Abstract: Light-emitting diode (LED) devices and more particularly arrangements of LED packages in LED devices and related methods are disclosed. LED devices include arrays of LED packages with spacings determined by grid structures. LED packages are partially finished before assembly into LED devices, thereby permitting individual testing and binning of LED packages before device assembly. Partially finished LED packages include primary encapsulants that partially fill recesses thereof to cover associated LED chips. During device assembly, overfill encapsulants are provided that cover the partially finished LED packages and fill portions of each recess above the primary encapsulants. Grid structures may remain as constituent elements in LED devices, or grid structures may be removed before providing overfill encapsulants.

Abstract: Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly structures for LED packages with multiple LED chips are disclosed. LED package structures include arrangements of one or more of body structures with multiple cavities for LED chips, encapsulants with lenses registered with the multiple cavities, and lead frame structures at least partially within the body structures. Cavities of body structures and/or corresponding lenses are disclosed with certain asymmetries configured to direct highest intensities of LED chip emissions in directions that are offset from cavity centers. Body structures are disclosed with one or more continuously planar surfaces that promote enhanced flexibility in encapsulant and/or lead frame structures and improved resistance to moisture ingress. One or more combinations of cavities and/or lenses asymmetries may be implemented in combination with one or more continuously planar body surfaces.

Abstract: Light-emitting diode (LED) devices and more particularly lead frame structures for reflow mitigation in LED packages are disclosed. Lead frame structures include various features positioned within a recess of a package housing and proximate mounting areas of LED chips within the recess. The features may include nonplanar shapes relative to a floor of the recess that promote increased adhesion with an encapsulant in the recess while also mitigating effects of reflow when the package is later bonded at a device level. Exemplary nonplanar shapes include portions of leads that extend upward into the recess and/or portions of leads that extend downward below the floor of the recess. The features may be arranged in rows, as islands, or even as random structures along portions of the leads.

Abstract: Light-emitting diode (LED) packages and more particularly light mixing arrangements in LED packages are disclosed. LED packages include multiple LED chips arranged within a single recess or cavity and a single corresponding lens. Light mixing arrangements include LED chip layouts, lens structures, and/or cladding layers for lens structures. LED packages are disclosed with reduced full width half maximum values and improved uniformity in far field pattern emissions by reducing lensing effects of multiple LED chips in a single cavity. A figure of merit is described that defines a color quality index metric that characterizes color quality and uniformity of far field emissions in multiple-color and multiple-chip LED packages.

Abstract: Light-emitting diode (LED) devices and more particularly anchored encapsulation in LED packages and related structures is disclosed. Anchoring structures are described herein that improve adhesion with encapsulant materials. Exemplary LED packages include support structures with recesses and one or more anchoring structures integrated along recess sidewalls, thereby increasing surface areas of the recess sidewalls. When encapsulant materials are provided within the recesses, portions of encapsulant materials may conform to the anchoring structures to promote increased contact area between the encapsulant materials and the support structures. Exemplary support structures include lead frame structures with housings that form the recesses or submount structures.

Abstract: Solid state light-emitting devices and more particularly arrangements of multiple-junction light-emitting diode (LED) chips in LED packages and corresponding LED displays are disclosed. Multiple-junction LED chips are arranged in LED packages with single-junction LED chips. Multiple-junction LED chips are configured to have forward voltages the same or similar to single-junction LED chips in the same LED package. Common anode or common cathode arrangements for multiple-junction and single-junction LED packages are disclosed. Multiple-junction LED chips configured to provide different emission wavelengths than single-junction LED chips while also having same or similar forward voltages are disclosed.

Abstract: Solid-state lighting devices, and more particularly, symmetrical lead frame structures for two-pin light emitting diode (LED) packages and methods for making the same are disclosed. The symmetrical lead frame structure can include a pair of leads that include symmetrical split cup portions that collectively, when placed next to each other, form a cup, across which an LED flip-chip can be placed. Each of the leads can be a respective electrode powering the LED flip-chip, which together with the symmetrical structure, provides a more even light emission profile and far-field pattern. A molded lens can be formed around the lead frame to protect the chip, as well as maintain a gap between the pair of leads of the lead frame structure. In some embodiments, a fill material can be added in the gap between the pair of leads.

Abstract: Light-emitting diode (LED) packages, and more particularly arrangements of light-altering coatings in LED packages are disclosed. Exemplary LED packages may include lead frame structures that are at least partially encased by a housing. Arrangements of light-altering coatings may be provided that cover one or more portions of lead frame structures exposed within LED package recesses. By providing light-altering coatings that cover lead frame structures within package recesses, negative impacts from potential lead frame discoloration due to environmental exposure may be reduced. Additionally, such light-altering coatings may be configured to reflect light emissions from LED chips before reaching portions of lead frame structures. Light-altering coating arrangements are disclosed where light-altering coatings are arranged in contact with LED chips or, alternatively, in a spaced relationship with LED chips.

Abstract: Light-emitting diode (LED) packages and more particularly LED packages that have LED chips mounted at different angles with respect to each to modify a far-field emission pattern are disclosed. The LED chips in the LED package can either be pitched inwards so that the light emissions from the LED chips generally overlap, or the LED chips can be pitched outwards. The LED chips can be mounted on a floor of a housing that has a plurality of angled surfaces. In other embodiments, the LED chips can be mounted on a platform in the housing that has different angled surfaces. In other embodiments, the LED chips can be mounted on one or more lead frame pins that can be angled, or angled with respect to other lead frame pins. The LED package may also include a light collector or a lens in order to further modify the far-field emission pattern.

Abstract: Light-emitting diode (LED) packages, and more particularly arrangements of light-altering coatings in LED packages are disclosed. Exemplary LED packages may include lead frame structures that are at least partially encased by a housing. Arrangements of light-altering coatings may be provided that cover one or more portions of lead frame structures exposed within LED package recesses. By providing light-altering coatings that cover lead frame structures within package recesses, negative impacts from potential lead frame discoloration due to environmental exposure may be reduced. Additionally, such light-altering coatings may be configured to reflect light emissions from LED chips before reaching portions of lead frame structures. Light-altering coating arrangements are disclosed where light-altering coatings are arranged in contact with LED chips or, alternatively, in a spaced relationship with LED chips.

Abstract: Light-emitting diode (LED) packages and more particularly multiple chip LED packages with common electrodes are disclosed. LED packages include lead frame structures with a common electrode for multiple LED chips and other corresponding electrodes separately coupled to individual ones of the LED chips. The common electrode forms an anode or a cathode connection for each of the LED chips. The common electrode includes multiple extensions or pins that separately exit the package to provide separate external electrical connections to the common electrode. The common electrode may provide increased surface area of metal within the LED package to form an improved thermal body for heat dissipation. Multiple pin extensions from the common electrode allow LED packages to maintain a same form factor to be a drop in replacement for existing packages and allow enhanced adhesion with a housing that encases the lead frame structure.

Abstract: Light-emitting diode (LED) packages and more particularly anchored light mixing structures in LED packages and related methods are disclosed. LED packages include one or more LED chips and integrated light mixing structures, such as light collectors, that are placed over the LED chips to modify far field patterns. Light mixing structures are provided within recesses of LED package housings in positions over the LED chips. Sidewalls of recesses may include alignment features with shapes configured to receive corresponding shapes of light mixing structures. Alternative configurations, alone or in combination with the sidewall alignment features, may include alignment features on top surfaces of the LED packages outside of a recess. As disclosed herein, alignment features are arranged to effectively anchor a light mixing structure in place during package assembly. Additional package structures, such as encapsulants and/or epoxies, may further hold the light mixing structures in place.

Abstract: Light-emitting diode (LED) packages, and more particularly to a light collector for light mixing in LED packages to improve the far field emission pattern (FFP) of the LED packages are disclosed. The LED package can include one or more LED chips with different wavelength ranges, and the light collector placed over the LED chips can have a reflective surface, save for a reduced aperture through which the light form the LED chips can be emitted after mixing in the light collector. The LED package can also include a lens to further improve the FFP. In an embodiment the light collector can include diffuser material to facilitate the mixing of the light within the light collector. The LED package with the light collector mixes multiple emission point sources into a single point source, or reduced-area source, that considerably improves the FFP of multi-colored LED chips of the LED package.

Abstract: Light-emitting diode (LED) packages and more particularly a light collector for light mixing in LED packages to improve the far field emission pattern (FFP) of the LED packages are disclosed. The LED package can include one or more LED chips with different wavelength ranges, and the light collector placed over the LED chips can have a reflective surface, save for a reduced aperture through which the light from the LED chips can be emitted after mixing in the light collector. The LED package can also include a lens to further improve the FFP. In an embodiment, the light collector can include diffuser material to facilitate the mixing of the light within the light collector. The LED package with the light collector mixes multiple emission point sources into a single point source, or reduced-area source, that considerably improves the FFP of multi-colored LED chips of the LED package.

Abstract: Group III nitride based light emitting diode (LED) structures include multiple quantum wells with barrier-well units that include III nitride interface layers. Each interface layer may have a thickness of no greater than about 30% of an adjacent well layer, and a comparatively low concentration of indium or aluminum. One or more interface layers may be present in a barrier-well unit. Multiple barrier-well units having different properties may be provided in a single active region.

Abstract: Light-emitting devices including solid-state light-emitting devices, light-emitting diode (LED) devices, and LED packages with support elements for improved near-field and far-field emissions are disclosed. LED chips may be mounted to support elements in a manner that directs light through the support elements in desired emission directions. Support elements include optical structures that spread and mix light laterally within the support element. Optical structures include interior mixing chambers bounded by light-altering layers, such as light-diffusing layers or light-reflective layers, that effectively increase internal reflections within the mixing chambers for lateral spreading of light. Support elements as described may be well suited for low profile LED devices where device heights are less than or equal to device widths.