Abstract: A method and system for dicing a semiconductor wafer providing a structure with greatly reduced backside chipping and cracking, as well as increased die strength. Semiconductor chip structures obtained from wafers diced according to this invention are also encompassed.

Abstract: Vehicle arresting beds, for installation at the ends of aircraft runways, are effective to safely decelerate aircraft entering the bed. The arresting bed is assembled of a large number of blocks of cellular concrete having predetermined compressive gradient strength, so that aircraft landing gear is subjected to drag forces effective to slow a variety of types of aircraft, while providing deceleration within a safe range of values. An arresting bed typically includes an entry region of a depth increasing from 9 to 24 inches formed of blocks having a first compressive gradient strength. A second region, which may be tapered into the first region and increase in depth to 30 inches, is formed of blocks having a greater compressive gradient strength. An aircraft thus experiences increasing drag forces while it travels through the bed, to provide an arresting capability suitable for a variety of aircraft.

Abstract: A method and system for dicing a semiconductor wafer providing a structure with greatly reduced backside chipping and cracking, as well as increased die strength. Semiconductor chip structures obtained from wafers diced according to this invention are also encompassed.

Abstract: A semiconductor structure with greatly reduced backside chipping and cracking, as well as increased die strength, accommodation of compact assembly with a carrier such as another semiconductor chip, and resistance to package damage is provided by dicing chips from a wafer in a manner that chamfers edges of the chips. Similar advantages are obtained in multi-chip structure.

Abstract: A method and system for dicing a semiconductor wafer providing a structure with greatly reduced backside chipping and cracking, as well as increased die strength. Semiconductor chip structures obtained from wafers diced according to this invention are also encompassed.

Abstract: A method and system for dicing a semiconductor wafer providing a structure with greatly reduced backside chipping and cracking, as well as increased die strength. Semiconductor chip structures obtained from wafers diced according to this invention are also encompassed.

Abstract: A method for sorting integrated circuit chips. At least one physical defect is detected in the semiconductor chips. The semiconductor chips are sorted based upon the physical defect.

Abstract: The propagation of a crack from the surface of the dielectric layer of an integrated circuit, through to the underlying circuit elements, is prevented by controlling the interface between the outermost, dielectric layer or layers and the inner layer or layers of the integrated circuit construction. The interface is weakened so that a crack that encounters the interface is caused to propagate in a horizontal manner, along the interface, preventing propagation of the crack in a direction that would be harmful to the manufactured article. This is preferably accomplished with multiple layers of material, each of which is made capable of redirecting (deflecting) the crack. Deflection of the crack, and arrest of the deflected crack along the interface, is made possible by controlling the fracture resistance of the interface.

Abstract: The propagation of a crack from the surface of the dielectric layer of an integrated circuit, through to the underlying circuit elements, is prevented by controlling the interface between the outermost, dielectric layer or layers and the inner layer or layers of the integrated circuit construction. The interface is weakened so that a crack that encounters the interface is caused to propagate in a horizontal manner, along the interface, preventing propagation of the crack in a direction that would be harmful to the manufactured article. This is preferably accomplished with multiple layers of material, each of which is made capable of redirecting (deflecting) the crack. Deflection of the crack, and arrest of the deflected crack along the interface, is made possible by controlling the fracture resistance of the interface.

Abstract: Vehicle arresting beds, for installation at the ends of aircraft runways, are effective to safely decelerate aircraft entering the bed. The arresting bed is assembled of a large number of blocks of cellular concrete having predetermined compressive gradient strength, so that aircraft landing gear is subjected to drag forces effective to slow a variety of types of aircraft, while providing deceleration within a safe range of values. An arresting bed typically includes an entry region of a depth increasing from 9 to 24 inches formed of blocks having a first compressive gradient strength. A second region, which may be tapered into the first region and increase in depth to 30 inches, is formed of blocks having a greater compressive gradient strength. An aircraft thus experiences increasing drag forces while it travels through the bed, to provide an arresting capability suitable for a variety of aircraft.

Abstract: Arresting material test apparatus, test probes and test methods enable testing of compressive gradient strength of cellular concrete, and materials having similar characteristics, on a continuous basis from the surface of a section to a typical internal penetration depth of at least 60 percent of thickness. Previous testing of cellular concrete typically focused on testing to confirm a minimum structural strength prior to structural failure or shattering of a test sample. For an aircraft arresting bed, for example, cellular concrete must exhibit a compressive gradient strength in a relatively narrow precalculated range continuously from the surface to penetration depth equal to 60 to 80 percent of sample thickness. Precalculated and controlled compressive gradient strength is critical to enabling an aircraft to be safely stopped within a set distance, without giving rise to drag forces exceeding main landing gear structural limits.

Abstract: A coupling device which allows for quickly changing electrical fixtures without rewiring. The quick change mounting fixture comprises a combined electrical and mechanical two-piece male and female fastening device. The invention allows for consumer as well as professional installation and detachment of fixtures by providing an easy and safe method. All wires and contacts are self contained and shielded from accidental contact. The invention comprises a female receptacle plate for mounting to a standard ceiling or wall mounted electrical junction box, a male tap support plate which also functions as a fixture support, a block terminal support, where contacts and wire routes are located, and a shield cover.