Abstract: A heat pipe system including a heat transfer block and a heat pipe coupled to the heat transfer block by a clip. By utilizing a clip to couple the heat pipe to the heat transfer block, a higher degree of thermal coupling may be achieved, thereby allowing more heat to be transferred from the heat transfer block to the heat pipe. The heat pipe system has particular application in transferring heat away from heat-producing electronic components, such as computer chips.

Abstract: A heat pipe system including a heat transfer block and a heat pipe coupled to the heat transfer block by a clip. By utilizing a clip to couple the heat pipe to the heat transfer block, a higher degree of thermal coupling may be achieved, thereby allowing more heat to be transferred from the heat transfer block to the heat pipe. The heat pipe system has particular application in transferring heat away from heat-producing electronic components, such as computer chips.

Abstract: A heat dissipation structure for electronics including a first heat sink for dissipating heat produced by a first processing unit (e.g., a Central Processing Unit (CPU)), a second heat sink for dissipating heat produced by a second processing unit (e.g., a Graphics Processing Unit (GPU)) and, a heat pipe interconnecting the first and second heat sinks. By connecting the CPU and GPU heat sinks, heat generated by the GPU can be transferred to the CPU where it can be more effectively cooled.

Abstract: A heat pipe system including a heat transfer block and a heat pipe coupled to the heat transfer block by a clip. By utilizing a clip to couple the heat pipe to the heat transfer block, a higher degree of thermal coupling may be achieved, thereby allowing more heat to be transferred from the heat transfer block to the heat pipe. The heat pipe system has particular application in transferring heat away from heat-producing electronic components, such as computer chips.

Abstract: The invention is an apparatus for cooling a portable computer while it is attached to a docking station. Heat transfer surfaces on simple thermally conductive plates are attached to heat pipes in both the portable computer and the docking station, and the installation of the portable computer into the docking station is arranged to put the two heat transfer surfaces into thermally conductive contact. With the portable computer heat pipe attached to a heat generating component and the docking station heat pipe attached to a heat sink, heat is transferred to the heat sink through the heat transfer surfaces when they are in contact. The heat sink can be fan cooled, and the fan can be arranged to discharge through either the back or side of the docking station. The heat transfer surface of the portable computer also functions as a cooling surface when the portable computer is detached from the docking station.

Abstract: The invention is an apparatus for cooling a portable computer while it is attached to a docking station. Heat transfer surfaces on simple thermally conductive plates are attached to heat pipes in both the portable computer and the docking station, and the installation of the portable computer into the docking station is arranged to put the two heat transfer surfaces into thermally conductive contact. With the portable computer heat pipe attached to a heat generating component and the docking station heat pipe attached to a heat sink, heat is transferred to the heat sink through the heat transfer surfaces when they are in contact. The heat sink can be fan cooled, and the fan can be arranged to discharge through either the back or side of the docking station. The heat transfer surface of the portable computer also functions as a cooling surface when the portable computer is detached from the docking station.

Abstract: A heat sink assembly having a base formed through an injection molding process utilizing high conductivity plastic in which both the heat pipe and the cooling fins are over-molded into the base to form an integral assembly. The heat pipe is of known construction that operates to transfer heat from a source to a remote location for dissipation. The cooling fins are preferably of the folded fin array configuration and are embedded into the top surface of the heat sink base. A cooling fan can be mounted to the assembly to draw air across the folded fin array for dissipation of the heat conducted efficiently from the heat pipe into the heat sink, including the folded fin array. The thermal resistance of the heat sink is improved as the interface resistance and the spreading resistance between the heat pipe and the cooling fins are substantially reduced.

Abstract: The present invention relates to a threaded member incorporating structural features which prevents more than a required amount of torque or rotational force to be applied thereto. More particularly, the shaft of the threaded member is hollow and slotted so that it buckles or collapses inwardly when the member bottoms out.

Abstract: The invention disclosed herein is a pin and socket connector having a low insertion force and a high resistance to tensile forces. More particularly, the pin, which is composed of spring beam members, and the socket, have complementary locking teeth and grooves and also cooperating means for releasing the spring beam members into locking engagement with the socket.