Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a system condition engine and non-volatile memory. The system condition engine is configured to monitor a condition associated with an electronic device and non-volatile memory. The non-volatile memory can store a predetermined specification range or a specification threshold for the condition and when the condition is outside of the predetermined specification range or exceeds the specification threshold, the system condition engine can record that the condition was outside of the predetermined specification range or exceeded the specification threshold in the non-volatile memory. In an example, the non-volatile memory may be a fuse, especially a field programmable fuse.

Abstract: A radiation imaging system comprising a scintillator, an imager array, and a lamination layer. Lamination layer bonds and optically couples scintillator to imager array. Lamination layer is comprised of a lamination material that is substantially free from void spaces. Radiation imaging system fabrication comprises the steps of disposing lamination layer between a light imager and a scintillator to form a subassembly. Light imager comprises imager array, an imaging plate surface and a plurality of contact pads. Additional steps include subjecting subassembly to a vacuum; heating subassembly to a bonding temperature, exerting a bonding force on subassembly, maintaining the vacuum, the bonding temperature and the bonding force until light imager is bonded to the scintillator and the lamination layer is comprised of lamination material that is substantially free from void spaces.

Abstract: A solid state imager is provided that comprises an imaging array of gated photodiodes. The imager comprises a plurality of photosensor pixels arranged in a pixel array, and each of the photosensor pixels includes a photodiode having a sidewall, the sidewall having a gate dielectric layer disposed thereon, and a field plate disposed around the photodiode body. The field plate comprises amorphous silicon disposed on the gate dielectric layer and extends substantially completely around the sidewall of said photodiode. The field plate is electrically coupled to the common electrode of the imaging array so that the field plate creates an electric field around the photodiode body in correspondence with the potential of said common electrode. A method of fabricating the gated photodiode array is also provided.

Abstract: A method and apparatus for displaying an image generated by at least one detector of an imaging unit are disclosed herein. The method includes creating a pixel map identifying locations of bad pixels in an array of pixels in the image detected by the at least one detector, linking the pixel map to the image, and providing for selective display of the pixel map. Bad pixels behave from a group including pixels which do not respond electrically and pixels which are statistically different from surrounding pixels in the array of pixels. The apparatus includes an imaging unit for generating x-rays which pass through a body of interest, at least one detector unit for detecting the x-rays, and a processing unit for identifying bad pixels within the detected image.

Abstract: In an imager having an array of light-sensitive elements and employing striped common electrodes, exposed edges of preimidized polyimide layers above the light-sensitive imaging elements are sealed with the material of the common electrode (e.g., indium tin oxide). Similarly, exposed preimidized polyimide edges in electrical contacts for the array and bridge members electrically coupling adjacent light-sensitive imaging elements are also sealed with the material of the common electrode.

Abstract: A method and apparatus for displaying an image generated by at least one detector of an imaging unit are disclosed herein. The method includes creating a pixel map identifying locations of bad pixels in an array of pixels in the image detected by the at least one detector, linking the pixel map to the image, and providing for selective display of the pixel map. Bad pixels behave from a group including pixels which do not respond electrically and pixels which are statistically different from surrounding pixels in the array of pixels. The apparatus includes an imaging unit for generating x-rays which pass through a body of interest, at least one detector unit for detecting the x-rays, and a processing unit for identifying bad pixels within the detected image.

Abstract: A radiation imaging system comprising a scintillator, an imager array, and a lamination layer. Lamination layer bonds and optically couples scintillator to imager array. Lamination layer is comprised of a lamination material that is substantially free from void spaces. Radiation imaging system fabrication comprises the steps of disposing lamination layer between a light imager and a scintillator to form a subassembly. Light imager comprises imager array, an imaging plate surface and a plurality of contact pads. Additional steps include subjecting subassembly to a vacuum; heating subassembly to a bonding temperature, exerting a bonding force on subassembly, maintaining the vacuum, the bonding temperature and the bonding force until light imager is bonded to the scintillator and the lamination layer is comprised of lamination material that is substantially free from void spaces.

Abstract: In an imager having an array of light-sensitive elements and employing striped common electrodes, exposed edges of preimidized polyimide layers above the light-sensitive imaging elements are sealed with the material of the common electrode (e.g., indium tin oxide). Similarly, exposed preimidized polyimide edges in electrical contacts for the array and bridge members electrically coupling adjacent light-sensitive imaging elements are also sealed with the material of the common electrode.

Abstract: In an imager having an array of light-sensitive elements and employing striped common electrodes, exposed edges of preimidized polyimide layers above the light-sensitive imaging elements are sealed with the material of the common electrode (e.g., indium tin oxide). Similarly, exposed preimidized polyimide edges in electrical contacts for the array and bridge members electrically coupling adjacent light-sensitive imaging elements are also sealed with the material of the common electrode.

Abstract: A radiation imager is disclosed that is resistant to degradation due to moisture by either contact pad corrosion, guard ring corrosion or by photodiode leakage. A contact pad of a large area imager is disclosed that is formed into three distinct and electrically connected regions. The resulting structure of the contact pad regions forms reliable contact that is resistant to corrosion damage. Also disclosed is a data line of an imager, or a display, the resistance of which is reduced by patterning an aluminum (Al) line on top of a transistor island structure, with the formed data line preferably being encapsulated. In addition, a guard ring having first and second regions and photosensitive element are disclosed. The second region comprises an electrical contact between ITO and underlying metal and a second tier which acts as a moisture barrier and is preferably disposed at the corner of the guard ring and separated from the contact pads of the imager in such a manner as to minimize corrosion.

Abstract: RD-25953-17-A method of fabricating an imager array having a plurality of pixels is provided in which each pixel is made up of a photodiode and a corresponding thin film transistor (TFT) switching device, the method including the steps of depositing materials to form the photodiode island and to form a TFT body over a gate electrode, then depositing a layer of source/drain metal over the silicon layers of the TFT body, and over a common dielectric layer, removing sections of the source/drain metal layer to expose a portion of the silicon layers of the TFT body, but leaving regions of sacrificial source/drain metal over the photodiode islands, and forming a back channel in the TFT body by a back channel etch step. The method further includes then removing the sacrificial regions of source/drain metal from above the photodiode islands, and depositing a passivation layer over the entire exposed surface of the array.

Abstract: An apparatus and method are provided for sealing a light imaging array and scintillator of an imaging device which prevents light or moisture from entering the sealed cavity while controlling the lateral expansion of the epoxy material during construction. The seal is formed by dispensing a bead of epoxy around substantially the entire perimeter of the active imaging array and scintillator, leaving a slight gap therein. A cover plate is then placed over the scintillator and imaging array to protect against light or moisture entering the sealed cavity from the side of the substrate that is sealed. As the cover plate is attached, it compresses the epoxy. During compression, pressure builds within the sealed cavity. However, the pressure is allowed to escape through the gap in the epoxy bead. The pressure release lowers the outward force against the epoxy bead, which in turn limits the lateral expansion of the epoxy.

Abstract: In a digital x-ray imager alignment method, a low exposure x-ray image of an object is taken. The dose is sufficient to create an image of an object and alignment bars on an antiscatter grid. The relative position of the alignment bars on the image is measured. The relative angle of the detector to the x-ray source is adjusted. This adjustment brings the grid into alignment with the x-ray source. A diagnostic x-ray exposure image of the object is then taken.

Abstract: A radiation imager includes a light sensitive imaging array, a barrier layer formed over the light sensitive imaging array, a continuous polymer layer formed over the barrier layer, and a scintillator formed directly on the continuous polymer layer. The continuous polymer layer improves the adherence of the scintillator by reducing delamination especially under adverse environmental conditions.

Abstract: In a digital x-ray imager alignment method, a low exposure x-ray image of an object is taken. The dose is sufficient to create an image of an object and alignment bars on an antiscatter grid. The relative position of the alignment bars on the image is measured. The relative angle of the detector to the x-ray source is adjusted. This adjustment brings the grid into alignment with the x-ray source. A diagnostic x-ray exposure image of the object is then taken.

Abstract: RD-25953-17-A method of fabricating an imager array having a plurality of pixels is provided in which each pixel is made up of a photodiode and a corresponding thin film transistor (TFT) switching device, the method including the steps of depositing materials to form the photodiode island and to form a TFT body over a gate electrode, then depositing a layer of source/drain metal over the silicon layers of the TFT body, and over a common dielectric layer, removing sections of the source/drain metal layer to expose a portion of the silicon layers of the TFT body, but leaving regions of sacrificial source/drain metal over the photodiode islands, and forming a back channel in the TFT body by a back channel etch step. The method further includes then removing the sacrificial regions of source/drain metal from above the photodiode islands, and depositing a passivation layer over the entire exposed surface of the array.

Abstract: A light block material disposed over the photosensitive region of a switching device (e.g., TFT) of a radiation imager is disclosed. The light block material prevents optical photons emitted from a scintillator from passing into the switching device and being absorbed. Cross-talk and noise in the imager are thereby reduced. Also, non-linear pixel response and spurious signals passing to readout electronics are avoided. Optionally, opaque caps comprising the same light block material may be included in the imager structure. The caps cover contact vias filled with a common electrode and located in the contact finger region of the imager. The integrity of the filled vias is thereby maintained during subsequent processing. Also disclosed is a radiation imager containing these structures.

Abstract: A radiation imager is disclosed that is resistant to degradation due to moisture by either contact pad corrosion, guard ring corrosion or by photodiode leakage. A contact pad of a large area imager is disclosed that is formed into three distinct and electrically connected regions. The resulting structure of the contact pad regions forms reliable contact that is resistant to corrosion damage. Also disclosed is a data line of an imager, or a display, the resistance of which is reduced by patterning an aluminum (Al) line on top of a transistor island structure, with the formed data line preferably being encapsulated. In addition, a guard ring having first and second regions and photosensitive element are disclosed. The second region comprises an electrical contact between ITO and underlying metal and a second tier which acts as a moisture barrier and is preferably disposed at the corner of the guard ring and separated from the contact pads of the imager in such a manner as to minimize corrosion.

Abstract: A radiation imager is disclosed that is resistant to degradation due to moisture by either contact pad corrosion, guard ring corrosion or by photodiode leakage. A contact pad of a large area imager is disclosed that is formed into three distinct and electrically connected regions. The resulting structure of the contact pad regions forms reliable contact that is resistant to corrosion damage. Also disclosed is a data line of an imager, or a display, the resistance of which is reduced by patterning an aluminum (Al) line on top of a transistor island structure, with the formed data line preferably being encapsulated. In addition, a guard ring having first and second regions and photosensitive element are disclosed. The second region comprises an electrical contact between ITO and underlying metal and a second tier which acts as a moisture barrier and is preferably disposed at the corner of the guard ring and separated from the contact pads of the imager in such a manner as to minimize corrosion.

Abstract: A radiation imager is disclosed that is resistant to degradation due to moisture by either contact pad corrosion, guard ring corrosion or by photodiode leakage. A contact pad of a large area imager is disclosed that is formed into three distinct and electrically connected regions. The resulting structure of the contact pad regions forms reliable contact that is resistant to corrosion damage. Also disclosed is a data line of an imager, or a display, the resistance of which is reduced by patterning an aluminum (Al) line on top of a transistor island structure, with the formed data line preferably being encapsulated. In addition, a guard ring having first and second regions and photosensitive element are disclosed. The second region comprises an electrical contact between ITO and underlying metal and a second tier which acts as a moisture barrier and is preferably disposed at the corner of the guard ring and separated from the contact pads of the imager in such a manner as to minimize corrosion.