Patents by Inventor Robert F. Fullowan

Robert F. Fullowan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • RF circuit substrate comprised of guide portions made of photocurable layers and including a protruding surface features
    Patent number: 8299878
    Abstract: A radio frequency circuit structure for transmitting radio signals includes a lower guide portion having a plurality of photocurable layers deposited on a substrate and an upper guide portion interfacing with the lower guide portion to define a guiding geometry. The upper guide portion may also include a plurality of photocurable layers deposited on a second substrate. A method for fabricating the radio frequency circuit structure includes depositing the plurality of photocurable layers on the substrate. A portion of each photocurable layer of the plurality of photocurable layers is exposed to ultraviolet light to form a latent image. The plurality of photocurable layers is developed to remove the portions not exposed to ultraviolet light to form a guide portion. The guide portion may be metalized and closed to form a guiding geometry. A lower guide portion may be closed by an upper guide portion formed in substantially the same manner as the lower guide portion.
    Type: Grant
    Filed: September 30, 2009
    Date of Patent: October 30, 2012
    Assignee: Alcatel Lucent
    Inventors: Flavio Pardo, Robert F. Fullowan
  • Micromachined radio frequency circuit structures
    Publication number: 20110074528
    Abstract: A radio frequency circuit structure for transmitting radio signals includes a lower guide portion having a plurality of photocurable layers deposited on a substrate and an upper guide portion interfacing with the lower guide portion to define a guiding geometry. The upper guide portion may also include a plurality of photocurable layers deposited on a second substrate. A method for fabricating the radio frequency circuit structure includes depositing the plurality of photocurable layers on the substrate. A portion of each photocurable layer of the plurality of photocurable layers is exposed to ultraviolet light to form a latent image. The plurality of photocurable layers is developed to remove the portions not exposed to ultraviolet light to form a guide portion. The guide portion may be metalized and closed to form a guiding geometry. A lower guide portion may be closed by an upper guide portion formed in substantially the same manner as the lower guide portion.
    Type: Application
    Filed: September 30, 2009
    Publication date: March 31, 2011
    Applicant: Alcatel-Lucent USA Inc.
    Inventors: Flavio Pardo, Robert F. Fullowan