Patents by Inventor Robert Franklin Williams, Jr.

Robert Franklin Williams, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for manufacture of laminates which are useful as packaging materials
    Patent number: 4119479
    Abstract: Heat-sealable laminates useful as packaging materials, for example, for the packaging of photographic processing chemicals, are comprised of a metal foil, a thermoplastic polymeric film, and an interlayer formed by radiation curing of a composition comprising an acrylated epoxy resin. The laminates are manufactured by a process which comprises forming a sandwich comprising a layer of metal foil, a layer of thermoplastic polymer and an interlayer formed from a composition comprising an acrylated epoxy resin and irradiating the interlayer through the layer of thermoplastic polymer, for example by the use of ultraviolet radiation or high energy ionizing radiation, to cure the interlayer and bond it to both the layer of metal foil and the layer of thermoplastic polymer.
    Type: Grant
    Filed: June 23, 1977
    Date of Patent: October 10, 1978
    Assignee: Eastman Kodak Company
    Inventors: Robert Franklin Williams, Jr., Chen-i Lu