor includes a CBS network and an organometallic filler, wherein the organometallic filler combines with the CBS network to form a composite conductor having a higher conductivity than the CBS network. Optionally, the CBS network may include carbon nanotube (CNT) fibers with the organometallic fillers being disposed within the CNT fibers. The organometallic fillers may include at least one of palladium glycolate, glycolic acid, glyoxyllic acid or methanol. A method for manufacturing a carbon-based substrate (CBS) conductor, such as for a cable, includes providing a CBS network of CBS fibers forming a framework, introducing an organometallic compound, and reacting the CBS network with the organometallic compound to form a composite conductor. The method may include immersing the CBS network in an organometallic bath having organometallic particles in a solvent.

Abstract: A method for silver plating an electrical contact is provided. The method includes cleaning an electrical contact by removing oil or other contaminants and exposing the electrical contact to at least one of an acid or base. The method also includes preparing a silver plating bath including a silver compound, a transition metal compound, and a supporting salt, wherein the transition metal is at least one of nickel or cobalt. The method further includes silver plating the electrical contact in the silver plating bath.