Abstract: A semiconductor slider including an integral spin valve transistor (SVT) having a read width of 250 nm or less disposed on a monolithic semiconductor. substrate, useful in magnetic data storage applications. The monolithic slider may also include other magnetic and semiconductor transistor structures and is fabricated in a single process using standard thin-film processing steps. The SVT includes a sensor stack having a top surface and including a first ferromagnetic (FM) layer in contact with and forming a Schottky barrier at the monolithic semiconductor substrate, a FM shield layer disposed over the sensor stack and in electrical contact with the top surface thereof, a SVT emitter terminal coupled to the FM shield, a SVT collector terminal coupled to the substrate and a SVT base terminal coupled to the first FM layer. The sensor stack may include a spin valve (SV) stack or a tunnel valve (TV) stack, for example.

Abstract: Several embodiments of a sense current perpendicular to the planes of the sensor (CPP) and flux guide type of read head has a gap between first and second shield layers at an air bearing surface (ABS) where the flux guide is located which is less than a gap between the first and second shield layers at a recessed location where the sensor is located. This reduced gap increases the linear bit density capability of the read head. A longitudinal bias stack (LBS) is located in the sensor stack. Several unique methods of construction are described for forming the magnetic head assemblies.

Abstract: The present invention is a magnetic head having a helical induction coil and includes hard disk drive devices that utilize the magnetic head. The helical coil is fabricated around a magnetic pole yoke in a series of process steps that include a reactive ion etch (RIE) process step which is utilized to simultaneously form vertical interconnect vias and upper helical coil member trenches. Thereafter, in a single fabrication step, such as by electroplating, the vertical interconnect lines and the upper helical coil traces are created in a single fabrication step, such that they are integrally formed. The vertical interconnect lines provide an electrical connection between outer ends of previously formed lower helical coil traces and outer ends of the integrally formed upper helical coil traces, such that a helical coil is fabricated. In the preferred embodiment, the helical coil is composed of copper.

Abstract: A magnetic recording system is provided having a write head employing a combination of magnetic write field gradient and thermal gradient to write data on a ‘thermal spring’ magnetic recording media. The write head comprises a magnetic element using a write current to induce a magnetic write field at the magnetic media and a thermal element using a very small aperture laser to heat a portion of the media. The thermal spring magnetic media comprises [comprises] first and second stacks providing two exchange coupled ferromagnetic layers having different Curie temperatures [The first stack has a high magneto-crystalline anisotropy, a relatively low saturation magnetization and a low Curie temperature.] [The second stack has a relatively low magneto-crystalline anisotropy, a high saturation magnetization and a high Curie temperature.

Abstract: Several embodiments of a sense current perpendicular to the planes of the sensor (CPP) and flux guide type of read head has a gap between first and second shield layers at an air bearing surface (ABS) where the flux guide is located which is less than a gap between the first and second shield layers at a recessed location where the sensor is located. This reduced gap increases the linear bit density capability of the read head. A longitudinal bias stack (LBS) is located in the sensor stack. Several unique methods of construction are described for forming the magnetic head assemblies.

Abstract: A semiconductor slider including an integral spin valve transistor (SVT) having a read width of 250 nm or less disposed on a monolithic semiconductor substrate, useful in magnetic data storage applications. The monolithic slider may also include other magnetic and semiconductor transistor structures and is fabricated in a single process using standard thin-film processing steps. The SVT includes a sensor stack having a top surface and including a first ferromagnetic (FM) layer in contact with and forming a Schottky barrier at the monolithic semiconductor substrate, a FM shield layer disposed over the sensor stack and in electrical contact with the top surface thereof, a SVT emitter terminal coupled to the FM shield, a SVT collector terminal coupled to the substrate and a SVT base terminal coupled to the first FM layer. The sensor stack may include a spin valve (SV) stack or a tunnel valve (TV) stack, for example.

Abstract: The present invention is a magnetic head having a helical induction coil and includes hard disk drive devices that utilize the magnetic head. The helical coil is fabricated around a magnetic pole yoke in a series of process steps that include a reactive ion etch (RIE) process step which is utilized to simultaneously form vertical interconnect vias and upper helical coil member trenches. Thereafter, in a single fabrication step, such as by electroplating, the vertical interconnect lines and the upper helical coil traces are created in a single fabrication step, such that they are integrally formed. The vertical interconnect lines provide an electrical connection between outer ends of previously formed lower helical coil traces and outer ends of the integrally formed upper helical coil traces, such that a helical coil is fabricated. In the preferred embodiment, the helical coil is composed of copper.

Abstract: A suspended resist bridge suitable for lithographically patterning MR sensors having trackwidths narrower than 0.2 micron is fabricated using the method of the present invention. First, PMGI is spun onto a substrate to form a first thin resist layer. Next, PMMA is spun onto the first resist layer to form a second resist layer. The PMMA layer is exposed to an electron beam to pattern the trackwidth of the MR sensors. E-beam exposed PMMA is then developed in an IPA solution. The resist structure is then placed in a basic solution for dissolving PMGI, which results in a fully undercut resist bridge that is used for patterning the MR sensors.

Abstract: A magnetic head having a helical induction coil. The helical coil is fabricated around a magnetic pole yoke in a series of process steps that include a reactive ion etch (RIE) process step which is utilized to simultaneously form vertical interconnect vias and upper helical coil member trenches. Thereafter, in a single fabrication step, such as by electroplating, the vertical interconnect lines and the upper helical coil traces are created in a single fabrication step, such that they are integrally formed. The vertical interconnect lines provide an electrical connection between outer ends of previously formed lower helical coil traces and outer ends of the integrally formed upper helical coil traces, such that a helical coil is fabricated. In the preferred embodiment, the helical coil is composed of copper.

Abstract: Various embodiments of a read head employ a bias stack which is in a sensor stack of the read head. The bias stack includes a biasing layer and is separated from a free layer in the sensor by a spacer layer. A magnetic moment of the free layer is longitudinally biased antiparallel to a magnetic moment of the biasing layer because of the coupling therebetween. The free layer is therefore more uniformly longitudinally biased than when hard bias layers are employed at first and second side surfaces of the sensor. Various methods are described for making the various read heads of the present invention.

Abstract: A semiconductor slider including an integral spin valve transistor (SVT) having a read width of 250 nm or less disposed on a monolithic semiconductor substrate, useful in magnetic data storage applications. The monolithic slider may also include other magnetic and semiconductor transistor structures and is fabricated in a single process using standard thin-film processing steps. The SVT includes a sensor stack having a top surface and including a first ferromagnetic (FM) layer in contact with and forming a Schottky barrier at the monolithic semiconductor substrate, a FM shield layer disposed over the sensor stack and in electrical contact with the top surface thereof, a SVT emitter terminal coupled to the FM shield, a SVT collector terminal coupled to the substrate and a SVT base terminal coupled to the first FM layer. The sensor stack may include a spin valve (SV) stack or a tunnel valve (TV) stack, for example.

Abstract: An electronic lapping guide (ELG) and method of making are provided for precisely lapping a read sensor to a designed air bearing surface (ABS). In the method a sensor material layer is formed on a wafer after which a portion of the sensor material layer is removed and ELG material is deposited therein. This is followed by forming track widths and back edges for each of the ELG and the read sensor to be followed by lapping to the ABS. Various films are employed for the ELG to minimize magnetoresistance and optimize the resistance of the ELG. The resistance of the ELG is then sensed by a computer for controlling a lapping tool to lap to the aforementioned ABS.

Abstract: Various embodiments of a read head employ a bias stack which is in a sensor stack of the read head. The bias stack includes a biasing layer and is separated from a free layer in the sensor by a spacer layer. A magnetic moment of the free layer is longitudinally biased antiparallel to a magnetic moment of the biasing layer because of the coupling therebetween. The free layer is therefore more uniformly longitudinally biased than when hard bias layers are employed at first and second side surfaces of the sensor. Various methods are described for making the various read heads of the present invention.

Abstract: Several embodiments of a sense current perpendicular to the planes of the sensor (CPP) and flux guide type of read head has a gap between first and second shield layers at an air bearing surface (ABS) where the flux guide is located which is less than a gap between the first and second shield layers at a recessed location where the sensor is located. This reduced gap increases the linear bit density capability of the read head. A longitudinal bias stack (LBS) is located in the sensor stack. Several unique methods of construction are described for forming the magnetic head assemblies.

Abstract: A spin valve transistor (SVT) for a magnetic head and a method of making the same are described. A slider of a disk drive is formed of a semiconductor material, such as silicon. A free layer is formed over the semiconductor material and a magnetic pinned layer is formed over a portion of the free layer. The free layer has an edge that is substantially flush with an air bearing surface (ABS) between the magnetic head and the disk, whereas the magnetic pinned layer has an edge that is recessed away from the ABS. Advantageously, since the free layer serves as a flux guiding structure for the sensor, the sensor has a thinner profile at the ABS to accommodate higher recording densities.

Abstract: A magnetic recording system is provided having a write head employing a combination of magnetic write field gradient and thermal gradient to write data on a ‘thermal spring’ magnetic recording media. The write head comprises a magnetic element using a write current to induce a magnetic write field at the magnetic media and a thermal element using a very small aperture laser to heat a portion of the media. The thermal spring magnetic media comprises comprises first and second stacks providing two exchange coupled ferromagnetic layers having different Curie temperatures. The first stack has a high magneto-crystalline anisotropy, a relatively low saturation magnetization and a low Curie temperature. The second stack has a relatively low magneto-crystalline anisotropy, a high saturation magnetization and a high Curie temperature.

Abstract: First and second longitudinal biasing layers for a free layer of a tunnel junction sensor are electrically insulative so as to not shunt any of the sense current conducted through the tunnel junction sensor. The first and second longitudinal biasing layers are composed of gamma iron oxide (&lgr;Fe2O3).

Abstract: A suspended resist bridge suitable for lithographically patterning MR sensors having trackwidths narrower than 0.2 micron is fabricated using the method of the present invention. First, PMGI is spun onto a substrate to form a first thin resist layer. Next, PMMA is spun onto the first resist layer to form a second resist layer. The PMMA layer is exposed to an electron beam to pattern the trackwidth of the MR sensors. E-beam exposed PMMA is then developed in an IPA solution. The resist structure is then placed in a basic solution for dissolving PMGI, which results in a fully undercut resist bridge that is used for patterning the MR sensors.

Abstract: A method and tool for measurement of the roll static attitude and y-misalignment of magnetic recording sliders within the head stack assembly having reference elements placed on the deposited end of the magnetic recording slider, which are optically analyzed by a video camera connected to a computer. For fast measurement the head stack assembly is clamped in a fixture mounted on motorized stages, which move each slider into the measurement position. In a two step imaging and analyzing process, the orientation and location of one or more edges of the reference element are computed and compared with known control parameters.

Abstract: The current invention provides for magnetic sensor devices with reduced gap thickness and improved thermal conductivity. Gap structures of the current invention are integrated in laminated Magneto-Resistive and Spin-Valve sensors used in magnetic data storage systems. The gap structures are produced by depositing metal layers and oxidizing portions of or all of the metal layers to form thin high quality oxidized metal dielectric separator layers. The oxidized metal layer provides for excellent electrical insulation of the sensor element and any remaining metallic portions of the metal layers provide a thermally conducting pathway to assist the dissipation of heat generated by the sensor element. Because of the combined qualities of electrical insulation and thermal conductivity, magnetic sensor devices of this invention can be made with thinner gap structures and operated at higher drive currents.