Abstract: A test chip module for testing the integrity of the flp chip solder ball interconnections between chip and substrate. The interconnections, are thermally stressed through an array of individual heaters formed in a layer of chip metallurgy to provide a uniform and ubiquitous source of heat. Current is passed through the interconnection to be tested by a current supply circuit using one signal I/O interconnection and the voltage drop across the interconnection to be tested from the current passed therethrough is measured by a voltage measuring circuit connected through another signal I/O interconnection. Stress initiating cracking and degradation at the interconnection creates a measurable change in voltage drop across the interconnection.

Abstract: A test chip module for testing the integrity of the flip chip solder ball interconnections between chip and substrate. The interconnections are thermally stressed through an array of individual heaters formed in a layer of chip metallurgy to provide a uniform and ubiquitous source of heat. Current is passed through the interconnection to be tested by a current supply circuit using one signal I/O interconnection and the voltage drop across the interconnection to be tested from the current passed therethrough is measured by a voltage measuring circuit connected through another signal I/O interconnection. Stress initiating cracking and degradation at the interconnection creates a measurable change in voltage drop across the interconnection.

Abstract: A method and structure for coupling a semiconductor substrate (e.g., a semiconductor chip) to an organic substrate (e.g., a chip carrier). The coupling interfaces a solder member (e.g., a solder ball) to both a conductive pad on the semiconductor substrate and a conductive pad on the organic substrate. Thermal strains on the solder member during thermal cycling may be reduced by having a surface area of the pad on the semiconductor substrate exceed a surface area of the pad on the organic substrate. Thermal strains on the solder member during thermal cycling may also be reduced by having a distance from a centerline of the solder member to a closest lateral edge of the semiconductor substrate exceed about 0.25 mm.

Abstract: A test chip module for testing the integrity of the flip chip solder ball interconnections between chip and substrate. The interconnections are thermally stressed through an array of individual heaters formed in a layer of chip metallurgy to provide a uniform and ubiquitous source of heat. Current is passed through the interconnection to be tested by a current supply circuit using one signal I/O interconnection and the voltage drop across the interconnection to be tested from the current passed therethrough is measured by a voltage measuring circuit connected through another signal I/O interconnection. Stress initiating cracking and degradation at the interconnection creates a measurable change in voltage drop across the interconnection.

Abstract: A method and structure for coupling a semiconductor substrate (e.g., a semiconductor chip) to an organic substrate (e.g., a chip carrier). The coupling interfaces a solder member (e.g., a solder ball) to both a conductive pad on the semiconductor substrate and a conductive pad on the organic substrate. Thermal strains on the solder member during thermal cycling may be reduced by having a surface area of the pad on the semiconductor substrate exceed a surface area of the pad on the organic substrate. Thermal strains on the solder member during thermal cycling may also be reduced by having a distance from a centerline of the solder member to a closest lateral edge of the semiconductor substrate exceed about 0.25 mm.

Abstract: A method and structure for coupling a semiconductor substrate (e.g., a semiconductor chip) to an organic substrate (e.g., a chip carrier). The coupling interfaces a solder member (e.g., a solder ball) to both a conductive pad on the semiconductor substrate and a conductive pad on the organic substrate. Thermal strains on the solder member during thermal cycling may be reduced by having a surface area of the pad on the semiconductor substrate exceed a surface area of the pad on the organic substrate. Thermal strains on the solder member during thermal cycling may also be reduced by having a distance from a centerline of the solder member to a closest lateral edge of the semiconductor substrate exceed about 0.25 mm.

Abstract: A cordless drive mechanism for use in a top rail of a shade having inherent spring characteristics. The drive mechanism includes a constant torque spring assembly, at least two tape spool assemblies, and a brake/clutch mechanism, all interconnected via a shaft. The shaft is driven by at least one spring assembly to drive the tape spool assembly, which retracts a bottom rail of the shade by acting as a reel upon which tape is wound. The brake/clutch assembly locks the shade into a position desired by the user, and applies a braking force to the shaft when the shade is retracting, forcing a virtually constant retraction speed. The constant torque spring assembly is modular, constructed of identical housing pieces, a spring take-up spool and a rolled constant torque spring. More spring assemblies may be added to the drive mechanism for larger and heavier shades.

Abstract: A gas turbine engine acoustic noise damping mount on a helicopter airframe includes a first outboard washer assembly with metallic inner and outer washers having a thin layer of elastomer bonded therebetween; an inboard bushing assembly has telescoped inner and outer metallic bushings with a thin layer of elastomer bonded therebetween; an engine trunnion is supported by the inner bushing; and flat inboard faces on the washer assembly and inboard bushing assembly are held against either side of an airframe strut by a nut threaded to the trunnion. The inboard bushing assembly includes a tubular extension pilot guided within an engine strut whereby the thin layers of elastomer serve to interrupt transmission of structure borne sound from engine to airframe.

Abstract: Disclosed is electrical plug ejecting apparatus having an elongated housing adapted to transversely retain the electrical plug, the housing defining a pair of spaced compartments disposed on opposite sides of the retained plug with ejector springs latchably retained within the compartments by trap doors tripably released by pivotal movement of a trip lever in response to the lateral movement of the line cord coupled to the electrical plug.