Patents by Inventor Robert DeBlieck

Robert DeBlieck has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated solder and heat spreader fabrication
    Publication number: 20070035012
    Abstract: A system may include an integrated heat spreader that includes a portion of solder material and a thermal conductor, wherein a voidless interface exists between the solder material and a first side of the thermal conductor.
    Type: Application
    Filed: October 13, 2006
    Publication date: February 15, 2007
    Inventors: Carl Deppisch, Edward Martin, Sabina Houle, James Mellody, Marvin Burgess, Maureen Brown, Robert DeBlieck, David Carroll
  • Thermal interface material bonding
    Publication number: 20050133934
    Abstract: A system may include placement of a first surface of a solder preform on a first surface of a heat dissipator, and rolling of a roller across a second surface of the solder preform. In some embodiments, the system further includes pressing the solder preform and the heat dissipator against each other.
    Type: Application
    Filed: December 23, 2003
    Publication date: June 23, 2005
    Inventors: James Mellody, Sabina Houle, Carl Deppisch, Joni Hansen, Marvin Burgess, Robert DeBlieck
  • Integrated solder and heat spreader fabrication
    Publication number: 20050121776
    Abstract: A system may include an integrated heat spreader that includes a portion of solder material and a thermal conductor, wherein a voidless interface exists between the solder material and a first side of the thermal conductor.
    Type: Application
    Filed: December 5, 2003
    Publication date: June 9, 2005
    Inventors: Carl Deppisch, Edward Martin, Sabina Houle, James Mellody, Marvin Burgess, Maureen Brown, Robert DeBlieck, David Carroll