Patents by Inventor Robert F. CHENEY

Robert F. CHENEY has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • On Package Floating Metal/Stiffener Grounding to Mitigate RFI and SI Risks
    Publication number: 20160268213
    Abstract: An apparatus including a package including a die and a package substrate, the package substrate including a conductor; and a stiffener body electrically coupled to the conductor of the package substrate. An apparatus including a package including a die and a package substrate; a stiffener body coupled to the package substrate; and an electrically conductive path between the stiffener body and the package substrate. A method including electrically coupling a stiffener body to a conductor of a package substrate.
    Type: Application
    Filed: March 9, 2015
    Publication date: September 15, 2016
    Inventors: Hongjin JIANG, Robert STARKSTON, Digvijay A. RAORANE, Keith D. JONES, Ashish DHALL, Omkar G. KARHADE, Kedar DHANE, Suriyakala RAMALINGAM, Li-Sheng WENG, Robert F. CHENEY, Patrick N. STOVER