Abstract: Embodiments of the disclosure pertain to a multi-layer barrier for a flexible substrate supporting electronic and/or microelectromechanical system (MEMS) devices. Apparatuses including a substrate, a first metal nitride layer, a first oxide layer on or over the first metal nitride layer, a second metal nitride layer and a second oxide layer on or over the first oxide layer, and a device layer on or over the first oxide layer or both the first and second oxide layers are disclosed. When the device layer is on or over the first oxide layer, the second metal nitride layer is on or over the device layer, and the second oxide layer is on or over the on or over the second metal nitride layer. When the device layer is on or over both the first and second oxide layers, the second metal nitride layer is on or over the second oxide layer. A method of making the same is also disclosed.

Abstract: A customizable cap that includes: a head portion; a removable bill removably attached to the head portion; a top button, wherein the top button removably attaches to the cap; a means to attach the bill to the cap; and a size adjustment strap, where the size adjustment strap is capable of being removed or interchanged. The means to attach the bill and includes hook-and-loop fasteners on the cap and the removable bill. The top button also includes a flexible strap and a locking mechanism for the top button to attach to the cap.

Abstract: The present invention relates to an extendable folding saw that is lightweight and compact when retracted yet rigid when extended. In one embodiment, the extendable folding saw can have a folding saw and a removably attached extension. The folding saw can have a grip and a pivotally attached saw. The extension can comprise several members that are compactable to a length not much greater than the length of the longest individual member. The members of the extension can have a generally I shaped profile. The extension rod can be attached to the folding saw in a snap-fitting manner for use. A retracted folding saw can be snapped side-by-side to a retracted to extension rod for storage.

Abstract: The present invention is a mobile structure that is stowable and releasably securable to a wall or other rigid body to maximize floor space. The mobile structure preferably comprises a frame defining upper and lower ends, a work surface or pair of cabinets located on the frame and movable between deployed and stowed positions, and a plurality of legs located at the lower end of the frame. Each leg preferably terminates at a wheel or caster to enable the rolling transport of the mobile structure across a floor or other surface. To facilitate the stowable, compact capabilities of the mobile structure, at least one leg of the plurality is movable between deployed and stowed positions. An interlock assembly is also preferably located on the frame and operable to releasably secure the structure to a rigid body in a predetermined location.

Abstract: Metal residue on a semiconductor surface resulting from metal chemical mechanical polishing (“CMP”) process are eradicated using a dry clean process. The dry cleaning uniformly removes or substantially eliminates metal residue from the surface of the semiconductor. An unintended metal short that may be present due to the residue may thereby be eliminated by adjusting the dry cleaning process based on a type of dry cleaning material, and type and a thickness of the residue.

Abstract: The present invention provides an apparatus, kit and method for dispensing lids one at a time in a sanitary and effective manner. A stack of lids is placed inside a tube and substantially held in the tube by a cover piece. Preferably the cover piece is concave in shape and is opposed by a concave platform that biases the stack of lids towards said cover piece. The bottommost lid of the stack is available for dispensing while the next lid in the stack is restrained in place, preferably by elements associated with the cover piece.

Abstract: An electric meter comprises an electronics housing and a meter base. The electronics housing defines a front panel and includes a first plurality of option board guides. A main meter board is disposed substantially parallel to the front panel. The meter base defines a rear panel of the electric meter. The meter base includes a plurality of housing guides for receiving the electronics housing and a second plurality of option board guides disposed substantially perpendicularly to the rear panel. The second plurality of option board guides are adapted to receive an option board and to position the option board substantially perpendicularly to the main meter board of the electronics housing during assembly of the electronics housing to the meter base. The housing guides in combination with the first and second pluralities of option board guides enable blind assembly of the electronics housing to the meter base.

Abstract: An electric meter comprises an electronics housing and a meter base. The electronics housing defines a front panel and includes a first plurality of option board guides. A main meter board is disposed substantially parallel to the front panel. The meter base defines a rear panel of the electric meter. The meter base includes a plurality of housing guides for receiving the electronics housing and a second plurality of option board guides disposed substantially perpendicularly to the rear panel. The second plurality of option board guides are adapted to receive an option board and to position the option board substantially perpendicularly to the main meter board of the electronics housing during assembly of the electronics housing to the meter base. The housing guides in combination with the first and second pluralities of option board guides enable blind assembly of the electronics housing to the meter base.

Abstract: Metal residue on a semiconductor surface resulting from metal chemical mechanical polishing (“CMP”) process are eradicated using a dry clean process. The dry cleaning uniformly removes or substantially eliminates metal residue from the surface of the semiconductor. An unintended metal short that may be present due to the residue may thereby be eliminated by adjusting the dry cleaning process based on a type of dry cleaning material, and type and a thickness of the residue.

Abstract: Metal residue on a semiconductor surface resulting from metal chemical mechanical polishing (“CMP”) process are eradicated using a dry clean process. The dry cleaning uniformly removes or substantially eliminates metal residue from the surface of the semiconductor. An unintended metal short that may be present due to the residue may thereby be eliminated by adjusting the dry cleaning process based on a type of dry cleaning material, and type and a thickness of the residue.

Abstract: The invention relates to an improvement in a process for delivering a fabric refreshening active to a fabric. This improvement includes delivering the active to the fabric in a conventional clothes dryer such that the heat and tumbling action provided by the dryer delivers the active to the fabric while damp to thus provide refreshing properties to the fabric. The invention also relates to a product for delivering the active as noted. The active is generally applied to the fabric at a temperature in the range of 125 to 145° F., and comprises hydrogen peroxide. The refreshening active may include a fragrancing agent so that the fabric is fragranced as the refreshening agent is applied. Preferably, the refreshening active is initially placed in a container that is placed in the dryer, wherein the container does not release the agent until a desired temperature is reached.

Abstract: An edge protection process for semiconductor device fabrication includes forming a protective layer on the circumferential edge region of a semiconductor substrate. The semiconductor substrate is placed in a plasma atmosphere and trench structures, such as deep trenches and shallow trench isolation structures are etched in the substrate. The protective layer substantially prevents the etching of the circumferential edge region, such that the formation of black silicon is substantially minimized during the etching process.

Abstract: Preferred embodiments of housings for an automatic meter reading device permit the automatic meter reading device to be mounted on a meter such as a water meter, or on a wall remote from the meter. A removable portion of the housing can be separated from a body of the housing when the housing is used to mount the automatic meter reading device on the meter.

Abstract: A method for manufacturing a trench capacitor with a reduced resistance in a buried strap window for use in a memory circuit such as a dynamic random access memory circuit may be realized by reducing the number of polysilicon layers that are deposited. The method includes the deposition of a collar material followed by a dry etch of the collar material. The collar material is etched away from the top region leaving a layer of collar material on the wall of the trench between the surface of the first polysilicon layer filling the bottom of the trench and the upper region where the collar material was removed. The second polysilicon layer may be deposited after the collar material has been etched for making contact to other devices.

Abstract: In a semiconductor manufacturing process for a dynamic random access memory, a buried insulator layer such as a buried SIMOX layer between trench capacitors isolates the capacitor from the access transistor, limiting leakage, improving device performance and simplifying manufacturing.

Abstract: An edge protection process for semiconductor device fabrication includes forming a protective layer on the circumferential edge region of a semiconductor substrate. The semiconductor substrate is placed in a plasma atmosphere and trench structures, such as deep trenches and shallow trench isolation structures are etched in the substrate. The protective layer substantially prevents the etching of the circumferential edge region, such that the formation of black silicon is substantially minimized during the etching process.

Abstract: A game includes the opportunity for a bonus award. As part of the play of a game, such as a game of video poker, one of the possible winning outcomes is selected and designated a bonus winning outcome. If the player receives that outcome as a result of game play, the player is paid a bonus which is larger than the normal payout for that outcome. In one embodiment, at least a portion of the bonus is funded from a progressive pool. Various embodiments of the invention comprise methods of determining a bonus in a game environment where multiple denomination bets may be placed and where a bonus is awarded for outcomes having different probabilities of occurring.

Abstract: Metal residue on a semiconductor surface resulting from metal chemical mechanical polishing (“CMP”) process are eradicated using a dry clean process. The dry cleaning uniformly removes or substantially eliminates metal residue from the surface of the semiconductor. An unintended metal short that may be present due to the residue may thereby be eliminated by adjusting the dry cleaning process based on a type of dry cleaning material, and type and a thickness of the residue.

Abstract: The present invention relates to eglin c variants which inhibit proteases, and in particular to eglin c mutants at adventitious contact sites. The present invention also relates to eglin c variants which comprise mutations in both adventitious contact sites and at reactive loop sites. The present invention further relates to methods of preparing the eglin c variants, and methods of using the eglin c variants for treatment of diseases including acute bacterial, viral, and fungal infections.

Abstract: A sustained release composite is made from a three-dimensional piece of calcium silicate having a xontolite structure and in which are fibers of textile glass and borosilicate glass, and an active agent. The active agent can be a fire starting material, a fragrance, or a masking fragrance.