Abstract: An embedded imaging system in one embodiment includes an encoding module, an imaging module, and a cable. The encoding module is disposed proximate to a proximal end of the system, and is configured to encode frame synchronizing information into timing information comprising a reference clock. The imaging module is disposed proximate the distal end, and includes an image capture device configured to obtain imaging information and a decoding module. The decoding control module is configured to obtain the timing information, to decode the timing information to obtain recovered frame synchronizing information, and to control the image capture device using the recovered frame synchronizing information. The cable is interposed between the proximal end and the distal end, and is configured for passage therethrough of the timing information and the imaging information.

Abstract: A method for forming a fault tolerant detector assembly is presented. The method includes providing a sensor array having a plurality of sensor elements, providing an electronics layer having a plurality of electronics cells, where the plurality of electronics cells corresponds to the plurality of sensor elements in the sensor array, introducing a status indicator element in each of the plurality of the electronics cells, where the status indicator element is configured to store a status of a corresponding sensor element, scanning the plurality of sensor elements in the sensor array to identify the status of the plurality of sensor elements in the sensor array, generating a functionality map based on the identified status of the plurality of sensor elements in the sensor array, and selectively programming the status indicator elements based on the functionality map to form a fault tolerant detector assembly.

Abstract: A transceiver for use in an ultrasound system is provided. The transceiver is configured to operate in a transmit mode and a receive mode. The transceiver comprises a high voltage switch, a low voltage switch and a resistor coupled to the high voltage switch and the low voltage switch.

Abstract: An embedded imaging system in one embodiment includes an encoding module, an imaging module, and a cable. The encoding module is disposed proximate to a proximal end of the system, and is configured to encode frame synchronizing information into timing information comprising a reference clock. The imaging module is disposed proximate the distal end, and includes an image capture device configured to obtain imaging information and a decoding module. The decoding control module is configured to obtain the timing information, to decode the timing information to obtain recovered frame synchronizing information, and to control the image capture device using the recovered frame synchronizing information. The cable is interposed between the proximal end and the distal end, and is configured for passage therethrough of the timing information and the imaging information.

Abstract: A method for forming a fault tolerant detector assembly is presented. The method includes providing a sensor array having a plurality of sensor elements, providing an electronics layer having a plurality of electronics cells, where the plurality of electronics cells corresponds to the plurality of sensor elements in the sensor array, introducing a status indicator element in each of the plurality of the electronics cells, where the status indicator element is configured to store a status of a corresponding sensor element, scanning the plurality of sensor elements in the sensor array to identify the status of the plurality of sensor elements in the sensor array, generating a functionality map based on the identified status of the plurality of sensor elements in the sensor array, and selectively programming the status indicator elements based on the functionality map to form a fault tolerant detector assembly.

Abstract: An ultrasound acoustic assembly includes a number of ultrasound acoustic arrays, each array comprising an acoustic stack comprising a piezoelectric layer assembled with at least one acoustic impedance dematching layer and with a support layer. The acoustic stack defines a number of dicing kerfs and a number of acoustic elements, such that the dicing kerfs are formed between neighboring ones of the acoustic elements. The dicing kerfs extend through the piezoelectric layer and through the acoustic impedance dematching layer(s) but extend only partially through the support layer. The ultrasound acoustic assembly further includes a number of application specific integrated circuit (ASIC) die. Each ultrasound acoustic array is coupled to a respective ASIC die to form a respective acoustic-electric transducer module. Methods of manufacture are also provided.

Abstract: A method for forming a tileable detector array is presented.

Abstract: In one embodiment, a transducer apparatus comprises an elastomeric substrate and another elastomeric substrate. A plurality of transducer modules are mounted on the elastomeric substrate. A plurality of additional transducer modules are mounted on the other elastomeric substrate. Each transducer module of the plurality of transducer modules and the plurality of additional transducer modules comprises a transducer array having multiple transducer elements and an electronic circuitry coupled to the transducer array. The plurality of transducer modules and the plurality of additional transducer modules are mounted relative to each other whereby the plurality of additional transducer modules substantially cover any dead zones of the plurality of transducer modules.

Abstract: An ultrasound acoustic assembly includes a number of ultrasound acoustic arrays, each array comprising an acoustic stack comprising a piezoelectric layer assembled with at least one acoustic impedance dematching layer and with a support layer. The acoustic stack defines a number of dicing kerfs and a number of acoustic elements, such that the dicing kerfs are formed between neighboring ones of the acoustic elements. The dicing kerfs extend through the piezoelectric layer and through the acoustic impedance dematching layer(s) but extend only partially through the support layer. The ultrasound acoustic assembly further includes a number of application specific integrated circuit (ASIC) die. Each ultrasound acoustic array is coupled to a respective ASIC die to form a respective acoustic-electric transducer module. Methods of manufacture are also provided.

Abstract: In one embodiment, a transducer apparatus comprises an elastomeric substrate and another elastomeric substrate. A plurality of transducer modules are mounted on the elastomeric substrate. A plurality of additional transducer modules are mounted on the other elastomeric substrate. Each transducer module of the plurality of transducer modules and the plurality of additional transducer modules comprises a transducer array having multiple transducer elements and an electronic circuitry coupled to the transducer array. The plurality of transducer modules and the plurality of additional transducer modules are mounted relative to each other whereby the plurality of additional transducer modules substantially cover any dead zones of the plurality of transducer modules.

Abstract: A modular and tileable sensor array with routing in the interposer carrying the signals from the sensors to the integrated circuits. In one embodiment a large area modular sensor array assembly includes one or more tileable modules coupled together. The tileable modules have a plurality of transducer cells forming a sensor, an interposer coupled on a first side to the plurality of transducer cells by a plurality, one or more integrated circuits coupled to a second side of the interposer, wherein the interposer is configured to form the connection of at least some of the transducer cells to the integrated circuits, and one or more input/output connectors coupled to the interposer and providing an external interface.

Abstract: A method for forming a tileable detector array is presented.

Abstract: According to embodiments of the present technique, a system and a method for addressing transducers in a two-dimensional transducer array is disclosed. According to one aspect of the present technique, the transducers are arranged in rows and columns, and the columns are coupled to a shared transmit and receive circuitry while the rows are coupled to a row selection circuitry. In another embodiment, each transducer is coupled to a separate, dedicated transmit circuitry and the columns are coupled to a shared receive circuitry.

Abstract: Predictive Analog-to-Digital Converter system in one embodiment includes a sampling section producing a sampled analog input signal with a first summer section combining the sampled analog input signal and an analog prediction signal to produce an analog prediction error signal. There is at least one error analog-to-digital convertor digitizing the analog prediction error signal, wherein a digital error signal output from the error analog-to-digital convertor is one of a full bitwidth error signal during an over-range condition else a lower bitwidth error signal. A second summer is coupled to the digital error signal output and a digital prediction signal, and generates a full bitwidth digital output signal. A feedback section is coupled to the digital output signal and providing the digital prediction signal and the analog prediction signal.

Abstract: Predictive Analog-to-Digital Converter system in one embodiment includes a sampling section producing a sampled analog input signal with a first summer section combining the sampled analog input signal and an analog prediction signal to produce an analog prediction error signal. There is at least one error analog-to-digital convertor digitizing the analog prediction error signal, wherein a digital error signal output from the error analog-to-digital convertor is one of a full bitwidth error signal during an over-range condition else a lower bitwidth error signal. A second summer is coupled to the digital error signal output and a digital prediction signal, and generates a full bitwidth digital output signal. A feedback section is coupled to the digital output signal and providing the digital prediction signal and the analog prediction signal.

Abstract: An ultrasound imaging system (100). An exemplary system (100) includes a plurality of transducer elements (136) formed in subarrays (140) and a plurality of subarray circuit units (160?), with each circuit unit (160?) connected to a subarray (140) of the transducer elements (136). The circuitry in each unit (160?) comprises a plurality of integrated circuits (330, 340, 350), with at least a first (340) of the integrated circuits formed over a second (330) of the integrated circuits in a stacked configuration. In an example illustration the first integrated circuit (340) includes a first plurality of first bond pads (345) along a surface (342) thereof and the second integrated circuit (330) includes a second plurality of second bond pads (335) along a surface (331) thereof, with bond wires (344) extending between pairs of first and second bond pads to provide input/output signal connections therebetween.

Abstract: A modular and tileable sensor array with routing in the interposer carrying the signals from the sensors to the integrated circuits. In one embodiment a large area modular sensor array assembly includes one or more tileable modules coupled together. The tileable modules have a plurality of transducer cells forming a sensor, an interposer coupled on a first side to the plurality of transducer cells by a plurality, one or more integrated circuits coupled to a second side of the interposer, wherein the interposer is configured to form the connection of at least some of the transducer cells to the integrated circuits, and one or more input/output connectors coupled to the interposer and providing an external interface.

Abstract: A method for dynamically reconfiguring elements in an ultrasound transducer array is provided. The method includes defining two or more groups of the elements in the array, wherein each element individually comprises a first switch, and a second switch; providing boundary definitions information to the elements in the array to define boundaries for the two or more groups; and locally determining switch configuration state within the array for the first and second switch of one or more elements based on the boundary definitions. Further, a switch matrix configured to locally determine switch settings is provided. Furthermore, a system comprising an array of ultrasonic transducer subelements is provided.

Abstract: An ultrasonic monitoring system is formed with a probe unit. In one example an array of transducer cells is arranged in rows and columns formed along a first plane with a first pitch along a first direction. An integrated circuit including an array of circuit cells is formed along a second plane parallel to the first plane. The circuit cells are spaced apart along the first direction at a second pitch smaller than the first pitch. A first of the transducer cells is vertically aligned, along a direction normal to one of the planes, with a first of the circuit cells and having a connection thereto. A second of the transducer cells is offset from vertical alignment with respect to the position of a second circuit cell so as to not overlie the second circuit cell.

Abstract: An ultrasound transducer probe is disclosed comprising: an array of ultrasound transducer elements, each ultrasound transducer element associated with a corresponding unit transducer cell for providing transmit and receive functions, each unit transducer cell including a cell transmit/receive switch connected to a low voltage switch matrix via a low voltage transmit path; and a plurality of microelectronic cross-point switches for switching an externally generated analog transmit signal to one or more of the low voltage transmit paths.