Abstract: A thermosettable (curable) epoxy resin composition including (A) a residual oligomeric product; wherein the residual oligomeric product comprises a polyfunctional aliphatic or cycloaliphatic epoxy resin which has been isolated from an epoxy resin product formed as a result of an epoxidation process comprising the reaction of (i) an aliphatic or cycloaliphatic hydroxyl-containing material with (ii) an epihalohydrin, (iii) a basic-acting substance, (iv) a non-Lewis acid catalyst, and (V) optionally one or more solvents; (B) an epoxy curing material comprising (i) an epoxy resin curing agent, (ii) an epoxy resin catalyst, or both an epoxy resin curing agent (i) and an epoxy resin catalyst (ii); and (C) optionally, an epoxy resin compound other than the aliphatic or cycloaliphatic polyfunctional epoxy resin (A). A thermoset may also be made from the above thermosettable composition.

Abstract: Embodiments include poly(allyl ether)s of polycyclopentadiene polyphenol that can be obtained by allylation of a polycyclopentadiene polyphenol, where the aromatic hydroxyl group(s) (—OH) are converted to HR1C?CR1—CH2—O— and/or H2R1C—CR1?HC—O—, where R1 is as described herein. Embodiments also include thermosettable compositions including the poly(allyl ether)s of polycyclopentadiene polyphenol and products obtained by curing the thermosettable compositions.

Abstract: Embodiments include vinylbenzyl ethers of polycyclopentadiene polyphenol that can be obtained by reacting a polycyclopentadiene polyphenol with a vinylbenzyl halide. Embodiments also include thermosettable compositions including the vinylbenzyl ethers of a polycyclopentadiene polyphenol and products obtained by curing the thermosettable compositions. Formula (I).

Abstract: A process for preparing an aliphatic or cycloaliphatic epoxy resin including the steps of: (I) reacting a mixture of (a) an aliphatic or cycloaliphatic hydroxyl containing material, (b) an epihalohydrin, (c) a basic acting substance, (d) a non-Lewis acid catalyst, and (e) optionally, a solvent, forming an epoxy resin composition; (II) subjecting the epoxy resin composition produced in step (I) to a separation process to remove (A) “light” components such as, for example, solvent used in the epoxidation reaction, if any, unreacted epihalohydrin, and co-products such as di(epoxypropyl)ether; (B) unreacted aliphatic or cycloaliphatic hydroxyl containing material, if any; (C) partially epoxidized aliphatic or cycloaliphatic hydroxyl containing material, such as, for example, MGE; (D) fully epoxidized aliphatic or cycloaliphatic hydroxyl containing material, such as, for example, DGE, such that the (E) aliphatic or cycloaliphatic polyfunctional epoxy resin product remaining contains no more than 50% by weight of s

Abstract: An epoxy resin composition of the following chemical structure (I), where n is a number from 1 to about 3000; each m independently has a value of 0 or 1; each R0 is independently —H or —CH3; each R1 is independently —H or a C1 to C6 alkylene radical (saturated divalent aliphatic hydrocarbon radical), Ar is a divalent aryl group or heteroarylene group; and X is a cycloalkylene group, including a substituted cycloalkylene group, where the substituent group include an alkyl, cycloalkyl, an aryl or an aralkyl group or other substituent group, for example, a halogen, a nitro, or a blocked isocyanate, an alkyloxy group; the combination of cycloalkylene and alkylene groups and the combination of alkylene and cycloalkylene group with a bridging moiety in between.

Abstract: A coating composition comprising an advanced poly epoxy ester resin polymeric composition having the following chemical structure: where n is a number from 1 to about 3000; each m independently has a value of 0 or 1; each R0 is independently —H or —CH3; each R1 is independently —H or a C1 to C6 alkylene radical (saturated divalent aliphatic hydrocarbon radical); Ar is a divalent aromatic fused-ring moiety, which is most preferably a divalent naphthalene group, substituted divalent naphthalene group, where the substitute groups include an alkyl, cycloalkyl, an aryl or an aralkyl group or other substituent; and X is cycloalkylene group, including substituted cycloalkylene group, where the substitute group include an alkyl, cycloalkyl, an aryl or an aralkyl group or other substitute group, for example, a halogen, a nitro, a blocked isocyanate, or an alkyloxy group; the combination of cycloalkylene and alkylene groups and the combination of alkylene and cycloalkylene group with a bridging moiety in between.

Abstract: A poly epoxy ester resin composition of the following chemical structure: where n is a number from 2 to about 3000; each m independently has a value of 0 or 1; each R0 is independently —H or —CH3; each R1 is independently —H or a C1 to C6 alkylene radical (saturated divalent aliphatic hydrocarbon radical), Ar is a divalent aryl group or heteroarylene group;_and X is cycloalkylene group, including substituted cycloalkylene group, where the substitute group include an alkyl, cycloalkyl, an aryl or an aralkyl group or other substitute group, for example, a halogen, a nitro, a blocked isocyanate, or an alkyloxy group; the combination of cycloalkylene and alkylene groups and the combination of alkylene and cycloalkylene group with a bridging moiety in between.

Abstract: A compound comprising a class of sulfonated triorganophosphine compounds of formula R1R2P—R3[—O—(CH2)n—(SO3M)]m, wherein the R1 and R2 are selected individually from alkyl, aralkyl, and alicyclic groups, wherein R3 represents a divalent or polyvalent alkylene or alicyclic radical that is bonded to the phosphorus atom and to one or more sulfonate substituents via an alkylether link, and further wherein R3 does not contain any aryl moieties; n is an integer reflecting a number of methylene groups in the alkylether link; M represents a monovalent cation; and m is an integer representing a total number of sulfonated alkylether substituents. The compound is useful as a ligand in transition metal-ligand complex catalysts that are capable of catalyzing the hydroformylation of an olefinically-unsaturated compound with carbon monoxide and hydrogen to form one or more corresponding aldehyde products.

Abstract: Embodiments of the present disclosure include polycyclopentadiene compounds represented by Formula (I): in which each X is either a hydrogen or a cyano group (N?C—), n has an average value from zero to 20; each m independently has a value of zero to 3; p has a value of zero to 20; each R is independently a halogen, a nitrile group, a nitro group, an alkyl group, an alkoxy group, an alkenyl group, or an alkenyloxy group, where the alkyl group, the alkoxy group, the alkenyl group, and the alkenyloxy group each independently contain 1 to 6 carbon atoms; and each Q is independently hydrogen or an alkyl group containing 1 to 6 carbon atoms. Embodiments of the present disclosure also include a curable composition that includes the polycyclopentadiene compound(s) of Formula (I) and a curing amount of a resin or a catalyst amount of a catalyst and/or a cure accelerating amount of an accelerating agent.

Abstract: The present disclosure provides for polycyclopentadiene compounds that useful as an epoxide resin and/or as an adduct for a curable composition.

Abstract: Embodiments include poly(allyl ether)s of polycyclopentadiene polyphenol that can be obtained by allylation of a polycyclopentadiene polyphenol, where the aromatic hydroxyl group(s) (—OH) are converted to HR1C?CR1—CH2—O— and/or H2R1C—CR1?HC—O—, where R1 is as described herein. Embodiments also include thermosettable compositions including the poly(allyl ether)s of polycyclopentadiene polyphenol and products obtained by curing the thermosettable compositions.

Abstract: A thermosetting monomer comprising at least two of an aryl-cyanato group and at least two of a phosphorus group.

Abstract: An epoxy resin reactive diluent composition comprises an epoxy resin diluent (A) and a resin compound (B), wherein the epoxy resin diluent (A) comprises a cis, trans-1,3- and -1,4-cyclohexanedimethylether moiety; and wherein the resin compound (B) comprises one or more epoxy resins other than the epoxy resin diluent (A). A curable epoxy resin composition comprises the epoxy resin reactive diluent composition and a curing agent and/or curing catalyst therefore. A cured epoxy resin is prepared by curing the curable epoxy resin composition.

Abstract: A thermosetting monomer comprising at least two of an aryl-cyanato group and at least two of a phosphorus group.

Abstract: An epoxy resin composition prepared from a dihydroxydiphenyl-cycloalkane compound to form a diglycidyl ether of dihydroxydiphenyl cycloalkane compound which may be useful for making various products including, for example, powder coatings, composites and electrical laminates.

Abstract: A curable resin composition including (I) at least one thermoset resin composition; and (II) at least one hardener; wherein the powder coating has a balance of properties including a combination of high glass transition temperature and low water absorption.

Abstract: An epoxy resin comprising at least one epoxy amide such as at least one of a glycidyl ether amide and a glycidyl ester amide derived from at least one seed oil based alkanolamide; wherein the seed oil based alkanolamide is derived from the reaction of (i) at least one of a fatty acid ester, a fatty acid and a fatty acid triglyceride; and (ii) at least one alkanolamine; and a process for preparing such epoxy resin. An epoxy resin composition can be prepared comprising the epoxy amide above and one or more epoxy resins other than the epoxy amide. A curable epoxy resin composition can also be made from the above epoxy resin composition which contains at least one curing agent and/or at least one curing catalyst.

Abstract: Thermoset polyurethanes comprising a cis, trans-1,3- and -1,4-cyclohexanedimethylether moiety. Adducts of epoxy resins comprising a cis, trans-1,3- and -1,4-cyclohexanedimethylether moiety are used to react with a polyisocyanate to produce the thermoset polyurethanes.

Abstract: A compound comprising a class of sulfonated triorganophosphine compounds of formula R1R2P—R3[—O—(CH2)n—(SO3M)]m, wherein the R1 and R2 are selected individually from alkyl, aralkyl, and alicyclic groups, wherein R3 represents a divalent or polyvalent alkylene or alicyclic radical that is bonded to the phosphorus atom and to one or more sulfonate substituents via an alkylether link, and further wherein R3 does not contain any aryl moieties; n is an integer reflecting a number of methylene groups in the alkylether link; M represents a monovalent cation; and m is an integer representing a total number of sulfonated alkylether substituents. The compound is useful as a ligand in transition metal-ligand complex catalysts that are capable of catalyzing the hydroformylation of an olefinically-unsaturated compound with carbon monoxide and hydrogen to form one or more corresponding aldehyde products.

Abstract: An epoxy resin reactive diluent composition comprises an epoxy resin diluent (A) and a resin compound (B), wherein the epoxy resin diluent (A) comprises a cis, trans-1,3- and -1,4-cyclohexanedimethylether moiety; and wherein the resin compound (B) comprises one or more epoxy resins other than the epoxy resin diluent (A). A curable epoxy resin composition comprises the epoxy resin reactive diluent composition and a curing agent and/or curing catalyst therefore. A cured epoxy resin is prepared by curing the curable epoxy resin composition.