Abstract: Apparatus and method for filling and sealing selected holes in a circuit board with epoxy resin or the like. The board is sandwiched in series between sealing sheets of a thermoplastic material and barrier sheets of a glass fiber or the like to form a laminate stack through which the holes are drilled at selected locations. The stack is disassembled and the board is plated to coat the linings of the drilled holes therein with conductive material, followed by reassembly of the stack together with an overlying resin-carrying sheet such as a glass fiber coated and/or impregnated with epoxy resin. The stack and the resin-carrying sheet are subjected to heat and pressure for causing the sealing sheets to adhere to the board and then for melting the epoxy resin and for forcing it to flow into the holes in the circuit board. After the epoxy resin is cured, the various sheets are stripped from the board leaving the epoxy resin within the holes.