Patents by Inventor Robert Devlin

Robert Devlin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11988844
    Abstract: Metasurface elements, integrated systems incorporating such metasurface elements with light sources and/or detectors, and methods of the manufacture and operation of such optical arrangements and integrated systems are provided. Systems and methods for integrating transmissive metasurfaces with other semiconductor devices or additional metasurface elements, and more particularly to the integration of such metasurfaces with substrates, illumination sources and sensors are also provided. The metasurface elements provided may be used to shape output light from an illumination source or collect light reflected from a scene to form two unique patterns using the polarization of light. In such embodiments, shaped-emission and collection may be combined into a single co-designed probing and sensing optical system.
    Type: Grant
    Filed: May 13, 2020
    Date of Patent: May 21, 2024
    Assignee: Metalenz, Inc.
    Inventors: Gilbert N. Riley, Jr., Robert Devlin, Adam Erlich, Pawel Latawiec, John Graff
  • Publication number: 20240108651
    Abstract: The present disclosure relates to Dsg2 binding molecules, nucleic acid molecules encoding the Dsg2 binding molecules and compositions comprising the same and methods of use thereof for treating or preventing cancer.
    Type: Application
    Filed: December 2, 2021
    Publication date: April 4, 2024
    Inventors: Adam Eugene Snook, My Georgia Mahoney, Robert Devlin Carlson
  • Publication number: 20230194883
    Abstract: Metasurface elements, integrated systems incorporating such metasurface elements with light sources and/or detectors, and methods of the manufacture and operation of such optical arrangements and integrated systems are provided. Systems and methods for integrating transmissive metasurfaces with other semiconductor devices or additional metasurface elements, and more particularly to the integration of such metasurfaces with substrates, illumination sources and sensors are also provided. The metasurface elements provided may be used to shape output light from an illumination source or collect light reflected from a scene to form two unique patterns using the polarization of light. In such embodiments, shaped-emission and collection may be combined into a single co-designed probing and sensing optical system.
    Type: Application
    Filed: February 13, 2023
    Publication date: June 22, 2023
    Applicant: Metalenz, Inc.
    Inventors: Gilbert N. Riley, JR., Robert Devlin, Adam Erlich, Pawel Latawiec, John Graff
  • Patent number: 11579456
    Abstract: Metasurface elements, integrated systems incorporating such metasurface elements with light sources and/or detectors, and methods of the manufacture and operation of such optical arrangements and integrated systems are provided. Systems and methods for integrating transmissive metasurfaces with other semiconductor devices or additional metasurface elements, and more particularly to the integration of such metasurfaces with substrates, illumination sources and sensors are also provided. The metasurface elements provided may be used to shape output light from an illumination source or collect light reflected from a scene to form two unique patterns using the polarization of light. In such embodiments, shaped-emission and collection may be combined into a single co-designed probing and sensing optical system.
    Type: Grant
    Filed: December 7, 2021
    Date of Patent: February 14, 2023
    Assignee: Metalenz, Inc.
    Inventors: Gilbert N. Riley, Jr., Robert Devlin, Adam Erlich, Pawel Latawiec, John Graff
  • Publication number: 20220091428
    Abstract: Metasurface elements, integrated systems incorporating such metasurface elements with light sources and/or detectors, and methods of the manufacture and operation of such optical arrangements and integrated systems are provided. Systems and methods for integrating transmissive metasurfaces with other semiconductor devices or additional metasurface elements, and more particularly to the integration of such metasurfaces with substrates, illumination sources and sensors are also provided. The metasurface elements provided may be used to shape output light from an illumination source or collect light reflected from a scene to form two unique patterns using the polarization of light. In such embodiments, shaped-emission and collection may be combined into a single co-designed probing and sensing optical system.
    Type: Application
    Filed: December 7, 2021
    Publication date: March 24, 2022
    Applicant: Metalenz, Inc.
    Inventors: Gilbert N. Riley, JR., Robert Devlin, Adam Erlich, Pawel Latawiec, John Graff
  • Patent number: 11034077
    Abstract: A thermoforming mold trimming system, apparatus, and method of use are disclosed. The thermoforming mold trimming apparatus includes a robot support structure with at least one robot secured to the robot support structure. The apparatus also includes a contact probe removably secured to the robot, the contact probe being configured to generate a trim path for a thermoformed molded part. The robot is programmed to follow the trim path generated by the contact probe. The robot then uses a blade to trim excess material of a finished molded part within the housing by following the trim path.
    Type: Grant
    Filed: November 8, 2016
    Date of Patent: June 15, 2021
    Assignee: DEVLINKS, LTD.
    Inventors: Robert Devlin, Scott Jackson, David Findlay, Adin Kay Goings
  • Patent number: 10795168
    Abstract: Metasurface elements, integrated systems incorporating such metasurface elements with light sources and/or detectors, and methods of the manufacture and operation of such optical arrangements and integrated systems are provided. Systems and methods for integrating transmissive metasurfaces with other semiconductor devices or additional metasurface elements, and more particularly to the integration of such metasurfaces with substrates, illumination sources and sensors are also provided. The metasurface elements provided may be used to shape output light from an illumination source or collect light reflected from a scene to form two unique patterns using the polarization of light. In such embodiments, shaped-emission and collection may be combined into a single co-designed probing and sensing optical system.
    Type: Grant
    Filed: August 31, 2018
    Date of Patent: October 6, 2020
    Assignee: Metalenz, Inc.
    Inventors: Gilbert N. Riley, Jr., Robert Devlin, Adam Erlich, Pawel Latawiec, John Graff
  • Publication number: 20200271941
    Abstract: Metasurface elements, integrated systems incorporating such metasurface elements with light sources and/or detectors, and methods of the manufacture and operation of such optical arrangements and integrated systems are provided. Systems and methods for integrating transmissive metasurfaces with other semiconductor devices or additional metasurface elements, and more particularly to the integration of such metasurfaces with substrates, illumination sources and sensors are also provided. The metasurface elements provided may be used to shape output light from an illumination source or collect light reflected from a scene to form two unique patterns using the polarization of light. In such embodiments, shaped-emission and collection may be combined into a single co-designed probing and sensing optical system.
    Type: Application
    Filed: May 13, 2020
    Publication date: August 27, 2020
    Applicant: Metalenz, Inc.
    Inventors: Gilbert N. Riley, JR., Robert Devlin, Adam Erlich, Pawel Latawiec, John Graff
  • Publication number: 20190064532
    Abstract: Metasurface elements, integrated systems incorporating such metasurface elements with light sources and/or detectors, and methods of the manufacture and operation of such optical arrangements and integrated systems are provided. Systems and methods for integrating transmissive metasurfaces with other semiconductor devices or additional metasurface elements, and more particularly to the integration of such metasurfaces with substrates, illumination sources and sensors are also provided. The metasurface elements provided may be used to shape output light from an illumination source or collect light reflected from a scene to form two unique patterns using the polarization of light. In such embodiments, shaped-emission and collection may be combined into a single co-designed probing and sensing optical system.
    Type: Application
    Filed: August 31, 2018
    Publication date: February 28, 2019
    Applicant: Metalenz, Inc.
    Inventors: Gilbert N. Riley, JR., Robert Devlin, Adam Erlich, Pawel Latawiec, John Graff
  • Publication number: 20170129159
    Abstract: A thermoforming mold trimming system, apparatus, and method of use are disclosed. The thermoforming mold trimming apparatus includes a robot support structure with at least one robot secured to the robot support structure. The apparatus also includes a contact probe removably secured to the robot, the contact probe being configured to generate a trim path for a thermoformed molded part. The robot is programmed to follow the trim path generated by the contact probe. The robot then uses a blade to trim excess material of a finished molded part within the housing by following the trim path.
    Type: Application
    Filed: November 8, 2016
    Publication date: May 11, 2017
    Inventors: Robert Devlin, Scott Jackson, David Findlay, Adin Kay Goings