Patents by Inventor Robert DITTMER
Robert DITTMER has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230414145Abstract: An electrode comprising a top layer comprising at least one conductive polymer section and at least one dry adhesive section, wherein the at least one dry adhesive section comprises a plurality of fibrillar microstructures; at least one middle layer comprising a non-conductive polymer; and a bottom layer comprising a conductive polymer, wherein the conductive polymer of the bottom layer is in electrical communication with the conductive polymer of the top layer through the at least one middle layer.Type: ApplicationFiled: November 16, 2021Publication date: December 28, 2023Inventors: Robert DITTMER, Leonard STOICA, Jeffrey HENDRICKS
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Publication number: 20210403388Abstract: One aspect relates to a process for producing a sintered workpiece, which includes sintering of a ceramic material at a temperature of at least 1000° C. and in an atmosphere, in the case of which the partial pressure of atmospheric air is reduced to less than 10?6-times, based on the ambient air at the same temperature under equilibrium conditions.Type: ApplicationFiled: June 14, 2021Publication date: December 30, 2021Applicant: Heraeus Deutschland GmbH & Co. KGInventors: Leoni WILHELM, Ulrich HAUSCH, Robert DITTMER
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Publication number: 20210030292Abstract: One aspect relates to a body, including at least one first polymer segment having a porosity p1 and an electrical conductivity c1, and at least one further polymer segment being in seamless contact with the at least one first polymer segment and having a porosity p2?p1 and an electrical conductivity c2?c1. One aspect also relates to a process for the preparation of a body, to a body obtainable by such a process, to the use of a body for electrophysical measurements or as a biosensor and to a therapeutic current delivery or current receiving system comprising the body.Type: ApplicationFiled: September 24, 2020Publication date: February 4, 2021Applicants: Heraeus Deutschland GmbH & Co. KG, Heraeus Medical Components LLCInventors: Robert Dittmer, Leonard Stoica, Jeffrey Hendricks
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Patent number: 10881866Abstract: One aspect relates to an electrical contacting device for a medical implantable device, including an electrically insulating base body with a first and a second surface. The base body includes a ceramics, an electrically conductive conducting element that extends from the first surface of the base body through the base body. The conducting element includes a cermet and is connected to the ceramics of the base body in firmly bonded manner through a sintered connection, a contact element including a metal. The contact element is connected to the conducting element in electrically conductive manner and can be connected to an electrically conductive structure. The contacting device includes an adhesion element. The adhesion element is connected to the contact element in firmly bonded manner and wherein the adhesion element includes an adhesion promoter in order to form a firmly bonded connection at least to the first surface of the base body.Type: GrantFiled: December 27, 2018Date of Patent: January 5, 2021Assignee: Heraeus Deutschland GmbH & Co. KGInventors: Robert Dittmer, Ulrich Hausch, Ilias Nikolaidis, Jens Trötzschel
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Patent number: 10413639Abstract: One aspect relates to a composite, including a ceramic body having a first layer surface and a second layer surface and at least one cermet conductor that electrically connects the surfaces. The composite includes a first layer with the first layer surface, a first ceramic, a first hole and a first cermet element in the first hole, a second layer with the second layer surface, a second ceramic, a second hole and a second cermet element in the second hole, and an intermediate layer that is located between the first and the second layer. The intermediate layer includes an intermediate layer ceramic, an intermediate hole and one intermediate cermet element in the intermediate hole. A projection of the cross-section of the first hole and a projection of the cross section of the second hole onto a plane Px,y are arranged offset to each other.Type: GrantFiled: October 4, 2018Date of Patent: September 17, 2019Assignee: Heraeus Deutschland GmbH & Co. KGInventors: Robert Dittmer, Ulrich Hausch, Jens Trötzschel, Peter Herzog, Josef Roth
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Publication number: 20190201699Abstract: One aspect relates to an electrical contacting device for a medical implantable device, including an electrically insulating base body with a first and a second surface. The base body includes a ceramics, an electrically conductive conducting element that extends from the first surface of the base body through the base body. The conducting element includes a cermet and is connected to the ceramics of the base body in firmly bonded manner through a sintered connection, a contact element including a metal. The contact element is connected to the conducting element in electrically conductive manner and can be connected to an electrically conductive structure. The contacting device includes an adhesion element. The adhesion element is connected to the contact element in firmly bonded manner and wherein the adhesion element includes an adhesion promoter in order to form a firmly bonded connection at least to the first surface of the base body.Type: ApplicationFiled: December 27, 2018Publication date: July 4, 2019Applicant: Heraeus Deutschland GmbH & Co. KGInventors: Robert Dittmer, Ulrich Hausch, Ilias Nikolaidis, Jens Trötzschel
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Patent number: 10293172Abstract: One aspect relates to a feedthrough system. The feedthrough system includes a feedthrough and a wire. At least a portion of the feedthrough is made of an insulator and at least one area forming an electrically conductive cermet pathway. The cermet pathway may include an electrically conductive metal. The wire may be at least partially connected to the cermet pathway so that the material of the wire forms a joint microstructure with the electrically conductive material in the cermet pathway.Type: GrantFiled: April 4, 2017Date of Patent: May 21, 2019Assignee: Heraeus Deutschland GmbH & Co. KGInventors: Robert Dittmer, Senthil Kumar Balasubramanian, Leoni Wilhelm, Thomas Schmitt, Thorsten Kaiser, Tim Asmus
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Patent number: 10286219Abstract: One aspect relates to an apparatus includes a ceramic body including a first surface and a further surface. The first surface is opposite the further surface, the first surface includes a first opening. The further surface includes a further opening. The first opening and the further opening are connected by a tunnel, which at least partly includes a tunnel filling and is occluded by the tunnel filling. The tunnel filling includes a first constituent, including a cermet, and a second constituent. The first and second constituents are electroconductingly connected to one another. The first constituent has a first electrical conductivity and the second constituent has a second electrical conductivity, which differs from the first by at least 5·10?4 Siemens per meter (S/m). The ceramic body is characterized by a further electrical conductivity. The first electrical conductivity is more by at least 1·105 Siemens per meter (S/m) than the 15 further electrical conductivity.Type: GrantFiled: August 17, 2017Date of Patent: May 14, 2019Assignee: Heraeus Deutschland GmbH & Co. KGInventors: Ilias Nikolaidis, Frederik Roth, Ulrich Hausch, Robert Dittmer, Jacqueline Gebhardt, Sandra Sauer
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Publication number: 20190105431Abstract: One aspect relates to a composite, including a ceramic body having a first layer surface and a second layer surface and at least one cermet conductor that electrically connects the surfaces. The composite includes a first layer with the first layer surface, a first ceramic, a first hole and a first cermet element in the first hole, a second layer with the second layer surface, a second ceramic, a second hole and a second cermet element in the second hole, and an intermediate layer that is located between the first and the second layer. The intermediate layer includes an intermediate layer ceramic, an intermediate hole and one intermediate cermet element in the intermediate hole. A projection of the cross-section of the first hole and a projection of the cross section of the second hole onto a plane Px,y are arranged offset to each other.Type: ApplicationFiled: October 4, 2018Publication date: April 11, 2019Applicant: Heraeus Deutschland GmbH & Co. KGInventors: Robert DITTMER, Ulrich HAUSCH, Jens TRÖTZSCHEL, Peter HERZOG, Josef ROTH
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Patent number: 10212836Abstract: One aspect relates to an electrical bushing for a medically implantable device, including an electrically insulating base body and an electrical conducting element. The conducting element includes a cermet, and the base body and the conducting element are connected by a sintered bond with a hermetic seal against the base body. The conducting element extends from a first surface of the base body through the base body to a second surface of the base body. The conducting element has first and second electrically conductive areas, and at least one of the electrically conductive areas is at least partially superimposed by a layer-like contact element, including a metal, so that the conducting element is connected in an electroconductive manner via the contact element. The contact element is an electrochemically created layer, such that it has a porous structure, wherein the porosity of the contact element is not more than 20%.Type: GrantFiled: January 19, 2018Date of Patent: February 19, 2019Assignee: Heraeus Deutschland GmbH & Co. KGInventors: Robert Dittmer, Frank Krüger
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Publication number: 20180339149Abstract: One aspect relates to a multi-contact electrode, a method for manufacturing a multi-contact electrode, and a use of such multi-directional multi-contact electrode. The multi-contact electrode includes a support structure and a plurality of electrically conductive electrode segments. The support structure is made of a ceramic material. The electrode segments are made of a cermet material and are supported by the support structure. The electrode segments are distributed over an outer surface of the multi-contact electrode to form a multi-directional multi-contact electrode.Type: ApplicationFiled: May 23, 2018Publication date: November 29, 2018Applicant: Heraeus Deutschland GmbH & Co. KGInventors: Robert DITTMER, Ulrich HAUSCH, Jens TRÖTZSCHEL
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Publication number: 20180318589Abstract: One aspect relates to a biocompatible composite system, an implantable medical device, and a manufacturing method for a biocompatible composite system. The biocompatible composite system includes a printed multi-layer circuit board and a feedthrough. The circuit board includes at least one electrically conductive via. The feedthrough includes an insulating ceramic base material and at least one electrically conductive cermet pathway. The pathway is embedded into the base material to form an electrically conductive and hermetically sealed connection to the via of the circuit board. The feedthrough and the circuit board are integrated into one composite part.Type: ApplicationFiled: May 1, 2018Publication date: November 8, 2018Applicants: Heraeus Deutschland GmbH & Co. KG, Heraeus Quartz America LLCInventors: Matthew Joseph DONELON, Robert DITTMER, Ulrich HAUSCH, Jens TROETZSCHEL
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Publication number: 20180213665Abstract: One aspect relates to an electrical bushing for a medically implantable device, including an electrically insulating base body and an electrical conducting element. The conducting element includes a cermet, and the base body and the conducting element are connected by a sintered bond with a hermetic seal against the base body. The conducting element extends from a first surface of the base body through the base body to a second surface of the base body. The conducting element has first and second electrically conductive areas, and at least one of the electrically conductive areas is at least partially superimposed by a layer-like contact element, including a metal, so that the conducting element is connected in an electroconductive manner via the contact element. The contact element is an electrochemically created layer, such that it has a porous structure, wherein the porosity of the contact element is not more than 20%.Type: ApplicationFiled: January 19, 2018Publication date: July 26, 2018Applicant: Heraeus Deutschland GmbH & Co. KGInventors: Robert DITTMER, Frank KRÜGER
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Publication number: 20180050212Abstract: One aspect relates to an apparatus comprising a ceramic body including a first surface and a further surface. The first surface is opposite the further surface, the first surface includes a first opening. The further surface includes a further opening. The first opening and the further opening are connected by a tunnel, which at least partly includes a tunnel filling and is occluded by the tunnel filling. The tunnel filling includes a first constituent, including a cermet, and a second constituent. The first and second constituents are electroconductingly connected to one another. The first constituent has a first electrical conductivity and the second constituent has a second electrical conductivity, which differs from the first by at least 5·104 S/m. The ceramic body is characterized by a further electrical conductivity. The first electrical conductivity is more by at least 1·105 S/m than the further electrical conductivity.Type: ApplicationFiled: August 17, 2017Publication date: February 22, 2018Applicant: Heraeus Deutschland GmbH & Co. KGInventors: Ilias Nikolaidis, Frederik Roth, Ulrich Hausch, Robert Dittmer, Jacqueline Gebhardt, Sandra Sauer
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Publication number: 20170291033Abstract: One aspect relates to a feedthrough system. The feedthrough system includes a feedthrough and a wire. At least a portion of the feedthrough is made of an insulator and at least one area forming an electrically conductive cermet pathway. The cermet pathway may include an electrically conductive metal. The wire may be at least partially connected to the cermet pathway so that the material of the wire forms a joint microstructure with the electrically conductive material in the cermet pathway.Type: ApplicationFiled: April 4, 2017Publication date: October 12, 2017Applicant: Heraeus Deutschland GmbH & Co. KGInventors: Robert DITTMER, Senthil Kumar BALASUBRAMANIAN, Leoni WILHELM, Thomas SCHMITT, Thorsten KAISER, Tim ASMUS