Abstract: A mechanism is provided for soldering the leads of electronic components, such as integrated circuit elements, to corresponding conductors on a printed circuit board. The mechanism utilizes the known lap soldering reflow process by which the leads of the electronic component and the printed circuit conductors are solder coated, and a heated soldering tip holds each component lead and the corresponding printed circuit conductor in contact with one another while melting the solder on the lead and on the conductor. The soldering tip continues to hold the lead and conductor in contact with one another after the heat in the tip has been terminated and until the solder solidifies. The soldering tip is then removed leaving a soldered joint.