Patents by Inventor Robert E. Hilton

Robert E. Hilton has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Nickel plated tape
    Patent number: 4810620
    Abstract: An improved copper bump tape for tape automated bonding inhibits electromigration of the copper after bonding to a semiconductor device. The improved tape is characterized by the plating of a migration resistant metal onto the inner ends of connector beams of the tape. The migration resistant metal is coated onto all surfaces of the connector bump, except for the surface which is to be bonded to the semiconductor device. In this way, the surfaces of the bump which remain exposed after connection to the semiconductor are inhibited from electromigration.
    Type: Grant
    Filed: August 27, 1987
    Date of Patent: March 7, 1989
    Assignee: National Semiconductor Corporation
    Inventors: Hem P. Takiar, P. Shah Divyesh, Robert E. Hilton
  • Nickel plated copper tape
    Patent number: 4707418
    Abstract: An improved copper bump tape for tape automated bonding inhibits electromigration of the copper after bonding to a semiconductor device. The improved tape is characterized by the plating of a migration resistant metal onto the inner ends of connector beams of the tape. The migration resistant metal is coated onto all surfaces of the connector bump, except for the surface which is to be bonded to the semiconductor device. In this way, the surfaces of the bump which remain exposed after connection to the semiconductor are inhibited from electromigration.
    Type: Grant
    Filed: June 26, 1985
    Date of Patent: November 17, 1987
    Assignee: National Semiconductor Corporation
    Inventors: Hem P. Takiar, Divyesh P. Shah, Robert E. Hilton