Patents by Inventor Robert E. Sulouff, Jr.

Robert E. Sulouff, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of forming a device by removing a conductive layer of a wafer
    Patent number: 7816165
    Abstract: A method of forming a MEMS device provides a wafer having a base with a conductive portion. The wafer also has an intermediate conductive layer. After it provides the wafer, the method adds a diaphragm layer to the wafer. The method removes at least a portion of the intermediate conductive layer to form a cavity between the diaphragm layer and the base. At least a portion of the diaphragm layer is movable relative to the base. After it forms the cavity, the method seals the cavity.
    Type: Grant
    Filed: January 9, 2009
    Date of Patent: October 19, 2010
    Assignee: Analog Devices, Inc.
    Inventors: Timothy J. Brosnihan, Robert E. Sulouff, Jr., John M. Sledziewski
  • Flow sensor chip
    Patent number: 7703339
    Abstract: A flow sensor has an inlet chamber with a first pressure sensor and an inlet port for receiving fluid, and an outlet chamber with a second pressure sensor and an outlet port. The flow sensor also has an anemometer in fluid communication with at least one of the two chambers.
    Type: Grant
    Filed: December 8, 2006
    Date of Patent: April 27, 2010
    Assignee: Analog Devices, Inc.
    Inventors: Robert E. Sulouff, Jr., Craig E. Core
  • Method of Forming a Device by Removing a Conductive Layer of a Wafer
    Publication number: 20090114954
    Abstract: A method of forming a MEMS device provides a wafer having a base with a conductive portion. The wafer also has an intermediate conductive layer. After it provides the wafer, the method adds a diaphragm layer to the wafer. The method removes at least a portion of the intermediate conductive layer to form a cavity between the diaphragm layer and the base. At least a portion of the diaphragm layer is movable relative to the base. After it forms the cavity, the method seals the cavity.
    Type: Application
    Filed: January 9, 2009
    Publication date: May 7, 2009
    Applicant: Analog Devices, Inc.
    Inventors: Timothy J. Brosnihan, Robert E. Sulouff, JR., John M. Sledziewski
  • Method of forming a device by removing a conductive layer of a wafer
    Patent number: 7491566
    Abstract: A method of forming a MEMS device provides a wafer having a base, a first conductive layer, a second conductive layer, and an intermediate conductive layer. After it provides the wafer, the method removes at least a portion of the intermediate conductive layer to form a cavity between the first and second conductive layers. At least a portion of the first conductive layer is movable relative to the base to form a diaphragm, while the second conductive layer is substantially immovable relative to the base. After it forms the cavity, the method seals the cavity.
    Type: Grant
    Filed: February 2, 2005
    Date of Patent: February 17, 2009
    Assignee: Analog Devices, Inc.
    Inventors: Timothy J. Brosnihan, Robert E. Sulouff, Jr., John M. Sledziewski
  • Folded cantilever beam accelerometer
    Patent number: 5412987
    Abstract: A cantilever beam has a proof mass arranged at its distal end so as to cause the beam to resiliently deform into an S-shape when the accelerometer is subjected to acceleration intended to be detected. Strain gauge elements are placed at the two knees of the S-shape.
    Type: Grant
    Filed: September 24, 1992
    Date of Patent: May 9, 1995
    Assignee: Siemens Automotive L.P.
    Inventors: John S. Bergstrom, Robert E. Sulouff, Jr.