Abstract: The wafer edge processing unit may be a stand alone unit or may be incorporated in existing grinding machines. The processing unit employs a plurality of tapes which are coated with differing grades of grit to sequentially polish the edge of a rotating wafer or to remove an edge bead from a processed wafer or the other substrate. The tapes are mounted on a backing block which is rotated to move the tapes from a line contact with the top bevel of the wafer to a line contact with the bottom bevel of the wafer. Fresh surfaces of the tapes are presented to successive wafers by rotating the spools on which the tapes are mounted. The wafer may be moved in small increments along a Y-axis and/or an X-axis relative to a tape during polishing to improve the polishing operation.

Abstract: The saw blade mount is provided with a stabilizer blade mount for imposing an axial force on the saw blade to eliminate unevenness in the saw blade. The stabilizer blade mount includes a gasket ring of plastic or elastomeric material which is abutting against the saw blade and which faces an opposing surface of an inner clamping ring. Adjustment screws permit adjustment of the stabilizing ring relative to the saw blade either completely about the periphery or only at localized regions.