Patents by Inventor Robert E. Silhavy

Robert E. Silhavy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Systems and methods for thermal control of integrated circuits
    Patent number: 9735088
    Abstract: A system includes a carrier defining a plurality of channels. The system includes an integrated circuit (IC) die having a first side and having a second side opposite the first side. The second side of the IC die is coupled to the carrier. The system includes a die attach layer between the carrier and the second side of the IC die. The die attach layer defines one or more openings that enable a fluid to flow from the carrier to the second side of the IC die.
    Type: Grant
    Filed: December 8, 2015
    Date of Patent: August 15, 2017
    Assignee: The Boeing Company
    Inventors: Kyle A. Woolrich, Jonathan M. Allison, Thomas Rust, III, Robert E. Silhavy
  • SYSTEMS AND METHODS FOR THERMAL CONTROL OF INTEGRATED CIRCUITS
    Publication number: 20170162473
    Abstract: A system includes a carrier defining a plurality of channels. The system includes an integrated circuit (IC) die having a first side and having a second side opposite the first side. The second side of the IC die is coupled to the carrier. The system includes a die attach layer between the carrier and the second side of the IC die. The die attach layer defines one or more openings that enable a fluid to flow from the carrier to the second side of the IC die.
    Type: Application
    Filed: December 8, 2015
    Publication date: June 8, 2017
    Applicant: THE BOEING COMPANY
    Inventors: Kyle A. Woolrich, Jonathan M. Allison, Thomas Rust, III, Robert E. Silhavy
  • Method of forming a soldered electrical connection
    Patent number: 6742248
    Abstract: A reliable, long-lived soldered electrical connection is made to a ceramic substrate having a thick-film metallization thereon, over which is deposited a joint-structure-stabilizing thin-film metallization. The thin-film metallization is a multilayered structure having an adhesion layer overlying and in contact with the thick-film metallization, a readily wettable base-metal layer overlying and in contact with the adhesion layer, and an oxidation-prevention layer overlying and in contact with the base-metal layer. An electrical conductor is soldered to the thin-film metallization of the ceramic substrate. The electrical conductor may be a bonding pad of a flip chip having a solder bump thereon.
    Type: Grant
    Filed: May 14, 2001
    Date of Patent: June 1, 2004
    Assignee: The Boeing Company
    Inventors: Boon Wong, Robert E. Silhavy, Jennifer Shinno
  • Metallized ceramic substrate and its use in forming a reliable, long-lived soldered electrical connection
    Publication number: 20020166230
    Abstract: A reliable, long-lived soldered electrical connection is made to a ceramic substrate having a thick-film metallization thereon, over which is deposited a joint-structure-stabilizing thin-film metallization. The thin-film metallization is a multilayered structure having an adhesion layer overlying and in contact with the thick-film metallization, a readily wettable base-metal layer overlying and in contact with the adhesion layer, and an oxidation-prevention layer overlying and in contact with the base-metal layer. An electrical conductor is soldered to the thin-film metallization of the ceramic substrate. The electrical conductor may be a bonding pad of a flip chip having a solder bump thereon.
    Type: Application
    Filed: May 14, 2001
    Publication date: November 14, 2002
    Inventors: Boon Wong, Robert E. Silhavy, Jennifer Shinno