Patents by Inventor Robert Edward Kalinowski

Robert Edward Kalinowski has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6130306
    Abstract: A moisture curing composition comprising (a) an oxyalkylene polymer having at least one reactive silicon group in each molecule, (b) bis(3-triethoxysilylpropyl)tetrasulfane, and (c) a condensation catalyst. The presence of the bis(3-triethoxysilylpropyl)tetrasulfane in the composition provides for improved physical properties such as tensile strength and elongation. The present compositions are suitable for use in such applications as sealing materials for construction both in the form of extrudable liquid compositions and as cured preformed configurations such as tapes.
    Type: Grant
    Filed: March 11, 1999
    Date of Patent: October 10, 2000
    Assignees: Dow Corning S. A., Dow Corning Corporation
    Inventors: Robert Edward Kalinowski, Andreas Thomas Franz Wolf
  • Patent number: 6060559
    Abstract: The presence in curable polyolefin compositions of a moisture curable organosilicon compound containing at least one alkenyloxy group bonded to the silicon atoms improves the adhesion to a variety of substrates that is developed during the curing reaction of polyolefin compositions cured by a hydrosilation reaction. The organosilicon compound is preferably a reaction product of ingredients comprising 1) a silane or bis-silylalkane containing at least three silicon-bonded moisture-reactive groups per molecule and 2) an organic compound containing at least one carbinol group and at least one ethylenically unsaturated group.
    Type: Grant
    Filed: September 4, 1998
    Date of Patent: May 9, 2000
    Assignee: Dow Corning Corporation
    Inventors: Qian Jane Feng, Robert Edward Kalinowski, Kenneth Michael Lee, Michael Andrew Lutz, Michael James Owen, Susan Victoria Perz, Toshio Suzuki
  • Patent number: 5928794
    Abstract: This invention relates to the preparation of an addition curable composition having self adhesion to substrates. The addition curable composition comprises an organic polymer having on average at least 1.4 alkenyl groups per molecule, a crosslinker having on average at least 1.4 hydrosilyl groups per molecule, a platinum group metal containing catalyst, an alkoxy silicon compound and a titanium compound having Ti--O--C bonds. Another embodiment of this invention is a method of adhering the addition curable composition to a substrate surface.
    Type: Grant
    Filed: December 3, 1997
    Date of Patent: July 27, 1999
    Assignees: Dow Corning GmbH, Dow Corning Corporation
    Inventors: Robert Edward Kalinowski, Mary Kay Tomalia, Andreas Thomas Franz Wolf, Ming Hsiung Yeh
  • Patent number: 5880195
    Abstract: This invention relates to the preparation of an addition curable composition curable to a high tensile strength, tack free composition. The addition curable composition comprises an organic polymer having on average at least 1.4 alkenyl groups per molecule, a crosslinker having on average at least 1.4 hydrosilyl groups per molecule, a platinum group metal-containing catalyst and a specific ratio of a fatty acid treated, precipitated calcium carbonate filler having an average particle size in the range of 0.05 to 1 micron and a ground filler selected from the group consisting of calcium carbonate, kaolin clay and amorphous, non quartz silica each having an average particle size in the range of 0.2 to 40 microns.
    Type: Grant
    Filed: December 3, 1997
    Date of Patent: March 9, 1999
    Assignee: Dow Corning GmbH & Dow Corning Corporation
    Inventors: Robert Edward Kalinowski, Mary Kay Tomalia, Andreas Thomas Franz Wolf