Patents by Inventor Robert Eisenstadt

Robert Eisenstadt has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8966425
    Abstract: A technique generates small scale clock trees using a spine-based architecture (using spine routing) while also using clustered placement. Techniques are used to control clock sink cluster contents in order to minimize clock skew, minimize clock buffer count, and minimize use of routing resources. This approach also provides the user with ample structure and control to customize small efficient clock trees, and can also reduce clock power consumption.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: February 24, 2015
    Assignee: Pulsic Limited
    Inventors: Robert Eisenstadt, Mark Waller, Tim Parker, Mark Williams, Jeremy Birch, Graham Balsdon, Fumiako Sato
  • Publication number: 20140167818
    Abstract: Methods and/or associated devices and/or systems for creating integrated circuits (IC's) that have multiple connected I/O regions that can be designed and implemented using commonly available standard I/O libraries in conjunction with standard IC design flows and tools and in combination with one or more novel standardized I/O region interconnect cells for interconnecting between or through otherwise separated I/O regions. Specific embodiments support a wide variety of IC's that can be developed using standard libraries and design flows including: application specific integrated circuits (ASIC's), programmable logic devices (PLDs), custom IC's, analog IC's, CPU's, GPU's, and other IC's that require large numbers of input/ouput (IO) circuits while having relatively small core circuitry areas. Specific embodiments may involve innovative I/O cell functions, innovative IC topologies, and innovative IC packaging solutions for single die packages and multiple die packages.
    Type: Application
    Filed: September 30, 2013
    Publication date: June 19, 2014
    Inventor: Robert Eisenstadt
  • Patent number: 8549447
    Abstract: Methods and/or associated devices and/or systems for creating integrated circuits (IC's) that have multiple connected I/O regions that can be designed and implemented using commonly available standard I/O libraries in conjunction with standard IC design flows and tools and in combination with one or more novel standardized I/O region interconnect cells for interconnecting between or through otherwise separated I/O regions. Specific embodiments support a wide variety of IC's that can be developed using standard libraries and design flows including: application specific integrated circuits (ASIC's), programmable logic devices (PLDs), custom IC's, analog IC's, CPU's, GPU's, and other IC's that require large numbers of input/ouput (IO) circuits while having relatively small core circuitry areas. Specific embodiments may involve innovative I/O cell functions, innovative IC topologies, and innovative IC packaging solutions for single die packages and multiple die packages.
    Type: Grant
    Filed: April 24, 2010
    Date of Patent: October 1, 2013
    Inventor: Robert Eisenstadt
  • Publication number: 20110260318
    Abstract: Methods and/or associated devices and/or systems for creating integrated circuits (IC's) that have multiple connected I/O regions that can be designed and implemented using commonly available standard I/O libraries in conjunction with standard IC design flows and tools and in combination with one or more novel standardized I/O region interconnect cells for interconnecting between or through otherwise separated I/O regions. Specific embodiments support a wide variety of IC's that can be developed using standard libraries and design flows including: application specific integrated circuits (ASIC's), programmable logic devices (PLDs), custom IC's, analog IC's, CPU's, GPU's, and other IC's that require large numbers of input/ouput (IO) circuits while having relatively small core circuitry areas. Specific embodiments may involve innovative I/O cell functions, innovative IC topologies, and innovative IC packaging solutions for single die packages and multiple die packages.
    Type: Application
    Filed: April 24, 2010
    Publication date: October 27, 2011
    Inventor: Robert Eisenstadt
  • Patent number: 7080341
    Abstract: Methods and/or associated devices and/or systems for providing power management in electronic circuits, including custom ICs, programmable logic devices, and application specific integrated circuits (ASICs) places portions of various power management solutions in the I/O ring or in I/O macros. The invention has numerous specific embodiments and applications to a wide variety of ICs and logic or other circuit design components including circuit modules, software descriptions of circuit modules and/or design or simulation or test systems for circuit development.
    Type: Grant
    Filed: September 9, 2004
    Date of Patent: July 18, 2006
    Inventors: Robert Eisenstadt, Jon Shiell
  • Publication number: 20050091629
    Abstract: Methods and/or associated devices and/or systems for providing power management in electronic circuits, including custom ICs, programmable logic devices, and application specific integrated circuits (ASICs) places portions of various power management solutions in the I/O ring or in I/O macros. The invention has numerous specific embodiments and applications to a wide variety of ICs and logic or other circuit design components including circuit modules, software descriptions of circuit modules and/or design or simulation or test systems for circuit development.
    Type: Application
    Filed: September 9, 2004
    Publication date: April 28, 2005
    Inventors: Robert Eisenstadt, Jon Shiell
  • Patent number: RE44025
    Abstract: Methods and/or associated devices and/or systems for providing power management in electronic circuits, including custom ICs, programmable logic devices, and application specific integrated circuits (ASICs) places portions of various power management solutions in the I/O ring or in I/O macros. The invention has numerous specific embodiments and applications to a wide variety of ICs and logic or other circuit design components including circuit modules, software descriptions of circuit modules and/or design or simulation or test systems for circuit development.
    Type: Grant
    Filed: July 18, 2008
    Date of Patent: February 19, 2013
    Assignee: Jr. Shadt Electronics, LLC
    Inventors: Robert Eisenstadt, Jon Shiell