Abstract: An apparatus (100) for transferring heat from a first substrate (140) rotatably mounted to a second substrate (150). The apparatus (100) is comprised of at least a first fin ring (145) disposed concentrically on a first side surface (141) of the first substrate (140). A plurality of heat generating devices (130) is disposed on a second side surface (142) of the first substrate (140). There is at least a second fin ring (155) disposed concentrically on a first side surface (151) of the second substrate (150). The first fin ring (145) interleaves with the second fin ring (155) while allowing the first substrate (140) to rotate unobstructed relative to the second substrate (150). The second substrate (150) has at least a first port (160) for introducing moving air into a gap (G) defined between the first fin ring (145) and the second fin ring (155) for improving heat convection there between.

Abstract: An apparatus (100) for transferring heat from a first substrate (140) rotatably mounted to a second substrate (150). The apparatus (100) is comprised of at least a first fin ring (145) disposed concentrically on a first side surface (141) of the first substrate (140). A plurality of heat generating devices (130) is disposed on a second side surface (142) of the first substrate (140). There is at least a second fin ring (155) disposed concentrically on a first side surface (151) of the second substrate (150). The first fin ring (145) interleaves with the second fin ring (155) while allowing the first substrate (140) to rotate unobstructed relative to the second substrate (150). The second substrate (150) has at least a first port (160) for introducing moving air into a gap (G) defined between the first fin ring (145) and the second fin ring (155) for improving heat convection there between.

Abstract: An electrical connector for electrical connection to conductive members of a ceramic chip carrier comprises first and second dielectric frame members each of which has opposed side members in which electrical terminal posts are secured at spaced intervals with top sections extending above upper surfaces of the side members and bottom sections extending below bottom surfaces of the side members. Rail members extend between respective side members of each of the frame members so that when the frame members are nested together the rail members of one of the frame members are disposed in engagement with the rail members of the other of the frame members. Latching members on each of the frame members latch the frame members together thereby forming a chip carrier-receiving area so that the top sections of the terminal posts can be electrically connected to respective conductive members when the ceramic chip carrier is positioned within the chip carrier-receiving area.

Abstract: A modular receptacle housing is formed by four identical housing modules of molded rigid insulative material, which modules are interlocked to form a single housing. Each housing module carries a plurality of receptacle terminals. The arrangement of modules can readily be adopted to accommodate a wide variety of pin counts and configurations.

Abstract: An electrical connector for electrical connection to conductive members of a ceramic chip carrier comprises first and second dielectric frame members each of which has opposed side members in which electrical terminal posts are secured at spaced intervals with top sections extending above upper surfaces of the side members and bottom sections extending below bottom surfaces of the side members. Rail members extend between respective side members of each of the frame members so that when the frame members are nested together the rail members of one of the frame members are disposed in engagement with the rail members of the other of the frame members. Latching members on each of the frame members latch the frame members together thereby forming a chip carrier-receiving area so that the top sections of the terminal posts can be eletrically connected to respective conductive members when the ceramic chip carrier is positioned within the chip carrier-receiving area.