Patents by Inventor Robert E. Belland
Robert E. Belland has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6159772Abstract: A method for soldering a first component having a metal surface to a second component having a metal surface includes holding the metal surface of the first component in a position above a placement area on the metal surface of the second component to establish a gap between the surfaces. The method further includes reflowing solder within the gap. A structure including a thermally conductive baseplate, an electrical insulator attached to the baseplate, and a metallic shield mounted on the insulator. The structure also includes an integrated power device having a power-dissipating electronic device, and a first metal layer connected to the shield through a solder joint. A substrate includes an aperture, and the integrated power device is mounted with the power-dissipating device sitting within the aperture. The substrate also includes a conductive run electrically connected to a second metal layer of the integrated power device.Type: GrantFiled: June 3, 1998Date of Patent: December 12, 2000Assignee: VLT CorporationInventors: Patrizio Vinciarelli, Robert E. Belland, George J. Ead, Fred M. Finnemore, Lance L. Andrus
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Patent number: 6119923Abstract: A method for soldering a first component having a metal surface to a second component having a metal surface includes holding the metal surface of the first component in a position above a placement area on the metal surface of the second component to establish a gap between the surfaces. The method further includes reflowing solder within the gap.A structure including a thermally conductive baseplate, an electrical insulator attached to the baseplate, and a metallic shield mounted on the insulator. The structure also includes an integrated power device having a power-dissipating electronic device, and a first metal layer connected to the shield through a solder joint. A substrate includes an aperture, and the integrated power device is mounted with the power-dissipating device sitting within the aperture. The substrate also includes a conductive run electrically connected to a second metal layer of the integrated power device.Type: GrantFiled: June 3, 1998Date of Patent: September 19, 2000Assignee: VLT CorporationInventors: Patrizio Vinciarelli, Robert E. Belland, George J. Ead, Fred M. Finnemore, Lance L. Andrus
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Patent number: 6096981Abstract: A structure including a thermally conductive baseplate, an electrical insulator attached to the baseplate, and a metallic shield mounted on the insulator is set forth. The structure also includes an integrated power device having a power-dissipating electronic device, and a first metal layer connected to the shield through a solder joint. A substrate includes an aperture, and the integrated power device is mounted with the power-dissipating device sitting within the aperture. The substrate also includes a conductive run electrically connected to a second metal layer of the integrated power device. A further structure including an electrical conductor and a sheet of conductive material including a punt soldered to the electrical conductor is presented.Type: GrantFiled: June 3, 1998Date of Patent: August 1, 2000Assignee: VLT CorporationInventors: Patrizio Vinciarelli, Robert E. Belland, George J. Ead, Fred M. Finnemore, Lance L. Andrus
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Patent number: 5906310Abstract: A method for soldering a first component having a metal surface to a second component having a metal surface includes holding the metal surface of the first component in a position above a placement area on the metal surface of the second component to establish a gap between the surfaces. The method further includes reflowing solder within the gap.A structure including a thermally conductive baseplate, an electrical insulator attached to the baseplate, and a metallic shield mounted on the insulator. The structure also includes an integrated power device having a power-dissipating electronic device, and a first metal layer connected to the shield through a solder joint. A substrate includes an aperture, and the integrated power device is mounted with the power-dissipating device sitting within the aperture. The substrate also includes a conductive run electrically connected to a second metal layer of the integrated power device.Type: GrantFiled: September 5, 1995Date of Patent: May 25, 1999Assignee: VLT CorporationInventors: Patrizio Vinciarelli, Robert E. Belland, George J. Ead, Fred M. Finnemore, Lance L. Andrus
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Patent number: 5808358Abstract: A method for soldering a first component having a metal surface to a second component having a metal surface includes holding the metal surface of the first component in a position above a placement area on the metal surface of the second component to establish a gap between the surfaces. The method further includes reflowing solder within the gap.A structure including a thermally conductive baseplate, an electrical insulator attached to the baseplate, and a metallic shield mounted on the insulator. The structure also includes an integrated power device having a power-dissipating electronic device, and a first metal layer connected to the shield through a solder joint. A substrate includes an aperture, and the integrated power device is mounted with the power-dissipating device sitting within the aperture. The substrate also includes a conductive run electrically connected to a second metal layer of the integrated power device.Type: GrantFiled: September 19, 1996Date of Patent: September 15, 1998Assignee: VLT CorporationInventors: Patrizio Vinciarelli, Robert E. Belland, George J. Ead, Fred M. Finnemore, Lance L. Andrus
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Patent number: 4000393Abstract: A method of assembling, positioning, and making connections to a thermal printhead is disclosed. A substrate is provided upon which heating elements or mesas are mounted. Leads from these heating elements are continued on the same side of the substrate as the one on which the elements are located. The leads are brought to terminal pads where connections may be made to the logic circuit which selectively energizes the heating elements to form numerals or characters on heat sensitive paper. A flat flexible cable with conductor ends exposed is held in place so that the exposed conductor ends make contact with the terminal pads of one or more of such substrates. The substrates and cable are clamped together by two metal plates. This entire assembly is mounted on a spring-loaded pivot arrangement so as to hold the heating elements against the heat sensitive paper on an advancing platen. Connections may be made between the cable conductors and the printing logic to allow the heating elements to be energized.Type: GrantFiled: August 29, 1974Date of Patent: December 28, 1976Assignee: Texas Instruments IncorporatedInventors: Michael J. Cochran, Larry D. Propst, Richard D. Harris, Robert E. Belland, John W. Richardson, Stephen P. Hamilton