Abstract: Systems and methods are provided for depositing solder in a first pattern over a first bonding pad on the substrate; depositing solder in a second pattern over a second bonding pad on the substrate, wherein the second pattern defines a larger area than the first pattern; placing the electronic device on the substrate such that pads on the electronic device are aligned with the first and second bonding pads; and reflowing the solder between the pads on the electronic device and the first and second bonding pads, causing the solder deposited on the first bonding pad to form a first solder joint and the solder deposited on the second bonding pad to form a second solder joint. The second solder joint is larger than the first solder joint causing the electronic device to be attached at an angle relative to the substrate.

Abstract: Systems and methods are provided for depositing solder in a first pattern over a first bonding pad on the substrate; depositing solder in a second pattern over a second bonding pad on the substrate, wherein the second pattern defines a larger area than the first pattern; placing the electronic device on the substrate such that pads on the electronic device are aligned with the first and second bonding pads; and reflowing the solder between the pads on the electronic device and the first and second bonding pads, causing the solder deposited on the first bonding pad to form a first solder joint and the solder deposited on the second bonding pad to form a second solder joint. The second solder joint is larger than the first solder joint causing the electronic device to be attached at an angle relative to the substrate.

Abstract: A multi-chip module (MCM) assembly has three stacked integrated circuit (IC) layers. The first IC layer is electrically flip-chip connected to a substrate. The back of the second IC layer may be glued to the back of the first IC layer, and the second and third IC layers are electrically flip-chip connected to each other. In one embodiment, the third IC layer is electrically connected to the substrate through a vertical interconnect element for high circuit density. In another, the second IC layer is electrically connected to the substrate using wire bonding for greater post-fabrication customization flexibility. In still another embodiment, the MCM assembly comprises two stacked IC layers where the second IC layer is electrically flip-chip connected to the first IC layer and the second layer is electrically connected to the substrate through a vertical interconnect element.

Abstract: A method and a structure for reducing the stresses arising in a hybrid circuit from the interface between the encapsulant and the substrate. An additional layer, preferably of the same material as the substrate, is added to the outside surface of the encapsulant. The purpose of the layer is to provide a second opposing surface to balance and thereby reduce the stress originating from the encapsulant/substrate interface. The second layer is applied prior to the curing of the encapsulant material.