Abstract: An addressably switchable interconnecting device, comprising an AXI stream switch having a plurality of input/output ports, configured so as to receive, into a first input/output port, data and control signals as well as a switch destination output port signal, to connect the first input/output port to a second input/output port depending on the switch destination output port signal, so as to pass the data and control signals from the first input/output port through the stream switch to the second input/output port, and further comprising a switch destination output port signal generating device for generating the switch destination output port signal from the data signal. Also a communication system and a communication protocol using the addressably switchable interconnecting device.

Abstract: An addressably switchable interconnecting device, comprising an AXI stream switch having a plurality of input/output ports, configured so as to receive, into a first input/output port, data and control signals as well as a switch destination output port signal, to connect the first input/output port to a second input/output port depending on the switch destination output port signal, so as to pass the data and control signals from the first input/output port through the stream switch to the second input/output port, and further comprising a switch destination output port signal generating device for generating the switch destination output port signal from the data signal. Also a communication system and a communication protocol using the addressably switchable interconnecting device.

Abstract: A chassis configured to hold a cards of at least two form factors comprising: slots disposed in an inner portion the chassis, wherein the slots are aligned with one another and configured to act as card guides; a mid-height structure disposed adjacent a side wall of the chassis, the mid-height structure comprising a second plurality of slots and a third plurality of slots disposed on top and bottom surfaces of the mid-height structure that are substantially parallel to top and bottom walls of the chassis; and a plurality of cooling channels disposed within the walls of the chassis as well as within the mid-height structure, wherein the second and third plurality of slots are configured to align with at least a subset of the plurality of slots disposed in the top and bottom chassis walls and to act as card guides.

Abstract: A liquid-cooled printed circuit board chassis, such as a Eurocard chassis, is manufactured without brazing by 3D printing a plurality of components, smoothing and completing the components by subtractive manufacture, and then aligning and assembling the final chassis, all without application of heat. Horizontal cooling channels 3D printed within the chassis components are in thermal contact with board slots, and are divided into subchannels by closely spaced internal walls that function as thermal baffles. The baffles are tilted at oblique angles to increase their cooling efficiency, and to enable AM manufacture without temporary support structures. Elastomer seals between components can connect the cooling channels to vertical connecting channels. EMI seals can be formed between the components by EMI gaskets. The components can be aligned by alignment pins, and joined together by bolts, screws, and/or adhesives.

Abstract: A liquid-cooled printed circuit board chassis, such as a Eurocard chassis, is manufactured without brazing by 3D printing a plurality of components, smoothing and completing the components by subtractive manufacture, and then aligning and assembling the final chassis, all without application of heat. Horizontal cooling channels 3D printed within the chassis components are in thermal contact with board slots, and are divided into subchannels by closely spaced internal walls that function as thermal baffles. The baffles are tilted at oblique angles to increase their cooling efficiency, and to enable AM manufacture without temporary support structures. Elastomer seals between components can connect the cooling channels to vertical connecting channels. EMI seals can be formed between the components by EMI gaskets. The components can be aligned by alignment pins, and joined together by bolts, screws, and/or adhesives.

Abstract: A chassis configured to hold a cards of at least two form factors comprising: slots disposed in an inner portion the chassis, wherein the slots are aligned with one another and configured to act as card guides; a mid-height structure disposed adjacent a side wall of the chassis, the mid-height structure comprising a second plurality of slots and a third plurality of slots disposed on top and bottom surfaces of the mid-height structure that are substantially parallel to top and bottom walls of the chassis; and a plurality of cooling channels disposed within the walls of the chassis as well as within the mid-height structure, wherein the second and third plurality of slots are configured to align with at least a subset of the plurality of slots disposed in the top and bottom chassis walls and to act as card guides.