Patents by Inventor Robert G. Nelb, II

Robert G. Nelb, II has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6372831
    Abstract: The present invention is an flame resistant resin composition comprising: A) from about 50 to about 90 parts by weight of a rubber modified polymer derived from a vinyl aromatic monomer, B) from about 1 to about 8 parts by weight of an impact modifier, C) from about 0.5 to about 5 parts by weight of a polyolefin having a density of greater than 0.940 g/cm3 and a melt flow rate of less than 4 as measured according to ASTM D1238 at 190° C. using a 2.16 kg weight, D) a sufficient amount of a halogen-containing flame retardant to provide the composition with 7 to 14 parts by weight halogen, and E) from about 2 to about 6 parts by weight of an inorganic flame retardant synergist.
    Type: Grant
    Filed: June 6, 1996
    Date of Patent: April 16, 2002
    Assignee: The Dow Chemical Company
    Inventors: Kevin D. Sikkema, Dawn M. Orbeck, Robert G. Nelb, II
  • Patent number: 5183864
    Abstract: Disclosed is a process for the preparation of a thermoplastic polymer blend comprising a first preformed thermoplastic polymer such as a polyester, polycarbonate, ABS graft polymer and the like and a second thermoplastic polyamide or polyamideimide. The second polymer is prepared from a diisocyanate and polycarboxylic compund selected from a dicarboxylic acid, tricarboxylic acid or anhydride thereof, or mixtures of these components by reactively processing the monomer components in the presence of the first polymer.
    Type: Grant
    Filed: July 27, 1990
    Date of Patent: February 2, 1993
    Assignee: The Dow Chemical Company
    Inventors: Robert G. Nelb, II, Kemal Onder
  • Patent number: 4738990
    Abstract: Disclosed is a process for the preparation of a polyamideimide semi-flexible foam wherein a foam precursor is first prepared by heating together a mixture of an organic polyisocyanate, an aromatic polycarboxylic compound and a catalyst comprising a cyclic phosphorus compound, optionally in the presence of a surfactant until at least about 45 percent of the theoretical carbon dioxide has been evolved. The solidified precursor is comminuted and then heated to complete the reaction producing polyamideimide foam.
    Type: Grant
    Filed: August 31, 1987
    Date of Patent: April 19, 1988
    Assignee: The Dow Chemical Company
    Inventors: Robert G. Nelb, II, Keith G. Saunders
  • Patent number: 4672094
    Abstract: A process is described for increasing the molecular weights of thermoplastic polyamides and polyesteramides by fluxing and homogenizing the subject polymers which have been prepared by the reaction of an organic diisocyanate and a dicarboxylic acid with an effective amount of an organic diisocyanate reagent at a temperature of at least about 150.degree. C.
    Type: Grant
    Filed: January 21, 1986
    Date of Patent: June 9, 1987
    Assignee: The Dow Chemical Company
    Inventors: Robert G. Nelb, II, Kemal Onder, Karl W. Rausch, John A. Vanderlip
  • Patent number: 4579914
    Abstract: Disclosed are novel blends comprising segmented polyesteramides with minor amounts of aliphatic polyamides.The blends are characterized by good physical properties including improved elongation and solvent resistance over the base polyesteramides. The polymers so obtained find utility in the making of seals, gaskets, bushings, and the like.
    Type: Grant
    Filed: March 18, 1985
    Date of Patent: April 1, 1986
    Assignee: The Dow Chemical Company
    Inventors: Robert G. Nelb, II, Kemal Onder, Keith G. Saunders
  • Patent number: 4420603
    Abstract: A continuous, solvent-free process is described for the preparation of thermoplastic polyamides and polyester-amides by the reaction of the appropriate organic diisocyanate and dicarboxylic acid or difunctional carboxylic acid-terminated polyester.
    Type: Grant
    Filed: September 27, 1982
    Date of Patent: December 13, 1983
    Assignee: The Upjohn Company
    Inventors: Robert G. Nelb, II, Richard W. Oertel, III
  • Patent number: 4420602
    Abstract: A melt-polymerization process is described for the preparation of thermoplastic polyamides and polyesteramides by reaction of the appropriate organic diisocyanate and dicarboxylic acid or difunctional carboxylic acid-terminated polyol. The process, which can be conducted in a batch or continuous manner, comprises the steps of admixing the reactants (preferably in the liquid state), heating the mixed reactants at reaction temperature in a manner such that eliminated carbon dioxide can be vented freely, allowing the reaction to proceed until approximately 25-95 percent (preferably at least 50 percent) of the theoretical carbon dioxide has been eliminated and reducing the resulting intermediate to a powder before completing the reaction by melting, homogenizing, and devolatilizing.
    Type: Grant
    Filed: September 27, 1982
    Date of Patent: December 13, 1983
    Assignee: The Upjohn Company
    Inventors: Henry W. Bonk, Robert G. Nelb, II, Richard W. Oertel, III
  • Patent number: 4415693
    Abstract: Disclosed are novel compositions comprising blends of at least about 75 percent by weight of a polyesteramide and the balance of the blends comprising a urethane containing ingredient. Optionally, an antioxidant component is present in the blends.The blends display an unexpected level of stability in regard to their tensile properties when exposed to elevated temperatures.The blends find particular utility in the area of hoses, gaskets, seals, etc., used in handling fluids at elevated temperatures.
    Type: Grant
    Filed: August 9, 1982
    Date of Patent: November 15, 1983
    Assignee: The Upjohn Company
    Inventors: Augustin T. Chen, Robert G. Nelb, II, Kemal Onder
  • Patent number: 4410684
    Abstract: Novel copolyamides having the recurring unit ##STR1## are disclosed wherein Ar in the major proportion of the recurring units is m-phenylene and in the corresponding minor proportion (but more than 10 percent) of the recurring units Ar is a phenylene ether having the formula ##STR2## The copolyamides have excellent high temperature resistance but, unlike those polymers in which Ar in the above recurring unit is exclusively m-phenylene, they can be injection molded.
    Type: Grant
    Filed: February 7, 1983
    Date of Patent: October 18, 1983
    Assignee: The Upjohn Company
    Inventors: Robert G. Nelb, II, Kemal Onder
  • Patent number: 4328331
    Abstract: Segmented thermoplastic polyester-amides are described which are prepared by reacting a polymeric diol (molecular weight in the range of 400 to 4000) with a carboxylic acid terminated prepolymer obtained by reacting an aliphatic ether diamine, optionally in admixture with a minor proportion (based on equivalents) of an alkylene diamine, with an excess of dicarboxylic acid (aromatic or aliphatic). The polyester-amides, which can be prepared preferably by the melt condensation method, have excellent physical properties and resistance to degradation by heat.
    Type: Grant
    Filed: April 20, 1981
    Date of Patent: May 4, 1982
    Assignee: The Upjohn Company
    Inventors: Augustin T. Chen, Robert G. Nelb, II, Kemal B. Onder
  • Patent number: 4129715
    Abstract: Substantially linear, segmented polyester amides are described which contain aromatic residues in the "hard" segments but which still possess sufficiently low melt properties to be injection moldable. The polyester amides are obtained by reacting a carboxylic acid-terminated prepolymer (derived by reacting an excess of a dicarboxylic acid with a polymeric diol of molecular weight 400 to 4000) with a stoichiometric amount of methylenebis(phenyl isocyanate) or toluene diisocyanate or mixtures of these isocyanates and, optionally, a dicarboxylic acid.
    Type: Grant
    Filed: January 16, 1978
    Date of Patent: December 12, 1978
    Assignee: The Upjohn Company
    Inventors: Augustin T. Chen, William J. Farrissey, Jr., Robert G. Nelb, II