Abstract: In one embodiment, a power semiconductor module includes a main substrate, semiconductor chips mounted on the main substrate, and an auxiliary substrate also mounted on the main substrate. The power semiconductor module is capable of handling a current of 10 A or more. The auxiliary substrate is a printed circuit board having at least one carrier layer that is based on an organic material. The auxiliary substrate provides a common contact platform for at least some of the first semiconductor chips. The auxiliary substrate is attached to the main substrate by a joining layer located at a bottom side of the at least one auxiliary substrate facing the main substrate. The joining layer is a continuous organic adhesive layer of an adhesive foil or a double-faced adhesive tape.

Abstract: In one embodiment, a pre-product is configured for an electronic device intended to be loaded with a maximum current of at least 10 A, and comprises: an electronic component, a plurality of power terminals for external electrical contacting the electronic device, and a slide rail at an end of the at least one assigned power terminal remote from the electronic component. The power terminals are electrically connected to the electronic component and extend in a direction away from the electronic component. The slide rail is integrated in a metallic first leadframe together with at least one of the power terminals. A weight of the pre-product is at least 0.1 kg.

Abstract: In one embodiment, a pre-product is configured for an electronic device intended to be loaded with a maximum current of at least 10 A, and comprises: an electronic component, a plurality of power terminals for external electrical contacting the electronic device, and a slide rail at an end of the at least one assigned power terminal remote from the electronic component. The power terminals are electrically connected to the electronic component and extend in a direction away from the electronic component. The slide rail is integrated in a metallic first leadframe together with at least one of the power terminals. A weight of the pre-product is at least 0.1 kg.

Abstract: In one embodiment, a power semiconductor module includes a main substrate, semiconductor chips mounted on the main substrate, and an auxiliary substrate also mounted on the main substrate. The power semiconductor module is capable of handling a current of 10 A or more. The auxiliary substrate is a printed circuit board having at least one carrier layer that is based on an organic material. The auxiliary substrate provides a common contact platform for at least some of the first semiconductor chips. The auxiliary substrate is attached to the main substrate by a joining layer located at a bottom side of the at least one auxiliary substrate facing the main substrate. The joining layer is a continuous organic adhesive layer of an adhesive foil or a double-faced adhesive tape.