Patents by Inventor Robert E. Belke
Robert E. Belke has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6977337Abstract: The present invention provides an assembly for protecting automotive electronics. The assembly includes a circuit board, a cover, and a metal housing. The metal housing is disposed over and around the circuit board. The cover and metal housing are crimped together to create a seal that protects the circuit board inside the metal housing and attaches the cover to the metal housing.Type: GrantFiled: June 16, 2004Date of Patent: December 20, 2005Assignee: Visteon Global Technologies, Inc.Inventors: Anthony Nicolo Satullo, Robert E. Belke, Hong Zhou, Diane M. Jett, Bertrand R. Mohr, John Trublowski, Michael S. Schulke, Adam W. Schubring
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Patent number: 6752015Abstract: The present invention involves a device for detecting a condition of a flowing fluid within a vehicle having reduced sulfur ingress. The device includes a base plate having a receiving surface and a circumferential edge and a printed circuit board disposed on the receiving surface of the base plate. The device further includes a housing having peripheral side walls attaching to the receiving surface adjacent the circumferential edge to define a peripheral interface enclosing the printed circuit board within the housing. The device further includes an adhesive material disposed at the interface to adhere the housing to the base plate. The adhesive material has a predetermined thermal expansion coefficient and a predetermined elastic modulus to reduce fluid ingress through the interface and to accommodate thermal expansions of the base plate and the housing.Type: GrantFiled: September 24, 2002Date of Patent: June 22, 2004Assignee: Visteon Global Technologies, Inc.Inventors: David J. Thompson, Robert E. Belke, Jr., Edward P. McLeskey
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Publication number: 20040055376Abstract: The present invention involves a device for detecting a condition of a flowing fluid within a vehicle having reduced sulfur ingress. The device includes a base plate having a receiving surface and a circumferential edge and a printed circuit board disposed on the receiving surface of the base plate. The device further includes a housing having peripheral side walls attaching to the receiving surface adjacent the circumferential edge to define a peripheral interface enclosing the printed circuit board within the housing. The device further includes an adhesive material disposed at the interface to adhere the housing to the base plate. The adhesive material has a predetermined thermal expansion coefficient and a predetermined elastic modulus to reduce fluid ingress through the interface and to accommodate thermal expansions of the base plate and the housing.Type: ApplicationFiled: September 24, 2002Publication date: March 25, 2004Applicant: VISTEON GLOBAL TECHNOLOGIES, INC.Inventors: David J. Thompson, Robert E. Belke, Edward P. McLeskey
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Patent number: 6613239Abstract: A method 10 for making multi-layer electronic circuit boards having metallized apertures 34, 36 which may be selectively and electrically grounded or isolated from an electrical ground plane.Type: GrantFiled: April 17, 2001Date of Patent: September 2, 2003Assignee: Visteon Global Tech., Inc.Inventors: Andrew Z. Glovatsky, Robert E. Belke, Delin Li, Lakhi N. Goenka, Mohan R. Paruchuri, Marc A. Straub, Richard K. McMillan, Ram S. Raghava, Thomas B. Krautheim, Michael A. Howey, Vivek A. Jairazbhoy
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Publication number: 20020148809Abstract: A method 10 for making multi-layer electronic circuit boards having metallized apertures 34, 36 which may be selectively and electrically grounded or isolated from an electrical ground plane.Type: ApplicationFiled: April 17, 2001Publication date: October 17, 2002Inventors: Andrew Z. Glovatsky, Robert E. Belke, Delin Li, Lakhi N. Goenka, Mohan R. Paruchuri, Marc A. Straub, Richard K. McMillan, Ram S. Raghava, Thomas B. Krautheim, Michael A. Howey, Vivek A. Jairazbhoy
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Patent number: 6449839Abstract: A method for forming connections within a multi-layer electronic circuit board 10. In one non-limiting embodiment, the method includes selectively forming air bridges over portions of the circuit board 10 and selectively collapsing the air bridges with a metallurgical bonding tool, effective to interconnect layers of the circuit board 10.Type: GrantFiled: September 6, 2000Date of Patent: September 17, 2002Assignee: Visteon Global Tech., Inc.Inventors: Andrew Z. Glovatsky, Thomas Krautheim, Robert E. Belke, Jr., Vivek Amir Jairazbhoy, Cuong V. Pham
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Patent number: 5738797Abstract: A three dimensional multi-layer circuit structure is formed by partially etching a foil having a coating. A pre-circuit is formed by providing a metal foil, applying a photodefinable photoresist to each side of the metal foil, selectively exposing and developing the photoresist leaving exposed areas and unexposed areas and, plating the unexposed areas with a second metal. The pre-circuit is placed in an etching solution and removed after the etching solution partially etches the metal foil to undercut the second metal. The partially etched pre-circuit is then bent into a predetermined shape. The partially etched pre-circuit is then inserted into a mold cavity so that at least one surface of the circuit structure is adjacent to the mold. The mold is filled with a polymer resin so that the polymer resin encapsulates at least a portion of the partially etched pre-circuit and substantially fills the undercut.Type: GrantFiled: May 17, 1996Date of Patent: April 14, 1998Assignee: Ford Global Technologies, Inc.Inventors: Robert E. Belke, Jr., Michael G. Todd, Andrew Z. Glovatsky, Alice D. Zitzmann
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Patent number: 5579573Abstract: Method for fabricating an undercoated chip electrically interconnected to a substrate. The method includes the initial step of depositing a predetermined quantity of a liquid undercoat material onto the chip or the substrate. The method continues with the step of interconnecting the chip to the substrate so as to form an electrical interconnection bond therebetween. Finally, the method concludes with the step of heating, reflowing and curing the undercoat material during or after the step of electrically interconnecting the chip to the substrate.Type: GrantFiled: October 11, 1994Date of Patent: December 3, 1996Assignee: Ford Motor CompanyInventors: Jay D. Baker, Cuong V. Pham, Robert E. Belke, Jr.
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Patent number: 4876120Abstract: Disclosed are improved laminates useful in the manufacture of multi-layer printed wiring boards (MLPWB) and laminates. Such improved composites contain at least one layer which is formed from a liquid crystal polymer selected from the group consisting of poly(para-phenylene benzobisthiazole), poly(paraphenylene benzobisoxazole), poly(2,5-benzothiazole), poly(2,5-benzoxazole), and mixtures thereof. The presently preferred liquid crystal polymer comprises poly(para-phenylene benzobisthiazole). The negative coefficient of thermal expansion and high modulus of elasticity of the liquid crystal polymers enable a laminate and MLPWB to be manufactured therefrom having a tailored coefficient of thermal expansion, broadly ranging from about 0 to 15 ppm/.degree. C. MLPWBs constructed of polymeric core layers also are possible utilizing the preferred liquid crystal polymers of the present invention.Type: GrantFiled: April 21, 1987Date of Patent: October 24, 1989Assignee: General Electric CompanyInventors: Robert E. Belke, Louis Zakraysek, Walter O. Pillar
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Patent number: 4806704Abstract: The invention relates to a metal matrix composite used to support and/or enclose discrete electronic semiconductor devices, monolithic integrated circuits, hybrid circuits, and multi-layer printed wiring boards. The matrices herein disclosed employ aluminum as the matrix with Beta Eucryptite as the additive in a volume percent of up to 60. The preferred range of from 55 to 45 percent by volume of the additive has a coefficient of thermal expansion matching the common semiconductor materials and common ceramics used for electronic enclosures. The composite uses low cost materials, and due to the affinity of the additive to aluminum is easily prepared. The resulting structures have good thermal conductivity and low weight.Type: GrantFiled: June 8, 1987Date of Patent: February 21, 1989Assignee: General Electric CompanyInventors: Robert E. Belke, Jr., George F. Trojanowski, Louis Zakraysek
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Patent number: 4679122Abstract: A novel metal core printed circuit board and a method of making it are described. The circuit board comprises a metal substrate, a patternable metal foil, and an insulating layer of thermoplastic resin whose glass transition temperature is exceeded during assembly under pressure to bond the resin to the metal substrate and to the foil by high temperature wetting. The circuit board also provides holes whose interior is lined with a resin united fusing to the resin in the insulating layer by high temperature wetting accompanied by pressure. The thermoplastic resin is a polyetherimide engineering plastic. The layers of the printed circuit board described above, including any additional layers of insulating resin and foil, may be bonded in a single step in a laminating press.Type: GrantFiled: July 11, 1986Date of Patent: July 7, 1987Assignee: General Electric CompanyInventors: Robert E. Belke, Jr., Raymond A. Shirk, Hsiu H. Lin, Louis Zakraysek
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Patent number: 4466874Abstract: The invention deals with a method of electroding a poly(vinylidene fluoride) solid in a piezoelectric application. The electroding method entails surface preparation of the poly(vinylidene fluoride) by a variety of steps including plasma etching to create temporary molecular scale surface irregularities followed by sputtering a metallic layer before deterioration of the plasma etched surface. The chromium may be the initial metal sputtered, followed by a sputtered copper layer, followed in turn by at least one heavier electrodeposited conductive layer. The method may be conducted without deterioration of the piezoelectric properties of the material. The method has been found to provide very good adhesion between the electrode and the PVF.sub.2 surface.Type: GrantFiled: September 29, 1983Date of Patent: August 21, 1984Assignee: General Electric CompanyInventors: Robert E. Belke, Jr., Richard J. Hill, Raymond A. Shirk, David P. Smith
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Patent number: 4465547Abstract: The invention deals with a method of bonding a poly(vinylidene fluoride) solid to a variety of solid substrates, in an application typically using the piezoelectric properties of the material. The bonding method entails surface preparation of the poly(vinylidene fluoride) by a variety of steps including activation of the surface by plasma etching to cause the surface to wet the adhesive used in the bonding process. The bonding method produces bonds of increased strength and having good electrical properties.Type: GrantFiled: September 29, 1983Date of Patent: August 14, 1984Assignee: General Electric CompanyInventors: Robert E. Belke, Jr., Raymond A. Shirk