Abstract: An electronic device including electromechanical components, a cooling unit configured for heat removal for the electromechanical components, and a controller. The controller is configured to determine a system state of each of the electromechanical components based on temperature data for each of the electromechanical components and a temperature band corresponding to each of the electromechanical components, wherein the temperature data for each of the electromechanical components is sampled at a sample rate corresponding to each of the electromechanical components, determine a system state of the electronic device based on the system states of the electromechanical components, and control an operation of the cooling unit based on the system state of the electronic device.

Abstract: A storage device includes a data drive and an enclosure. Shock absorber mounting holes on the enclosure can receive shock absorbers to connect to the data drive. In this way the data drive can be suspended from the enclosure. The enclosure can also have one or more protrusion. The one or more protrusion can be located such that when the data drive is placed thereon and each shock absorber is placed within a respective shock absorber mounting hole, each shock absorber is aligned with a mounting hole on the data drive. This can allow securement of the respective shock absorber to the respective data drive mounting hole to suspend the data drive. When the data drive is assembled within the enclosure, the one or more protrusion is sized such that an impact on the one or more protrusion by the data drive will destroy the one or more protrusion.

Abstract: A computer system including a heat sink including a peripheral portion and a middle portion, a circuit board, a first controller configured to be secured to the circuit board, one or more attachment devices configured to secure the heat sink to the circuit board at the peripheral portion of the heat sink, and a standoff component. The standoff component includes a first threaded section configured to secure the standoff component to the circuit board, and a second threaded section configured to secure the standoff component to the heat sink at the middle portion of the heat sink. The one or more attachment devices and the standoff component are configured to secure the heat sink to the circuit board and allow the heat sink to have thermal contact with the first controller.

Abstract: Systems and manufacturing methods are disclosed herein that can beneficially reduce manufacturing cost while providing size efficient enclosures to house hard drives or other types of storage drives. An enclosure system can be used for separately housing one of two storage devices having different thicknesses. A first portion can be interchangeable with both storage devices. Second and third portions can each have a thickness to size efficiently accommodate the thickness of one storage device. Each of the second and third portions has an engagement surface to engage the first portion forming an enclosure. Either the first portion, or both second and third portions can comprise an opening or a shock mounting element. When the opening or the shock mounting element are on both the second and third portions, the opening or the shock mounting element is collectively identically spaced from the engagement surface on both the second and third portions.

Abstract: A method may comprise generating a first electronic model of a workpiece to be manufactured using an injection-molding process. The first electronic model may then be analyzed and the workpiece in the first electronic model may then be selectively distorted according to the analysis. A second electronic model of the distorted workpiece may then be generated. The workpiece may then be injection-molded within a mold generated using the second electronic model. Thereafter, the workpiece may be cooled such that the injection-molded workpiece gradually assumes the shape or substantially the shape of the workpiece in the first electronic model.

Abstract: A computer system including a heat sink including a peripheral portion and a middle portion, a circuit board, a first controller configured to be secured to the circuit board, one or more attachment devices configured to secure the heat sink to the circuit board at the peripheral portion of the heat sink, and a standoff component. The standoff component includes a first threaded section configured to secure the standoff component to the circuit board, and a second threaded section configured to secure the standoff component to the heat sink at the middle portion of the heat sink. The one or more attachment devices and the standoff component are configured to secure the heat sink to the circuit board and allow the heat sink to have thermal contact with the first controller.

Abstract: A computer system including a heat sink including a peripheral portion and a middle portion, a circuit board, a first controller configured to be secured to the circuit board, one or more attachment devices configured to secure the heat sink to the circuit board at the peripheral portion of the heat sink, and a standoff component. The standoff component includes a first threaded section configured to secure the standoff component to the circuit board, and a second threaded section configured to secure the standoff component to the heat sink at the middle portion of the heat sink. The one or more attachment devices and the standoff component are configured to secure the heat sink to the circuit board and allow the heat sink to have thermal contact with the first controller.

Abstract: A deflection or snap fit type latch system can resist separation in at least three axes. The snap fit type latch system can include a first member and a second member that when engaged are configured to form a snap fit connection, at least one of the members comprising a deflecting arm. A tee feature on the first member can include a stem and a head. A slot on the second member can slidingly receive the stem of the tee feature as the first and second members engage such that the second member is sandwiched between the first member and the head of the tee feature. The snap fit connection can resist separation in a first axis and the combined tee feature and slot resist separation in two additional axes. The snap fit type latch system can be part of an enclosure, such as a storage device.

Abstract: A method may comprise generating a first electronic model of a workpiece to be manufactured using an injection-molding process. The first electronic model may then be analyzed and the workpiece in the first electronic model may then be selectively distorted according to the analysis. A second electronic model of the distorted workpiece may then be generated. The workpiece may then be injection-molded within a mold generated using the second electronic model. Thereafter, the workpiece may be cooled such that the injection-molded workpiece gradually assumes the shape or substantially the shape of the workpiece in the first electronic model.

Abstract: Systems and manufacturing methods are disclosed herein that can beneficially reduce manufacturing cost while providing size efficient enclosures to house hard drives or other types of storage drives. An enclosure system can be used for separately housing one of two storage devices having different thicknesses. A first portion can be interchangeable with both storage devices. Second and third portions can each have a thickness to size efficiently accommodate the thickness of one storage device. Each of the second and third portions has an engagement surface to engage the first portion forming an enclosure. Either the first portion, or both second and third portions can comprise an opening or a shock mounting element. When the opening or the shock mounting element are on both the second and third portions, the opening or the shock mounting element is collectively identically spaced from the engagement surface on both the second and third portions.

Abstract: A deflection or snap fit type latch system can resist separation in at least three axes. The snap fit type latch system can include a first member and a second member that when engaged are configured to form a snap fit connection, at least one of the members comprising a deflecting arm. A tee feature on the first member can include a stem and a head. A slot on the second member can slidingly receive the stem of the tee feature as the first and second members engage such that the second member is sandwiched between the first member and the head of the tee feature. The snap fit connection can resist separation in a first axis and the combined tee feature and slot resist separation in two additional axes. The snap fit type latch system can be part of an enclosure, such as a storage device.

Abstract: A computer system including a heat sink including a peripheral portion and a middle portion, a circuit board, a first controller configured to be secured to the circuit board, one or more attachment devices configured to secure the heat sink to the circuit board at the peripheral portion of the heat sink, and a standoff component. The standoff component includes a first threaded section configured to secure the standoff component to the circuit board, and a second threaded section configured to secure the standoff component to the heat sink at the middle portion of the heat sink. The one or more attachment devices and the standoff component are configured to secure the heat sink to the circuit board and allow the heat sink to have thermal contact with the first controller.

Abstract: A robotic materials handling system for storing and handling box-like articles such as videocassettes includes a storage area containing a plurality of columns of storage bins, a vertical support shaft located adjacent the storage area and a manipulator assembly carried on the shaft. The manipulator assembly includes a plurality of gripper mechanisms which may be positioned adjacent desired storage bins. The system includes computer control circuitry for controlling the operation of the manipulator assembly and gripper mechanism to transport articles between desired locations.

Abstract: A cable retractor assembly which utilizes a rotatable spool assembly for taking up slack in a cable connected between a mobile member and a stationary base member. The present invention makes use of a cable assembly which has first and second portions which are wound onto or unwound from the spool assembly at the same time to maintain a continuous cable connection between the members while avoiding loose cable in the open. A retraction assembly provide the retraction force to rotate the spool assembly to wind the slack cable.

Abstract: A tape cassette handling and sequencing system includes a large storage library having a plurality of storage bins and a cassette loading section for receiving cassettes to be stored in the storage bins. Tape transports are provided for playing cassettes stored in the library. A manipulator assembly moves cassettes between the loading section, storage bins and tape transports. The design facilitates the automatic sequencing of a large number of cassettes thus freeing an operator for other tasks.