Abstract: A microwave heater equipped with a microwave choke and suitable for heating one or more articles under vacuum. The microwave choke inhibits leakage of microwave energy between a door of the heater and a main vessel body of the heater without causing arcing at the choke, even at low pressures. In certain situations, the microwave choke can be configured with side-by-side choke cavities. In certain situations, the microwave choke can be removably coupled to the door and/or vessel body for easier fabrication, installation, and/or replacement.

Abstract: A reciprocally moveable cutting knife is described and which includes an elongated main body having a first, and an opposite, second end for engaging an object of interest; and a protrusion is made integral with the elongated main body and which extends outwardly from a plane which is defined by the outside facing surface of the main body, and which inhibits an adhesion from being created between the outside facing surface of the elongated main body, and the respective sidewalls of a knife guidance track when a source of water wets the outside surface of the elongated main body and the spaced sidewalls of the knife guidance channel.

Abstract: Methods of forming 3-D ICs with integrated passive devices (IPDs) include stacking separately prefabricated substrates coupled by through-substrates-vias (TSVs). An active device (AD) substrate has contacts on its upper portion. An isolator substrate is bonded to the AD substrate so the TSVs in the isolator substrate are coupled to the contacts on the AD substrate. An IPD substrate is bonded to the isolator substrate so that TVs therein are coupled to an interconnect zone on the isolator substrate and/or TSVs therein. The IPDs of the IPD substrate are coupled by TSVs in the IPD and isolator substrates to devices in the AD substrate. The isolator substrate provides superior IPD to AD cross-talk attenuation while permitting each substrate to have small high aspect ratio TSVs, thus facilitating high circuit packing density and efficient manufacturing.

Abstract: Methods of forming 3-D ICs with integrated passive devices (IPDs) include stacking separately prefabricated substrates coupled by through-substrate-vias (TSVs). An active device (AD) substrate has contacts on its upper portion. An isolator substrate is bonded to the AD substrate so that TSVs in the isolator substrate are coupled to the contacts on the AD substrate. An IPD substrate is bonded to the isolator substrate so that TSVs therein are coupled to an interconnect zone on the isolator substrate and/or TSVs therein. The IPDs of the IPD substrate are coupled by TSVs in the IPD and isolator substrates to devices in the AD substrate. The isolator substrate provides superior IPD to AD cross-talk attenuation while permitting each substrate to have small high aspect ratio TSVs, thus facilitating high circuit packing density and efficient manufacturing.

Abstract: A system and method for the monitoring of carbon dioxide (CO2) for chemical contaminants. The carbon dioxide monitoring system includes a contaminant sensor that is configured to detect trace amounts of contaminants in CO2 that is pumped through it in real time. The contaminant sensor includes an interferometer configured to track the amount of contaminants.

Abstract: A cutting apparatus is disclosed and which includes a cutter knife which is reciprocally moveable along a path of travel, a track member mounted adjacent to the cutter knife, and which mechanically cooperates with the cutter knife so as to define, at least in part, a first non-cutting position, and the second, cutting position for the cutter knife, and a magnet mounted on the track member and which releasably magnetically restrains the cutter knife when the cutter knife is in either of the first non-cutting position, or the second, cutting position.

Abstract: There is disclosed various embodiments of an implantable anchor for anchoring a medical lead within a patient. The implantable anchor includes a body having at least one lumen for receiving a medical lead, a cam integrated with the body and rotatable to extend into the lumen for engaging the medical lead and inhibiting the movement of the lead with respect to the anchor. The cam may include a handle for facilitating the rotation of the cam. A needle could be connected to the handle to facilitate the securing of the anchor to a portion of the patient.

Abstract: Methods of forming 3-D ICs with integrated passive devices (IPDs) include stacking separately prefabricated substrates coupled by through-substrate-vias (TSVs). An active device (AD) substrate has contacts on its upper portion. An isolator substrate is bonded to the AD substrate so that TSVs in the isolator substrate are coupled to the contacts on the AD substrate. An IPD substrate is bonded to the isolator substrate so that TSVs therein are coupled to an interconnect zone on the isolator substrate and/or TSVs therein. The IPDs of the IPD substrate are coupled by TSVs in the IPD and isolator substrates to devices in the AD substrate. The isolator substrate provides superior IPD to AD cross-talk attenuation while permitting each substrate to have small high aspect ratio TSVs, thus facilitating high circuit packing density and efficient manufacturing.

Abstract: A system and method for the monitoring of ammonia in a fluid. The ammonia monitoring system includes an ammonia sensor that is configured to detect trace amounts of ammonia (NH3) in a fluid (i.e., gas or liquid) that is pumped through it in real time. The real time ammonia sensor includes an interferometer configured to track the amount of ammonia that is pumped into the real time ammonia sensor. The ammonia monitoring system, via the real time ammonia sensor, is further configured to detect ammonia levels in industrial poultry houses and provide electronic feedback to the building's ventilation control system.

Abstract: Methods of forming 3-D ICs with integrated passive devices (IPDs) include stacking separately prefabricated substrates coupled by through-substrate-vias (TSVs). An active device (AD) substrate has contacts on its upper portion. An isolator substrate is bonded to the AD substrate so that TSVs in the isolator substrate are coupled to the contacts on the AD substrate. An IPD substrate is bonded to the isolator substrate so that TSVs therein are coupled to an interconnect zone on the isolator substrate and/or TSVs therein. The IPDs of the IPD substrate are coupled by TSVs in the IPD and isolator substrates to devices in the AD substrate. The isolator substrate provides superior IPD to AD cross-talk attenuation while permitting each substrate to have small high aspect ratio TSVs, thus facilitating high circuit packing density and efficient manufacturing.

Abstract: In one embodiment, a lead extension comprises: a lead body; a plurality of conductors disposed within the lead body; a plurality of terminal contacts on a proximal end of the lead body, wherein the plurality of terminal contacts are electrically coupled to the plurality of conductors; and a housing structure disposed at a distal end of the lead body, the housing structure enclosing a plurality of electrical connectors for making electrical contact with terminal contacts of a stimulation lead, wherein the plurality of electrical connectors are electrically coupled to the plurality of conductors; the housing structure comprising an outer body of a first material and an inner reinforcing structure of a second material, wherein the first material is a relatively pliable biocompatible polymer material and the second material is a relatively rigid material, the reinforcing structure holding the plurality of electrical connectors in a relatively fixed arrangement.

Abstract: In one embodiment, there is disclosed a lead locking mechanism for use in a header component of an implantable pulse generator. In certain embodiments, the lead locking mechanism comprises a first locking member positioned to engage a surface of at least two leads; a second locking member positioned to also engage a surface of at least two leads, and a coupling member coupling the first locking member to the second locking member.

Abstract: 3-D ICs (18, 18?, 90) with integrated passive devices (IPDs) (38) having reduced cross-talk and high packing density are provided by stacking separately prefabricated substrates (20, 30, 34) coupled by through-substrate-vias (TSVs) (40). An active device (AD) substrate (20) has contacts on its upper portion (26). An isolator substrate (30) is bonded to the AD substrate (20) so that TSVs (4030) in the isolator substrate (30) are coupled to the contacts (26) on the AD substrate (20), and desirably has an interconnect zone (44) on its upper surface. An IPD substrate (34) is bonded to the isolator substrate (30) so that TSVs (4034) therein are coupled to the interconnect zone (44) on the isolator substrate (30) and/or TSVs (4030) therein. The IPDs (38) are formed on its upper surface and coupled by TSVs (4034, 4030) in the IPD (34) and isolator (30) substrates to devices (26) in the AD substrate (20).

Abstract: There is disclosed various embodiments of an implantable anchor for anchoring a medical lead within a patient. The implantable anchor includes a body having at least one lumen for receiving a medical lead, a cam integrated with the body and rotatable to extend into the lumen for engaging, compressing and twisting the medical lead to inhibit the movement of the lead with respect to the anchor. The body of the anchor may include at least one slot, sized and positioned to receive a portion of the lead to further facilitate the inhibition of the movement of the lead. The cam may include a handle for facilitating the rotation and locking of the cam.

Abstract: A cutting apparatus is disclosed and which includes a cutter knife which is reciprocally moveable along a path of travel, a track member mounted adjacent to the cutter knife, and which mechanically cooperates with the cutter knife so as to define, at least in part, a first non-cutting position, and the second, cutting position for the cutter knife, and a magnet mounted on the track member and which releasably magnetically restrains the cutter knife when the cutter knife is in either of the first non-cutting position, or the second, cutting position.

Abstract: In one embodiment, an apparatus comprises: a base structure adapted to be inserted within the burr hole; a lead securing member for securing the lead, the lead securing member comprising a first arm structure and a second arm structure, at least one spring loaded structure adapted to exert a force to bring the first arm structure and the second arm structure together; and a positioning tool having a distal end adapted to be inserted within the lead securing member. When the positioning tool is positioned within the lead securing member, the distal end holds the first and second arm structures a sufficient distance apart to receive a lead between the first and second arm structures; wherein the positioning tool comprises a control structure at a proximal end that, when engaged, causes the distal end of the positioning tool to be released from between the first and second arm structures.

Abstract: A semiconductor structure having a transistor region and an optical device region includes a transistor in a first semiconductor layer of the semiconductor structure, wherein the first semiconductor layer is over a first insulating layer, the first insulating layer is over a second semiconductor layer, and the second semiconductor layer is over a second insulating layer. A gate dielectric of the transistor is in physical contact with a top surface of the first semiconductor layer, and the transistor is formed in the transistor region of the semiconductor structure. A waveguide device in the optical device region and a third semiconductor layer over a portion of the second semiconductor layer.

Abstract: A microwave heater equipped with a microwave choke and suitable for heating one or more articles under vacuum. The microwave choke inhibits leakage of microwave energy between a door of the heater and a main vessel body of the heater without causing arcing at the choke, even at low pressures. In certain situations, the microwave choke can be configured with side-by-side choke cavities. In certain situations, the microwave choke can be removably coupled to the door and/or vessel body for easier fabrication, installation, and/or replacement.

Abstract: A microwave heater equipped with a microwave choke and suitable for heating wood under vacuum. The microwave choke inhibits leakage of microwave energy between a door of the heater and a main vessel body of the heater without causing arcing at the choke, even at low pressures. In certain situations, the microwave choke can be configured with side-by-side choke cavities. In certain situations, the microwave choke can be removably coupled to the door and/or vessel body for easier fabrication, installation, and/or replacement.

Abstract: A semiconductor structure having a transistor region and an optical device region includes a transistor in a first semiconductor layer of the semiconductor structure, wherein the first semiconductor layer is over a first insulating layer, the first insulating layer is over a second semiconductor layer, and the second semiconductor layer is over a second insulating layer. A gate dielectric of the transistor is in physical contact with a top surface of the first semiconductor layer, and the transistor is formed in the transistor region of the semiconductor structure. A waveguide device in the optical device region and a third semiconductor layer over a portion of the second semiconductor layer.