Patents by Inventor Robert DiMatteo

Robert DiMatteo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210268465
    Abstract: Systems and methods are described herein that create discrete volumes associated with solid-phase particles (e.g., drop-carrier particles) suspended in an immiscible phase (e.g., dropicles). One embodiment of the system includes a plurality of hydrogel-based drop-carrier particles containing a microscale voids or cavities that hold an aqueous phase droplet of fluid within each drop-carrier particle. The plurality of hydrogel drop-carrier particles associated with aqueous drops are suspended as individual elements in an immiscible oil phase. The microscale hydrogel drop-carrier particles containing the voids or cavities may be manufactured using microfluidic droplet generators. The dropicles may be used to analyze single-entities (e.g., single-molecules and single-cells) and analytes.
    Type: Application
    Filed: August 16, 2019
    Publication date: September 2, 2021
    Applicant: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
    Inventors: Dino Di Carlo, Joseph de Rutte, Robert Dimatteo
  • Patent number: 9349891
    Abstract: An MTPV thermophotovoltaic chip comprising a photovoltaic cell substrate, micron/sub-micron gap-spaced from a juxtaposed heat or infrared radiation-emitting substrate, with a radiation-transparent intermediate window substrate preferably compliantly adhered to the photovoltaic cell substrate and bounding the gap space therewith.
    Type: Grant
    Filed: January 20, 2014
    Date of Patent: May 24, 2016
    Assignee: MTPV Power Corporation
    Inventors: Paul Greiff, Robert DiMatteo, Eric Brown, Christopher Leitz
  • Patent number: 8822813
    Abstract: An improved submicron gap thermophotovoltaic structure and method comprising an emitter substrate with a first surface for receiving heat energy and a second surface for emitting infrared radiation across an evacuated submicron gap to a juxtaposed first surface of an infrared radiation-transparent window substrate having a high refractive index. A second surface of the infrared radiation-transparent substrate opposite the first surface is affixed to a photovoltaic cell substrate by an infrared-transparent compliant adhesive layer. Relying on the high refractive index of the infrared radiation-transparent window substrate, the low refractive index of the submicron gap and Snell's law, the infrared radiation received by the first surface of the infrared radiation-transparent window substrate is focused onto a more perpendicular path to the surface of the photovoltaic cell substrate. This results in increased electrical power output and improved efficiency by the thermophotovoltaic structure.
    Type: Grant
    Filed: November 30, 2012
    Date of Patent: September 2, 2014
    Assignee: MTPV Power Corporation
    Inventors: Paul Greiff, Robert Dimatteo, Eric Brown, Christopher Leitz
  • Publication number: 20140137921
    Abstract: An MTPV thermophotovoltaic chip comprising a photovoltaic cell substrate, micron/sub-micron gap-spaced from a juxtaposed heat or infrared radiation-emitting substrate, with a radiation-transparent intermediate window substrate preferably compliantly adhered to the photovoltaic cell substrate and bounding the gap space therewith.
    Type: Application
    Filed: January 20, 2014
    Publication date: May 22, 2014
    Applicant: MTPV Power Corporation
    Inventors: Paul Greiff, Robert DiMatteo, Eric Brown, Christopher Leitz
  • Patent number: 8633373
    Abstract: An MTPV thermophotovoltaic chip comprising a photovoltaic cell substrate, micron/sub-micron gap-spaced from a juxtaposed heat or infrared radiation-emitting substrate, with a radiation-transparent intermediate window substrate preferably compliantly adhered to the photovoltaic cell substrate and bounding the gap space therewith.
    Type: Grant
    Filed: May 12, 2008
    Date of Patent: January 21, 2014
    Assignee: MTPV Power Corporation
    Inventors: Paul Greiff, Robert DiMatteo, Eric Brown, Christopher Leitz
  • Patent number: 8450598
    Abstract: A near-field energy conversion method, utilizing a sub-micrometer “near-field” gap between juxtaposed infrared radiation receiver and emitter surfaces, wherein compliant membrane structures, preferably fluid-filled, are interposed in the structure for maintaining uniform gap separation. Thermally resistant gap spacers are also used to maintain uniform gap separation. Means are provided for cooling a receiver substrate structure and for conducting heat to an emitter substrate structure. The gap may also be evacuated for more effective operation.
    Type: Grant
    Filed: November 16, 2011
    Date of Patent: May 28, 2013
    Assignee: MTPV Power Corporation
    Inventors: Paul Greiff, Robert DiMatteo, Eric Brown, Christopher Leitz
  • Publication number: 20120060883
    Abstract: A near-field energy conversion method, utilizing a sub-micrometer “near-field” gap between juxtaposed infrared radiation receiver and emitter surfaces, wherein compliant membrane structures, preferably fluid-filled, are interposed in the structure for maintaining uniform gap separation. Thermally resistant gap spacers are also used to maintain uniform gap separation. Means are provided for cooling a receiver substrate structure and for conducting heat to an emitter substrate structure. The gap may also be evacuated for more effective operation.
    Type: Application
    Filed: November 16, 2011
    Publication date: March 15, 2012
    Applicant: MTPV LLC
    Inventors: Paul GREIFF, Robert DiMatteo, Eric Brown, Christopher Leitz
  • Patent number: 8076569
    Abstract: A near-field energy conversion structure and method of assembling the same, utilizing a sub-micrometer “near field” gap between juxtaposed photocell infrared radiation receiver and heat emitter surfaces, wherein compliant membrane structures, preferably fluid-filled, are interposed in the structure.
    Type: Grant
    Filed: May 12, 2008
    Date of Patent: December 13, 2011
    Assignee: MTPV, LLC
    Inventors: Paul Greiff, Robert DiMatteo, Eric Brown, Christopher Leitz
  • Publication number: 20100319749
    Abstract: An MTPV thermophotovoltaic chip comprising a photovoltaic cell substrate, micron/sub-micron gap-spaced from a juxtaposed heat or infrared radiation-emitting substrate, with a radiation-transparent intermediate window substrate preferably compliantly adhered to the photovoltaic cell substrate and bounding the gap space therewith.
    Type: Application
    Filed: May 12, 2008
    Publication date: December 23, 2010
    Inventors: Paul Greiff, Robert DiMatteo, Eric Brown, Christopher Leitz
  • Publication number: 20090277488
    Abstract: A near-field energy conversion structure and method of assembling the same, utilizing a sub-micrometer “near field” gap between juxtaposed photocell infrared radiation receiver and heat emitter surfaces, wherein compliant membrane structures, preferably fluid-filled, are interposed in the structure.
    Type: Application
    Filed: May 12, 2008
    Publication date: November 12, 2009
    Inventors: Paul Greiff, Robert DiMatteo, Eric Brown, Christopher Leitz
  • Publication number: 20090188549
    Abstract: A thermophotonic method and generator of photovoltaic current wherein preferably a thermal source supplemented by photon flux as generated in an interposed semiconductor LED or the like is vacuum-spaced from a photovoltaic semiconductor surface by a gap of the order of submicrons/microns.
    Type: Application
    Filed: January 29, 2008
    Publication date: July 30, 2009
    Inventor: Robert DiMatteo