Patents by Inventor Robert F. Cobaugh

Robert F. Cobaugh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4133592
    Abstract: The disclosure relates to electrical connectors positioned between adjacent printed circuit boards for interconnection therebetween. The terminal arrangements on each printed circuit board are predesigned for compatibility with the connector to be used.In accordance with the first embodiment of the connector, a zero insertion force connector is positioned over outwardly extending pins from the printed circuit boards and is then locked to the pins by a camming action within the connector. In accordance with the second embodiment, the connector is formed in male and female halves, contact to the board by the connector being by means of a normal force engagement against pads on the printed circuit board. Extensions of lines to further adjacent printed circuit boards is provided by way of additional connectors of the same type mounted in the same manner.
    Type: Grant
    Filed: June 29, 1977
    Date of Patent: January 9, 1979
    Assignee: AMP Incorporated
    Inventors: Robert F. Cobaugh, Edward C. Dowling, Attalee S. Taylor
  • Patent number: 4087906
    Abstract: An electrical terminal structure is disclosed which is provided with a flow deposited quantity or band of solder adhered to a selected portion of the terminal and limited from spreading over the surface of the terminal by the presence of a solder-nonwettable material adjacent to but not necessarily touching the terminal. A method of mounting the banded electrical terminals in plated apertures provided in a substrate is also disclosed, wherein the solder bands are applied to the terminals according to the above mentioned application technique. A technique of flattening the solder bands, and the resulting terminal structures having flattened solder bands adhered thereto are also disclosed. Flattening of the solder bands facilitates insertion of the banded terminals into the plated apertures by changing the shape of the solder bands and by reducing their structural integrity through the creation of numerous hairline fractures.
    Type: Grant
    Filed: July 29, 1975
    Date of Patent: May 9, 1978
    Assignee: AMP Incorporated
    Inventors: Robert F. Cobaugh, Kenneth R. Parmer