Abstract: A representative embodiment of the invention provides a projection system having a laser source that incorporates a tunable liquid lens and a spatial light modulator adapted to modulate light generated by the laser source to project an image on a viewing screen. The tunable liquid lens is adapted to vary focal length, alignment or position with respect to an optical element that is external to the lens, ability to diffuse light, and/or polarization rotation angle.

Abstract: A representative embodiment of the invention provides a projection system having a laser source that incorporates a tunable liquid lens and a spatial light modulator adapted to modulate light generated by the laser source to project an image on a viewing screen. The tunable liquid lens is adapted to vary focal length, alignment or position with respect to an optical element that is external to the lens, ability to diffuse light, and/or polarization rotation angle.

Abstract: An improved fiber administration system and method of operation for a fiber distribution system. The fiber administration system contains at least one frame, wherein each frame contains a plurality of fiber distribution shelves. The different fiber distribution shelves contain numerous optical connector ports. The various optical connector ports are interconnected throughout the fiber distribution system with optical fibers. The optical fiber pass through numerous routing pathways on the frame as they travel between points on the frame. A plurality of lights are disposed on the frame proximate the different routing pathways. A controller is provided to selectively light some of the lights that correspond in position to one selected routing pathway, among the numerous possible routing pathways. The light thereby provides a visual indication of a specific routing path.

Abstract: An apparatus may be used to deposit metal or conductive layers upon semiconductor wafers using an electrochemical process. The apparatus comprises a housing for retaining a first electrode (e.g., anode) and a second electrode (e.g., cathode), in a fixed spaced-apart relation to each other, with the surface area of the anode exceeding the surface area of the cathode (the wafer). The back surface of the wafer is mounted on a handling disk; the disk has an aperture for accessing the wafer and is held in the housing. A contact probe passes through the aperture to touch the back surface of the wafer, the probe having a spring-loaded spherical radius head for depressurizing the head as it touches the wafer. This apparatus permits a uniform current distribution as the contact probe is not interposed between the electrodes, and the larger surface area of the anode relative to the wafer enhances the production of uniform and reproducible films.