Abstract: A digital micromirror device includes a plurality of micromirror cells on a semiconductor die. Each respective cell includes a memory circuit and an electrode selection circuit. At least some of the micromirror cells include a micromirror and each respective memory circuit controls a micromirror tilt angle. For a given memory circuit controlled to a first tilt angle, a measurement circuit measures a first value indicative of a capacitance between a first electrode and the micromirror and measures a second value indicative of a capacitance on the second electrode. For a second micromirror tilt angle, the measurement circuit measures a third value indicative of a capacitance between the first electrode and the micromirror and measures a fourth value indicative of a capacitance on the second electrode. The measurement circuit generates a signal indicative of whether the micromirror is stuck at a particular angle or missing.

Abstract: A digital micromirror device includes a plurality of micromirror cells on a semiconductor die. Each respective cell includes a memory circuit and an electrode selection circuit. At least some of the micromirror cells include a micromirror and each respective memory circuit controls a micromirror tilt angle. For a given memory circuit controlled to a first tilt angle, a measurement circuit measures a first value indicative of a capacitance between a first electrode and the micromirror and measures a second value indicative of a capacitance on the second electrode. For a second micromirror tilt angle, the measurement circuit measures a third value indicative of a capacitance between the first electrode and the micromirror and measures a fourth value indicative of a capacitance on the second electrode. The measurement circuit generates a signal indicative of whether the micromirror is stuck at a particular angle or missing.

Abstract: An apparatus is provided. There is a circuit assembly with a package substrate and an integrated circuit (IC). The package substrate has a microstrip line, and the IC is secured to the package substrate and is electrically coupled to the microstrip line. A circuit board is also secured to the package substrate. A dielectric waveguide is secured to the circuit board. The dielectric waveguide has a dielectric core that extends into a transition region located between the dielectric waveguide and the microstrip line, and the microstrip line is configured to form a communication link with the dielectric waveguide.

Abstract: An apparatus is provided. There is a circuit assembly with a package substrate and an integrated circuit (IC). The package substrate has a microstrip line, and the IC is secured to the package substrate and is electrically coupled to the microstrip line. A circuit board is also secured to the package substrate. A dielectric waveguide is secured to the circuit board. The dielectric waveguide has a dielectric core that extends into a transition region located between the dielectric waveguide and the microstrip line, and the microstrip line is configured to form a communication link with the dielectric waveguide.

Abstract: An apparatus is provided. There is a circuit assembly with a package substrate and an integrated circuit (IC). The package substrate has a microstrip line, and the IC is secured to the package substrate and is electrically coupled to the microstrip line. A circuit board is also secured to the package substrate. A dielectric waveguide is secured to the circuit board. The dielectric waveguide has a dielectric core that extends into a transition region located between the dielectric waveguide and the microstrip line, and the microstrip line is configured to form a communication link with the dielectric waveguide.

Abstract: To date, bandwidth mismatch within time-interleaved (TI) analog-to-digital converters (ADCs) has been largely ignored because compensation for bandwidth mismatch is performed by digital post-processing, namely finite impulse response filters. However, the lag from digital post-processing is prohibitive in high speed systems, indicating a need for blind mismatch compensation. Even with blind bandwidth mismatch estimation, though, adjustment of the filter characteristics of track-and-hold (T/H) circuits within the TI ADCs can be difficult. Here, a T/H circuit architecture is provided that uses variations of the gate voltage of a sampling switch (which varies the “on” resistance of the sampling switch) to change the bandwidth of the T/H circuits so as to precisely match the bandwidths.

Abstract: A method is provided. A multi-amplitude signal is received and downconverted so as to generate I and Q signals using a local oscillator signal. The I and Q signals are equalized, and the equalized I and Q signals are digitized. First and second gains are adjusted with the second and first digital signals, respectively, and applied to the equalized I and Q signals, respectively. The difference between the first and second amplified signals is determined, and an error signal is generated from the difference between the first and second amplified signals. The local oscillator signal is then adjusted with the error signal.

Abstract: A track-and-hold circuit is provided. This track-and-hold circuit is adapted to track an analog input signal and hold a sampled voltage of the analog input signal at a sampling instant for processing by other circuitry, in response to a track signal that alternates with a hold signal. Preferably, the track-and-hold circuit includes a bi-directional current source that sources and sinks current through a first output node and a second output node, a unity gain amplifier that is coupled to first and second output nodes of the bi-directional current source and that receives the analog input signal, a resistor coupled to an output of the unity gain amplifier, and a capacitor coupled between the resistor and ground. Of interest, however, is the bi-directional current source, which includes a differential input circuit that is adapted to receive the track signal and the hold signal and that is coupled to the first and second output nodes and an RC network that is coupled to the differential input circuit.

Abstract: A method for equalizing a received signal is provided. The signal is filtered and transmitted over a channel using an encoding scheme, where the encoding scheme has transmit symbols. This transmitted signal is then shaped such that the filtering and equalization adjust a set of taps in an equalization window so that the taps from the set are substantially equal to one another. Inter-symbol interference is then compensated for in the equalized signal using a speculative DFE with significantly reduced comparator levels.

Abstract: A method is provided. A multi-amplitude signal is received and downconverted so as to generate I and Q signals using a local oscillator signal. The I and Q signals are equalized, and the equalized I and Q signals are digitized. First and second gains are adjusted with the second and first digital signals, respectively, and applied to the equalized I and Q signals, respectively. The difference between the first and second amplified signals is determined, and an error signal is generated from the difference between the first and second amplified signals. The local oscillator signal is then adjusted with the error signal.

Abstract: A method for compensator for comparator offset is provided. A first propagation delay for a first signal traversing a comparator to a first output terminal of the comparator and a second propagation delay for a second signal traversing the comparator to a second output terminal of the comparator are measured. The first and second propagation delays are then compared to generate a comparison result, and the comparator is adjusted to compensate for an input voltage offset based at least in part on the comparison result.

Abstract: An apparatus for comparing differential input signal inputs is provided. The apparatus comprises a CMOS sense amplifier (which has having a first input terminal, a second input terminal, a first output terminal, and a second output terminal), a first output circuit (which has a first load capacitance), a second output circuit (which has a second load capacitance), and an isolation circuit. The isolation circuit is coupled between the first output terminal of the CMOS sense amplifier and the first output circuit and is coupled between the second output terminal of the CMOS sense amplifier and the second output terminal of the CMOS sense amplifier. The isolation circuit isolates the first and second load capacitances from the CMOS sense amplifier.

Abstract: An apparatus is provided. There is a circuit assembly with a package substrate and an integrated circuit (IC). The package substrate has a microstrip line, and the IC is secured to the package substrate and is electrically coupled to the microstrip line. A circuit board is also secured to the package substrate. A dielectric waveguide is secured to the circuit board. The dielectric waveguide has a dielectric core that extends into a transition region located between the dielectric waveguide and the microstrip line, and the microstrip line is configured to form a communication link with the dielectric waveguide.

Abstract: An apparatus is provided. There is a circuit assembly with a package substrate and an integrated circuit (IC). The package substrate has a microstrip line, and the IC is secured to the package substrate and is electrically coupled to the microstrip line. A circuit board is also secured to the package substrate. A dielectric waveguide is secured to the circuit board. The dielectric waveguide has a dielectric core that extends into a transition region located between the dielectric waveguide and the microstrip line, and the microstrip line is configured to form a communication link with the dielectric waveguide.

Abstract: An apparatus is provided. There is a circuit assembly with a package substrate and an integrated circuit (IC). The package substrate has a microstrip line, and the IC is secured to the package substrate and is electrically coupled to the microstrip line. A circuit board is also secured to the package substrate. A dielectric waveguide is secured to the circuit board. The dielectric waveguide has a dielectric core that extends into a transition region located between the dielectric waveguide and the microstrip line, and the microstrip line is configured to form a communication link with the dielectric waveguide.

Abstract: An apparatus is provided. The apparatus comprises backend circuitry and pairs of redundant input circuits. Each pair of redundant input circuits is configured to form a differential pair of transistors, and each redundant input circuit includes a multiplexer and a set of transistors. The multiplexer is coupled to the backend circuitry, and each transistor from the set of transistors has a first passive electrode, a second passive electrode, and a control electrode. The first passive electrode of each transistor from the set of transistors is coupled to the multiplexer, and the control electrodes from the set of transistors are coupled together.

Abstract: An apparatus for comparing differential input signal inputs is provided. The apparatus comprises a CMOS sense amplifier (which has having a first input terminal, a second input terminal, a first output terminal, and a second output terminal), a first output circuit (which has a first load capacitance), a second output circuit (which has a second load capacitance), and an isolation circuit. The isolation circuit is coupled between the first output terminal of the CMOS sense amplifier and the first output circuit and is coupled between the second output terminal of the CMOS sense amplifier and the second output terminal of the CMOS sense amplifier. The isolation circuit isolates the first and second load capacitances from the CMOS sense amplifier.

Abstract: A method for compensator for comparator offset is provided. A first propagation delay for a first signal traversing a comparator to a first output terminal of the comparator and a second propagation delay for a second signal traversing the comparator to a second output terminal of the comparator are measured. The first and second propagation delays are then compared to generate a comparison result, and the comparator is adjusted to compensate for an input voltage offset based at least in part on the comparison result.

Abstract: A method for equalizing a received signal is provided. The signal is filtered and transmitted over a channel using an encoding scheme, where the encoding scheme has transmit symbols. This transmitted signal is then shaped such that the filtering and equalization adjust a set of taps in an equalization window so that the taps from the set are substantially equal to one another. Inter-symbol interference is then compensated for in the equalized signal using a speculative DFE with significantly reduced comparator levels.

Abstract: An apparatus is provided. The apparatus comprises backend circuitry and pairs of redundant input circuits. Each pair of redundant input circuits is configured to form a differential pair of transistors, and each redundant input circuit includes a multiplexer and a set of transistors. The multiplexer is coupled to the backend circuitry, and each transistor from the set of transistors has a first passive electrode, a second passive electrode, and a control electrode. The first passive electrode of each transistor from the set of transistors is coupled to the multiplexer, and the control electrodes from the set of transistors are coupled together.