Abstract: A spring guide retainer is provided for preventing buckling of a spring during spring compression as an upper die moves toward a lower die in a stamping operation. The spring guide retainer comprises a spring guide housing to hold the spring location, a spring guide holder fixed to the upper die to promote spring alignment, and a spring guide pin to maintain alignment of the spring. A screw associated with the spring guide pin is receivable through a pocket of the spring guide housing to secure the spring guide pin and the spring guide housing to the pad.