Patents by Inventor Robert E. Braun

Robert E. Braun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240181008
    Abstract: The present invention generally relates to uses of glial cell line-derived growth factor (GDNF) in cutaneous wound healing and hair growth. Methods of effecting hair growth and/or wound healing which feature administration of GDNF, or a biologically active fragment thereof, to subjects, e.g., human subject, are disclosed herein. The invention relates also to formulations and kits for achieving the indicated pharmaceutical advantages.
    Type: Application
    Filed: December 5, 2023
    Publication date: June 6, 2024
    Applicant: The Jackson Laborartory
    Inventors: Robert E. Braun, Manju Sharma
  • Patent number: 11890322
    Abstract: The present invention generally relates to uses of glial cell line-derived growth factor (GDNF) in cutaneous wound healing and hair growth. Methods of effecting hair growth and/or wound healing which feature administration of GDNF, or a biologically active fragment thereof, to subjects, e.g., human subject, are disclosed herein. The invention relates also to formulations and kits for achieving the indicated pharmaceutical advantages.
    Type: Grant
    Filed: July 13, 2021
    Date of Patent: February 6, 2024
    Assignee: The Jackson Laboratory
    Inventors: Robert E. Braun, Manju Sharma
  • Publication number: 20220062381
    Abstract: The present invention generally relates to uses of glial cell line-derived growth factor (GDNF) in cutaneous wound healing and hair growth. Methods of effecting hair growth and/or wound healing which feature administration of GDNF, or a biologically active fragment thereof, to subjects, e.g., human subject, are disclosed herein. The invention relates also to formulations and kits for achieving the indicated pharmaceutical advantages.
    Type: Application
    Filed: July 13, 2021
    Publication date: March 3, 2022
    Applicant: The Jackson Laboratory
    Inventors: Robert E. Braun, Manju Sharma
  • Publication number: 20200147174
    Abstract: The present invention generally relates to uses of glial cell line-derived growth factor (GDNF) in cutaneous wound healing and hair growth. Methods of effecting hair growth and/or wound healing which feature administration of GDNF, or a biologically active fragment thereof, to subjects, e.g., human subject, are disclosed herein. The invention relates also to formulations and kits for achieving the indicated pharmaceutical advantages.
    Type: Application
    Filed: June 25, 2019
    Publication date: May 14, 2020
    Inventors: Robert E. BRAUN, Manju SHARMA
  • Publication number: 20190307846
    Abstract: The present invention generally relates to uses of glial cell line-derived growth factor (GDNF) in cutaneous wound healing and hair growth. Methods of effecting hair growth and/or wound healing which feature administration of GDNF, or a biologically active fragment thereof, to subjects, e.g., human subject, are disclosed herein. The invention relates also to formulations and kits for achieving the indicated pharmaceutical advantages.
    Type: Application
    Filed: June 25, 2019
    Publication date: October 10, 2019
    Inventors: Robert E. BRAUN, Manju SHARMA
  • Patent number: 10376562
    Abstract: The present invention generally relates to uses of glial cell line-derived growth factor (GDNF) in cutaneous wound healing and hair growth. Methods of effecting hair growth and/or wound healing which feature administration of GDNF, or a biologically active fragment thereof, to subjects, e.g., human subject, are disclosed herein. The invention relates also to formulations and kits for achieving the indicated pharmaceutical advantages.
    Type: Grant
    Filed: March 14, 2014
    Date of Patent: August 13, 2019
    Assignee: The Jackson Laboratory
    Inventors: Robert E. Braun, Manju Sharma
  • Publication number: 20160022773
    Abstract: The present invention generally relates to uses of glial cell line-derived growth factor (GDNF) in cutaneous wound healing and hair growth. Methods of effecting hair growth and/or wound healing which feature administration of GDNF, or a biologically active fragment thereof, to subjects, e.g., human subject, are disclosed herein. The invention relates also to formulations and kits for achieving the indicated pharmaceutical advantages.
    Type: Application
    Filed: March 14, 2014
    Publication date: January 28, 2016
    Inventors: Robert E. BRAUN, Manju SHARMA
  • Publication number: 20020067389
    Abstract: For the formation of colored pixels on a substrate, a print head can be used which performs a forward and return movement in relation to the substrate and which has a number of ink nozzles, in which the different ink nozzles can produce ink droplets of different colors. A print head which, in the direction of the first movement, comprises at least two parallel rows of at least two ink nozzles can be used. Preceding the printing step the printing method comprises the step of entailing the allocation in each case of two neighboring colors in a color space to ink nozzles of different rows, and black either to one or more ink nozzles of a separate row or to the first ink nozzle and last ink nozzle of the same row.
    Type: Application
    Filed: January 11, 2002
    Publication date: June 6, 2002
    Inventors: Robert E.A. Braun, Petrus L.J. Welten, Jan J. Boomgaardt, Fulgencio Arjona-Gomez
  • Publication number: 20020060718
    Abstract: In a method for the formation with a print head on a substrate of pixels with a predefined pixel colour by means of droplet deposition, a print head is used which is set up so that, during operation, it performs in one pass a forward and return movement in relation to the substrate. The print head comprises ink nozzles which are aligned in a row behind one another in the direction of movement of the print head, which row comprises an initial series and a final series of ink nozzles, for at least two different first colours, and also a middle series of ink nozzles for at least two different additional colours, which additional colours cannot be formed from the first colours. The method comprises the steps of printing a pixel with a predefined pixel colour by the successive deposition of ink droplets of colours from the row of ink nozzles, in which black is composed as the first and/or the last colour with the aid of ink droplets of the first colours from the ink nozzles.
    Type: Application
    Filed: January 11, 2002
    Publication date: May 23, 2002
    Inventors: Petrus L.J. Welten, Robert E.A. Braun, Fulgencio Arjona-Gomez
  • Patent number: 5031025
    Abstract: An individual integrated circuit package utilizing an intermediate die carrier having legs in contact with a wiring substrate and a compatible lid to effect hermeticity. More specifically, the carrier includes on its outer surface a raised section and a peripheral ledge. The cap is formed with a cutout in its closed extremity to accommodate the raised carrier section and the portions of the cap adjacent the cutout rest upon and are sealed to the carrier ledge. The rim of the cap at its open extremity contacts and is sealed to the substrate to form the completed hermetic package.
    Type: Grant
    Filed: February 20, 1990
    Date of Patent: July 9, 1991
    Assignee: Unisys Corporation
    Inventors: Robert E. Braun, Ronald T. Gibbs
  • Patent number: 4987478
    Abstract: An hermetic integrated circuit package having a single die wherein wire connections to area pads on the active face of the die are carried through an hermetic boundary comprised of a cover plate to an external interface with the next succeeding interconnect level. The package is comprised of a heat exchange element to which the die is attached, a cover plate having holes homologously positioned with respect to the area pads on the die and a seal ring for joining the heat exchange element to the cover plate. The wire connections which are carried through the holes and sealed to the cover plate are externally accessible.
    Type: Grant
    Filed: February 20, 1990
    Date of Patent: January 22, 1991
    Assignee: Unisys Corporation
    Inventors: Robert E. Braun, Ronald T. Gibbs
  • Patent number: 4510446
    Abstract: The present disclosure describes test coupons having predetermined respective test patterns, formed in a multilayer printed circuit board simultaneously with the fabrication of the latter. The test coupons are probed with conventional electrical instruments to provide information as to the occurrence of a misregistration of any given subsurface printed plane or trace, whether or not the misregistration exceeds a specified limit, and if desired, a measure of the degree of misregistration. The foregoing are readily accomplished in a time and cost efficient manner without the need for cross-sectioning portions of the board and the visual observation of the subsurface printed layers.
    Type: Grant
    Filed: November 3, 1982
    Date of Patent: April 9, 1985
    Assignee: Burroughs Corporation
    Inventors: Robert E. Braun, John E. Benasutti
  • Patent number: 4338621
    Abstract: The present disclosure describes an hermetically sealed integrated circuit package capable of accommodating high density circuit configurations with their attendant high power levels. In performing this function, the package permits the back-bonded integrated circuit chip or die to be mounted to a thermally conductive member of the package which is disposed in an open air stream. Moreover, the opposite side of the package positioned in proximity to the interconnection medium remains available to be fully populated by a large number of closely spaced input/output pins.
    Type: Grant
    Filed: February 4, 1980
    Date of Patent: July 6, 1982
    Assignee: Burroughs Corporation
    Inventor: Robert E. Braun
  • Patent number: 3955867
    Abstract: A connector or receptacle is described for connecting a leadless integrated circuit package to an interconnection medium such as a printed circuit board without the need for soldering connections. A significant feature of the connector is that all of its electrical contacts may be engaged or probed individually or collectively from the package side of the interconnection board for diagnostic and test purposes. Probe means suitable for use with the connector are also described.
    Type: Grant
    Filed: October 9, 1974
    Date of Patent: May 11, 1976
    Assignee: Burroughs Corporation
    Inventors: Robert E. Braun, George J. Sprenkle
  • Patent number: 3946276
    Abstract: A system is described which provides for high density packaging of electronic equipment, particularly data processing systems. Subnanosecond integrated circuits of the LSI or MSI type in pluggable packages are adapted to be installed in receptacles or connectors. A cooling frame is provided which supports the package connectors as well as the package-to-package interconnection medium. In accordance with the system, groups of integrated circuit packages logically partitioned into functional elements and having, for example, gate complexities of the order of four thousand to ten thousand gates, comprise an island. The system may be expanded further by interconnecting several islands.
    Type: Grant
    Filed: October 9, 1974
    Date of Patent: March 23, 1976
    Assignee: Burroughs Corporation
    Inventors: Robert E. Braun, Richard H. Jones, George J. Sprenkle, Herbert Stopper
  • Patent number: 3942854
    Abstract: A hold down device is described for applying a high clamping force to a "leadless" integrated circuit package installed in a suitable connector. Use of the device results in reliable electrical connections between the package circuit leads and the connector contact elements; and reliable thermal connections between the package carrier and a cooling frame provided to dissipate the heat generated by the integrated circuits. The hold down device has added system utility in the clamping of an interconnect cable assembly adapted to plug into the aforementioned connector in lieu of the integrated circuit package.
    Type: Grant
    Filed: October 9, 1974
    Date of Patent: March 9, 1976
    Assignee: Burroughs Corporation
    Inventors: Peter P. Klein, Robert E. Braun