Abstract: The notch polishing machine employs a plurality of polishing tapes which can be sequentially introduced into the notch of a wafer to polish both sides of the notch, i.e. the top and bottom surfaces. Each tape is pulled off a supply reel and passed into a mounting block sized to fit into the wafer notch. Each block is also mounted to be oscillated to effect a polishing action. Also, all the blocks are mounted in common to be pivoted between a position angularly disposed relative to the top of the top of the wafer and a position angularly disposed relative to the bottom of the wafer.

Abstract: The blade track control system employs a pair of bearing pads and a pair of sensors. Each bearing pad is provided with a supply of compressed air of constant pressure to provide an aerodynamic bearing surface film against a rotating saw blade. Each bearing pad is mounted on a structure, a portion of which may be flexed in order to deflect the saw blade from a datum plane into a cutting plane. Each sensor detects a deviation in the saw blade from the cutting plane and emits a signal which effects a movement of the bearing pad toward or away from the blade in order to effect a corresponding deflection of the saw blade back to the cutting plane. The two bearing pads are mounted independently of the sensors and each is moved relative to the saw blade by deflecting a cross bar on which the bearing pad is mounted in cantilevered fashion.

Abstract: A wafer slicing and grinding machine is provided with a saw blade assembly for the slicing of wafers from an ingot. A grinding stage is also provided for sequentially grinding the rear face of a previously sliced wafer and the front face of an ingot in order to provide a double ground wafer. A transfer chuck and a holding chuck are disposed within the machine to perform movements for effecting a turning over of a wafer for grinding of the rear face of the wafer.

Abstract: The tool mounting arrangement employs a bushing within a recessed end of a shaft. The bushing has three lobes with inclined surfaces which abut against an internal conical wall of an annular mounting portion on the end of the shaft. A threaded screw passes through a washer and the grind wheel in non-rotatable relation into threaded relation in the bushing. Turning of the screw causes the bushing to be pulled in a direction out of the shaft so as to radially deform the annular mounting portion into uniform contact with the bore of the grind wheel while the grind wheel is simultaneously abutted square to the shaft axis. The annular mounting portion is provided with equi-spaced circumferentially disposed notches to permit passage of the lobes upon insertion of the bushing into the recess at the end of the shaft. One or more set screws is also provided in the shaft to prevent rotation of the bushing within the recess of the shaft.

Abstract: A wafer slicing and grinding machine is provided with a saw blade assembly for the slicing of wafers from an ingot. A grinding stage is also provided for sequentially grinding the rear face of a previously sliced wafer and the front face of an ingot in order to provide a double ground wafer. A transfer chuck and a holding chuck are disposed within the machine to perform movements for effecting a turning over of a wafer for grinding of the rear face of the wafer.

Abstract: The grinding wheel is provided with a plurality of circumferentially spaced apart micrometer screws which can be adjusted from time to time in order to index the grind wheel into different grinding positions. An indexing mechanism can be mounted on the face of the disk with drive pins extending through the disk into the micrometer screws for simultaneous rotation of the screws. The indexing mechanism is lightweight and can be readily attached to the face of the grind disk.

Abstract: The spindle on which the wheelhead rotates is mounted within a spindle housing which, in turn, is mounted by a bearing at one end in a pivotally mounted housing. A pair of hydraulic cylinders engage the opposite end of the spindle housing and are actuated during a cutting stroke so as to impose a force on the spindle housing to effect a lateral displacement of the spindle housing in a plane common to the spindle axis and the pivot axis of the housing. The lateral deflection, in turn, causes a lateral deflection of the wheelhead thereby controlling the lateral deviation of the wheelhead relative to the true cutting plane during the cutting stroke. A sensor is provided between the housing and the wheelhead to sense and control deviations of the wheelhead from the true cutting plane. The arrangement may also be used for saws with wheelheads which are horizontally mounted for the cutting of vertically mounted ingots.

Abstract: A grinding wheel is mounted coaxially of an internal diameter saw blade and rotates with the saw blade during operation. The grinding wheel includes a grinding disc and a center rod which is movably mounted within a central bore of the spindle of the slicing machine. Compressed fluid such as air is used to move the grinding wheel from a retracted position to an extended position against the bias of a spring secured to the center rod. The pressurized fluid is introduced into a chamber for moving an annular sleeve-like piston removably secured to the grinding disc. An adjustable stop ring is also mounted on an adaptor within the sleeve-like piston and has ears which can be deflected by screws from access openings in the grinding disc for fine running adjustments of the grinding disc. This stop ring can be accessed upon removal of the grinding disc from the center rod and sleeve-like piston in order to permit coarse initial adjustments in the positioning of the grinding disc.

Abstract: The flat grind stage assembly is programmed so that the grinding wheel is first caused to move along a straight path to form a flat on a wafer while the wafer is held in a stationary position. Thereafter, the grinding wheel is returned to the mid-point of the flat and then moved away from the flat. The wafer is then rotated and grinding commences when the end of the flat is reached so that a circular periphery is ground on the remainder of the wafer while the axis of the grinding wheel remains stationary.

Abstract: The grinder is provided with a grind burr which is programmed to form a notch in a peripheral edge of a wafer before or after grinding of the peripheral edge of the wafer. The grind burr is mounted on the housing of the grinding wheel to be moved in common therewith. The grind wheel housing can be moved vertically to bring the grind burr into alignment with the edge of the wafer.

Abstract: The saw assembly is provided with a self-contained balancing means for the automatic balancing of the wheel head. In one embodiment, the balancing means includes an annular rotor which is mounted on the wheel head and which contains a vaporizable fluid medium within circumferentially spaced chambers. Heating elements are provided for heating selected chambers in order to vaporize and transfer the balancing medium between chambers via a capillary manifold tube, or pneumatic means is used to transfer the balancing medium. Sensors are provided to sense the rotation of the wheel head and the radial vibration of the wheel head and cutting blade of the saw assembly in order to determine where the wheel head is out-of-balance.

Abstract: An improved tensioning device is provided for use in an inner diameter saw blade housing. A tensioning ring, disposed in an annular clamping member, is internally threaded at plurality of locations along its circumference. An associated plurality of screws, disposed in cylindrical recesses in the clamping member, threadedly engage the internal threads. The screws may be turned through an opening in the clamping member having a diameter smaller than the screw to thereby precisely tension the blade as desired. Since the screws are captive within the clamping member, migration of the tensioning ring relative to the blade is prevented. Further, the screws do not protrude from the surface of the clamping member and the threaded portions of the screws are closed off from the ambient such that foreign matter cannot enter the clamping member and interfere with the tensioning process.

Abstract: The wafering system employs a chuck assembly for moving a severed wafer from a crystal through the aperture in the cutting blade to a take-off conveyor. The chuck assembly includes a suction head which is pivotally mounted via a pivot arm assembly, a slide for moving the head back and forth and a carriage for vertically moving the head up and down. A motor is used to actuate the carriage while air cylinders are used to actuate the slide and pivot arm assembly.

Abstract: The present invention is related to a fluid metering valve that is specifically constructed to provide fine metering at extremely low flow rates while still providing a full shut-off capability. The fluid metering valve of the present invention is specifically adapted to be utilized in conjunction with corrosive fluids or fluids containing suspended solid particles that would otherwise damage or clog a comparable precision needle valve.

Abstract: An improvement is provided in an apparatus for mounting and tensioning an inside diameter cutting blade which is mounted in a circular saw blade housing. The outer circumference of the blade is clamped within a mounting apparatus. Pressurized hydraulic fluid within a channel exerts pressure against the blade radially inward of the clamping means by exerting pressure on a fluid-tight gasket which, in turn, bears against the blade. By virtue of the uniform pressure distribution throughout the fluid, uniform tensioning of the blade is accomplished. The improvement comprises constructing the gasket in two pieces with an outer sleeve which contacts the hydraulic fluid, and which while deformable, is fixed relative to the housing, and a filler ring mounted within the sleeve and which is relatively movable with respect thereto.