Abstract: A clamp attaches an electric submersible pump cable to a sucker rod to deploy and support the cable in an oil well. The clamp includes a core portion having a bore extending axially through the core portion for receiving the sucker rod. A pair of arms extends radially outwardly from the core portion. The arms grip the cable on the facing surfaces of the arms for engaging the cable in a space between the arms.

Abstract: An electrical cable assembly (10) comprising a cable core (12) and filler layer (16) encased in longitudinally welded reeled tubing (23) so as to restrict relative axial and longitudinal motion between the cable core (12) and reeled tubing (23). Small-diameter tubing (24) is optionally provided as part of the cable core (12) to facilitate the delivery of fluids such as lubricants and corrosion inhibitors to downhole equipment. A method is disclosed for deploying electrical cables in deep wells through use of the subject apparatus.

Abstract: A solid state device including glass containing SiO.sub.2, consisting essentially of the composition, in percent by weight, in the range of:______________________________________ SiO.sub.2 95-99.5 Al 0.5 to 5.0.

Abstract: A method for processing a magnetic bubble domain device for hard bubble suppression comprising the steps of providing a non-magnetic substrate; providing a thin layer of magnetic material capable of supporting magnetic bubble domains on a first major surface of the substrate; and directing a beam of ions consisting essentially of a nongaseous ion at the substrate.

Abstract: A method of fabricating a microelectronic circuit device on a substrate by forming a layer of electrically and thermally conductive material (13) on a surface of a substrate (10). Channels are then etched in the layer of conductive material (13) to form patterns of the conductive material which are delineated from the remainder of the layer of conductive material.The channels are filled with an electrically insulating material (21, 22, 23) so as to form a substantially planar surface layer on the substrate. Finally, a microelectronic circuit device (e.g., 25) is formed on the substantially planar surface.

Abstract: A process for fabricating magnetic bubble domain devices having multiple layers. The process is a single high resolution mask process. A magnetizable layer, a conductive layer and at least one dielectric spacer layer are provided on a suitable magnetic bubble domain material and etched in a suitable manner such as by ion milling. The material layers may be applied such that the conductive layer is applied first and the magnetizable layer applied thereafter or vice versa.

Abstract: There is described a metal alloy which provides improved operating characteristics and parameters for, inter alia, magnetic bubble domain devices.