Patents by Inventor Robert F. Quinn

Robert F. Quinn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10191676
    Abstract: The disclosure is directed to protecting data of a scalable storage system. A scalable storage system includes a plurality of nodes, each of the nodes having directly-attached storage (DAS), such as one or more hard-disk drives and/or solid-state disk drives. The nodes are coupled via an inter-node communication network, and a substantial entirety of the DAS is globally accessible by each of the nodes. The DAS is protected utilizing intra-node protection to keep data stored in the DAS reliable and globally accessible in presence of a failure within one of the nodes. The DAS is further protected utilizing inter-node protection to keep data stored in the DAS reliable and globally accessible if at least one of the nodes fails.
    Type: Grant
    Filed: February 22, 2017
    Date of Patent: January 29, 2019
    Assignee: Seagate Technology LLC
    Inventors: Earl T. Cohen, Robert F. Quinn
  • Publication number: 20170160967
    Abstract: The disclosure is directed to protecting data of a scalable storage system. A scalable storage system includes a plurality of nodes, each of the nodes having directly-attached storage (DAS), such as one or more hard-disk drives and/or solid-state disk drives. The nodes are coupled via an inter-node communication network, and a substantial entirety of the DAS is globally accessible by each of the nodes. The DAS is protected utilizing intra-node protection to keep data stored in the DAS reliable and globally accessible in presence of a failure within one of the nodes. The DAS is further protected utilizing inter-node protection to keep data stored in the DAS reliable and globally accessible if at least one of the nodes fails.
    Type: Application
    Filed: February 22, 2017
    Publication date: June 8, 2017
    Inventors: Earl T. Cohen, Robert F. Quinn
  • Patent number: 9613656
    Abstract: The disclosure is directed to protecting data of a scalable storage system. A scalable storage system includes a plurality of nodes, each of the nodes having directly-attached storage (DAS), such as one or more hard-disk drives and/or solid-state disk drives. The nodes are coupled via an inter-node communication network, and a substantial entirety of the DAS is globally accessible by each of the nodes. The DAS is protected utilizing intra-node protection to keep data stored in the DAS reliable and globally accessible in presence of a failure within one of the nodes. The DAS is further protected utilizing inter-node protection to keep data stored in the DAS reliable and globally accessible if at least one of the nodes fails.
    Type: Grant
    Filed: November 29, 2012
    Date of Patent: April 4, 2017
    Assignee: Seagate Technology LLC
    Inventors: Earl T. Cohen, Robert F. Quinn
  • Publication number: 20140207743
    Abstract: A method for storage driven de-duplication of server memory comprises configuring a storage controller, as part of each IO operation, to generate a unique signature for each data page passing through the controller. The method associates the signature with the data page and stores the associated page and signature. The signature is added to a signature queue for signature match analysis with signatures stored in server memory. Signature analysis is limited to read-only pages to speed up analysis of pages more likely to be duplicates. Once a duplicate page is found, a page table is updated to point to the match page and the duplicate page is added to a free list.
    Type: Application
    Filed: January 31, 2013
    Publication date: July 24, 2014
    Applicant: LSI Corporation
    Inventor: Robert F. Quinn
  • Publication number: 20140064048
    Abstract: The disclosure is directed to protecting data of a scalable storage system. A scalable storage system includes a plurality of nodes, each of the nodes having directly-attached storage (DAS), such as one or more hard-disk drives and/or solid-state disk drives. The nodes are coupled via an inter-node communication network, and a substantial entirety of the DAS is globally accessible by each of the nodes. The DAS is protected utilizing intra-node protection to keep data stored in the DAS reliable and globally accessible in presence of a failure within one of the nodes. The DAS is further protected utilizing inter-node protection to keep data stored in the DAS reliable and globally accessible if at least one of the nodes fails.
    Type: Application
    Filed: November 29, 2012
    Publication date: March 6, 2014
    Applicant: LSI Corporation
    Inventors: Earl T. Cohen, Robert F. Quinn
  • Patent number: 6087784
    Abstract: The present invention relates to a glass envelope for an illuminating device, the glass envelope comprising a gas channel, a pair of electrodes in communication with the gas channel and a glow-discharge lamp as a source of free electrons coupled to the glass envelope to assist the starting of the illuminating device in dark conditions, for example at night. Preferably, the glass envelope has a front and back surface laminated and integrated together to form a unitary body essentially free of any sealing materials.
    Type: Grant
    Filed: June 22, 1999
    Date of Patent: July 11, 2000
    Assignee: Corning Incorporated
    Inventors: Robert F. Quinn, Jose Mario Quintal
  • Patent number: 4667219
    Abstract: A semiconductor chip module for a semiconductor chip having an exposed front face with a two dimensional array of contacts is disclosed. A connector plate is located proximate the front face of the chip. The connector plate has a plurality of apertures which correspond to and are aligned with the contacts of the semiconductor chip. A plurality of transmission elements are located proximate the connector plate opposite from the semiconductor chip. A plurality of flexible conductors extend through the respective apertures of the connector plate. The flexible conductors are electrically coupled to the contacts of the chip and to the transmission elements.
    Type: Grant
    Filed: April 27, 1984
    Date of Patent: May 19, 1987
    Assignee: Trilogy Computer Development Partners, Ltd.
    Inventors: James C. K. Lee, Gene M. Amdahl, Richard L. Beck, Robert F. Quinn, Jerzy R. Sochor